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Flexible substrate with electronic devices formed thereon

  • US 7,964,507 B2
  • Filed: 02/01/2010
  • Issued: 06/21/2011
  • Est. Priority Date: 07/31/2006
  • Status: Expired due to Fees
First Claim
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1. A method of manufacturing an electronic device comprising:

  • a) providing a substrate that comprises at least one plastic material;

    b) embedding a particulate material preferentially in at least one surface of the substrate;

    c) applying a planarization material that preferentially bonds to the particulate material to the surface of the substrate having the embedded particulate material, forming a planarization layer thereby; and

    d) forming a thin film electronic device on said surface with said particulate material.

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