Micromechanical component and method for fabricating a micromechanical component
First Claim
1. A method for fabricating a micromechanical component, comprising the following steps:
- producing a first layer composite having a first substrate and a first insulation layer, which covers at least one part of a first surface of the first substrate, wherein first depressions are produced in the first surface of the first substrate,producing a second layer composite having a second substrate and a second insulation layer, which covers at least one part of a surface of the second substrate,after forming the first depressions, applying an at least partly conductive structure layer to the first layer composite, wherein the structure layer is formed on the insulation layer and over portions of the first substrate, in which the first depressions are produced,applying the second composite to the structure layer in such a way that the second insulation layer adjoins the structure layer,wherein the first and second layer composites and also the structure layer are configured in such a way that at least one part of the structure layer which comprises an active area comprising an active structure of the component is sealed by the first and second layer composites,after applying the second composite to the structure layer, forming contact holes within the first substrate for making contact with conductive regions of the structure layer,wherein lateral positions of the contact holes at least partly overlap with lateral positions of the first depressions, andwherein the lateral positions of the first depressions at least partly overlap with lateral positions of the conductive regions of the structure layer to be contacted through the contact holes.
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Abstract
A method for fabricating a microelectromechanical or microoptoelectromechanical component. The method includes producing first and second layer composites. The first has a first substrate and a first insulation layer, which covers at least one part of the surface of the first substrate, while the second has a second substrate and a second insulation layer, which covers at least one part of the surface of the second substrate. An at least partly conductive structure layer is applied to the first insulation layers and the second composite is applied to the structure layer so that the second insulation layer adjoins the structure layer. The first and second layer composites and the structure layer are configured so that at least one part of the structure layer that comprises the active area of the microelectromechanical or microoptoelectromechanical component is hermetically tightly sealed by the first and second layer composites. Contact holes are formed for making contact with conductive regions of the structure layer within the first and/or second substrate.
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Citations
18 Claims
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1. A method for fabricating a micromechanical component, comprising the following steps:
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producing a first layer composite having a first substrate and a first insulation layer, which covers at least one part of a first surface of the first substrate, wherein first depressions are produced in the first surface of the first substrate, producing a second layer composite having a second substrate and a second insulation layer, which covers at least one part of a surface of the second substrate, after forming the first depressions, applying an at least partly conductive structure layer to the first layer composite, wherein the structure layer is formed on the insulation layer and over portions of the first substrate, in which the first depressions are produced, applying the second composite to the structure layer in such a way that the second insulation layer adjoins the structure layer, wherein the first and second layer composites and also the structure layer are configured in such a way that at least one part of the structure layer which comprises an active area comprising an active structure of the component is sealed by the first and second layer composites, after applying the second composite to the structure layer, forming contact holes within the first substrate for making contact with conductive regions of the structure layer, wherein lateral positions of the contact holes at least partly overlap with lateral positions of the first depressions, and wherein the lateral positions of the first depressions at least partly overlap with lateral positions of the conductive regions of the structure layer to be contacted through the contact holes. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 18)
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14. A method for fabricating a micromechanical component, comprising the following steps:
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producing first depressions in a first surface of a first nonconductive substrate, after producing the first depressions, applying an at least partly conductive structure layer to the first surface of the first nonconductive substrate, wherein the structure layer is formed over portions of the first substrate, in which the first depressions are produced, applying a second nonconductive substrate to the structure layer, wherein the first and second substrates and also the structure layer are configured in such a way that at least one part of the structure layer which comprises an active area of the component is sealed by the first and second substrates, after applying the second nonconductive substrate to the structure layer, forming contact holes within the first substrate for making contact with conductive regions of the structure layer, wherein lateral positions of the contact holes at least partly overlap with lateral positions of the first depressions, and wherein the lateral positions of the first depressions at least partially overlap with lateral positions of the conductive regions of the structure layer to be contacted through the contact holes. - View Dependent Claims (15, 16, 17)
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Specification