Method making ink feed slot through substrate

• US 7,966,728 B2
• Filed: 03/31/2006
• Issued: 06/28/2011
• Est. Priority Date: 01/31/2002
• Status: Expired due to Fees

• Current Assignee: Hewlett-Packard Development Company, L.P. (HP Inc.)
• Original Assignee: Hewlett-Packard Development Company, L.P. (HP Inc.)
• Inventors: Buswell, Shen
• Primary Examiner(s): Banks; Derris H
• Assistant Examiner(s): NGUYEN, TAI V
• Application Number:
  US11/395,454
• Publication Number:
  US 20060162159A1
• Time in Patent Office: 1,915 Days
• Field of Search: 298/901, 296/11, 297/29, 347/62, 347/65, 347/54, 347/92, 347 84- 86, 347 68- 70, 216/27, 216/41, 216/47, 451 36- 38
• US Class Current: 29/890.1
• CPC Class Codes: B41J 2/1603 of the front shooter type
• CPC Class Codes: B41J 2/162 Manufacturing of the nozzle plates
• CPC Class Codes: B41J 2/1628 dry etching
• CPC Class Codes: B41J 2/1629 wet etching
• CPC Class Codes: B41J 2/1632 machining
• CPC Class Codes: B41J 2/1634 laser machining
• CPC Class Codes: Y10T 29/49083 Heater type
• CPC Class Codes: Y10T 29/49401 Fluid pattern dispersing device making, e.g., ink jet
• CPC Class Codes: Y10T 29/5313 Means to assemble electrical device

Abstract

The described embodiments relate to methods and systems of forming slots in a substrate. One exemplary embodiment forms a feature into a substrate having a first substrate surface and a second substrate surface, and moves a sand drill nozzle along the substrate to remove substrate material sufficient to form, in combination with said forming, a slot through the substrate.

Claims

1. A method comprising:

forming, using a first process applied to a first surface of a substrate, a slot through the substrate having the first substrate surface and a second substrate surface such that the slot has a tapered portion at each of its ends; and

,

removing, from the second substrate surface, at least part of the tapered portions of the slot using means for delivering abrasive particles to lengthen the slot and change its shape at the slot ends, wherein the forming and the removing configure the slot with a generally uniform minimum width measured orthogonally to a long axis of the slot.

2. The method of claim 1, wherein forming comprises forming the slot into the first substrate surface, and wherein removing comprises removing the tapered portions from the second substrate surface.

3. The method of claim 1, wherein forming comprises forming the slot into the first substrate surface and, wherein removing comprises removing the tapered portions from the first substrate surface.

4. The method of claim 1, wherein forming comprises one or more of laser machining, dry etching, wet etching, and mechanically abrading.

5. The method of claim 1, wherein forming and removing configure the slot with a generally uniform width at the second surface as measured generally parallel a short axis of the slot.

6. The method of claim 1, wherein forming and removing configure the slot at the second surface to have a greater width at the slot ends than at a mid-region.

7. The method of claim 1, wherein forming and removing configure the slot with a generally uniform width at the first surface as measured generally parallel a short axis of the slot.

8. The method of claim 1, wherein forming and removing configure the slot with a generally uniform width at the first surface as measured generally parallel a short axis of the slot, and wherein the width at the first surface is a minimum slot width.

9. The method of claim 1, wherein the first process does not use the means for delivering abrasive particles.

10. The method of claim 1, wherein forming and removing configure the slot at the second surface to have a gradually increasing width from a mid-region to the slot ends.

11. A method comprising:

forming, using a first process, a slot through a substrate having a first substrate surface and a second substrate surface such that the slot has a tapered portion at each of its ends; and

,

removing at least part of the tapered portion of the slot by moving a nozzle of a sand drill for delivering abrasive particles along a longitudinal axis of the substrate at a speed that is proportional to an elevational thickness of substrate material between the second substrate surface and a tapered elevational profile of the tapered portion to lengthen the slot and change its shape at the slot ends.

12. The method of claim 11, wherein the nozzle of the sand drill has a diameter that is approximately equal to the width of the slot formed using the first process.

13. A method comprising:

forming, using a circular cutting disk, a slot through a substrate having a first substrate surface and a second substrate surface such that the slot has a tapered portion at each of its ends; and

,

removing at least part of the tapered portions of the slot using means for delivering abrasive particles to lengthen the slot and change its shape at the slot ends.

14. The method of claim 13, wherein forming the slot using a circular disk comprises dragging the circular cutting disk along the substrate.

15. The method of claim 13, wherein forming the slot using a circular disk comprises simultaneously dragging the circular cutting disk along the substrate and changing the elevation of the circular cutting disk relative to the substrate.