Assembly comprising a functional device and a resonator and method of making same

• US 7,967,204 B2
• Filed: 10/08/2008
• Issued: 06/28/2011
• Est. Priority Date: 11/08/2004
• Status: Expired due to Fees

• Current Assignee: RUIZHANG TECHNOLOGY LIMITED COMPANY
• Original Assignee: Alien Technology Corporation
• Inventors: Craig, Gordon S. W., Carrender, Curt L., Smith, John Stephen, Hadley, Mark A.
• Primary Examiner(s): Lee; Michael G
• Assistant Examiner(s): Haupt; Kristy A
• Application Number:
  US12/248,020
• Publication Number:
  US 20090109002A1
• Time in Patent Office: 993 Days
• Field of Search: 235/451, 235/492, 340/572.1, 340/572.5, 340/572.7, 340/572.8
• US Class Current: 235/451
• CPC Class Codes: G06K 19/07718 the record carrier being manufactured in a continuous process, e.g. using endless rolls
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: G06K 19/07752 using an interposer
• CPC Class Codes: G06K 19/07756 the connection being non-galvanic, e.g. capacitive
• CPC Class Codes: H01L 2223/6677 for antenna, e.g. antenna included within housing of semiconductor device antennas per se H01Q
• CPC Class Codes: H01L 2224/04105 Bonding areas formed on an encapsulation of the semiconductor or solid-state body, e.g. bonding areas on chip-scale packages
• CPC Class Codes: H01L 2224/20 Structure, shape, material or disposition of high density interconnect preforms
• CPC Class Codes: H01L 2224/24227 the HDI interconnect not connecting to the same level of the item at which the semiconductor or solid-state body is mounted, e.g. the semiconductor or solid-state body being mounted in a cavity or on a protrusion of the item
• CPC Class Codes: H01L 2224/76155 Jetting means, e.g. ink jet
• CPC Class Codes: H01L 2224/82 by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI]
• CPC Class Codes: H01L 2224/82102 using jetting, e.g. ink jet
• CPC Class Codes: H01L 2224/83136 involving guiding structures, e.g. spacers or supporting members
• CPC Class Codes: H01L 2224/83851 being an anisotropic conductive adhesive
• CPC Class Codes: H01L 2224/95085 being a liquid, e.g. for fluidic self-assembly
• CPC Class Codes: H01L 2224/95122 by applying vibration
• CPC Class Codes: H01L 2224/95136 involving guiding structures, e.g. shape matching, spacers or supporting members
• CPC Class Codes: H01L 2224/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 23/66 High-frequency adaptations
• CPC Class Codes: H01L 24/19 Manufacturing methods of high density interconnect preforms
• CPC Class Codes: H01L 24/24 of an individual high density interconnect connector
• CPC Class Codes: H01L 24/83 : using a layer connector
• CPC Class Codes: H01L 24/95 : at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
• CPC Class Codes: H01L 24/97 : the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 25/50 : Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00 H01L21/50 takes precedence
• CPC Class Codes: H01L 29/0657 : characterised by the shape of the body
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00011 : Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/01005 : Boron [B]
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01015 : Phosphorus [P]
• CPC Class Codes: H01L 2924/0102 : Calcium [Ca]
• CPC Class Codes: H01L 2924/01023 : Vanadium [V]
• CPC Class Codes: H01L 2924/01024 : Chromium [Cr]
• CPC Class Codes: H01L 2924/01027 : Cobalt [Co]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/01055 : Cesium [Cs]
• CPC Class Codes: H01L 2924/01057 : Lanthanum [La]
• CPC Class Codes: H01L 2924/01074 : Tungsten [W]
• CPC Class Codes: H01L 2924/01075 : Rhenium [Re]
• CPC Class Codes: H01L 2924/01077 : Iridium [Ir]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/10158 : at the passive surface
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/15153 : the die mounting substrate comprising a recess for hosting the device
• CPC Class Codes: H01L 2924/15155 : the shape of the recess being other than a cuboid
• CPC Class Codes: H01L 2924/15157 : Top view
• CPC Class Codes: H01L 2924/15165 : Monolayer substrate
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/19041 : being a capacitor
• CPC Class Codes: H01L 2924/19042 : being an inductor
• CPC Class Codes: H01L 2924/19043 : being a resistor
• CPC Class Codes: H01L 2924/30105 : Capacitance
• CPC Class Codes: H01L 2924/30107 : Inductance
• CPC Class Codes: H01L 2924/3011 : Impedance
• CPC Class Codes: H01L 2924/3025 : Electromagnetic shielding
• CPC Class Codes: Y10T 29/53178 : Chip component

Abstract

A Radio Frequency Identification (RFID) device. The RFID device comprises an antenna assembly and a resonator assembly. The antenna assembly comprises a first substrate and an antenna element. The resonator assembly comprises a second substrate having an integrated circuit connected to a resonator loop. The first substrate and the second substrate are attached to one another. The integrated circuit electrically couples to the antenna element without a direct mechanical contact.

Claims

1. A device comprising:

an antenna assembly having an antenna element; and

a resonator assembly having an integrated circuit connected to a resonator loop, wherein the resonator loop has an inductance configured to cancel a capacitance of the integrated circuit, wherein the resonator loop has an inductor configured to electrically couple the integrated circuit with the antenna element while avoiding a physical contact with the antenna element, wherein a size of the resonator loop is selected to have the inductance to cancel the capacitance of the integrated circuit.

2. The device of claim 1, further comprising a dielectric layer between the antenna element and the resonator loop.

3. The device of claim 1 wherein the antenna assembly has a first substrate coupled to the antenna element.

4. The device of claim 1, wherein the resonator assembly has a second substrate coupled to the resonator loop.

5. The device of claim 1 wherein the integrated circuit and the resonator loop are formed on a same substrate.

6. The device of claim 1 wherein the integrated circuit is inductively coupled to the antenna element.

7. The device of claim 1 wherein the integrated circuit is capacitively coupled to the antenna element.

8. The device of claim 1 wherein the antenna assembly further comprising at least two antenna elements electrically isolated from one another and wherein each one of the antenna elements includes at least a portion that is capacitively coupled to the resonator loop.

9. The device of claim 1 wherein the resonator loop is placed in proximity and not in physical contact with the antenna element for an inductive coupling between the integrated circuit and the antenna element.

10. The device of claim 1 wherein the resonator loop includes a portion that overlaps to a portion of the antenna element for an inductive coupling between the integrated circuit and the antenna element.

11. The device of claim 1 wherein the resonator assembly further comprising:

pad conductors to interconnect the integrated circuit to the resonator loop.

12. The device of claim 1 wherein the resonator loop has a double-loop configuration.

13. The device of claim 1 wherein the antenna assembly is attached to or at least is part of a packaging of an item.

14. A device comprising:

an antenna assembly having an antenna element; and

a resonator assembly having an integrated circuit connected to a resonator loop, wherein the resonator loop has an inductance configured to cancel a capacitance of the integrated circuit to electrically couple the antenna element to the resonator loop while avoiding a physical contact with the antenna element, wherein a size of the resonator loop is selected to have the inductance to cancel the capacitance of the integrated circuit, wherein the resonator assembly has a second substrate coupled to the resonator loop, and wherein the resonator assembly further comprises

a third substrate having the integrated circuit embedded therein, wherein the resonator loop is formed on the second substrate, and wherein the third substrate is coupled to the second substrate such that an electrical interconnection is formed from the integrated circuit to the resonator loop.

15. An RFID device comprising:

an antenna; and

a resonator assembly comprising a first substrate having an integrated circuit coupled to a resonator loop, wherein the resonator loop has an inductance to cancel a capacitance of the integrated circuit,

wherein the antenna is electrically coupled to the integrated circuit via an inductor in the resonator loop that lacks direct contact with the antenna, wherein a size of the resonator loop is selected to have the inductance to cancel the capacitance of the integrated circuit.

16. The RFID device of claim 15 further comprising a dielectric layer between the antenna and the resonator loop.

17. The RFID device of claim 15 wherein the antenna is formed on a second substrate, the second substrate being attached to the first substrate.

18. The RFID device of claim 15 wherein the antenna further comprises at least two antenna elements disposed apart by a non-conductive area and wherein each one of the antenna elements include an end that is capacitively coupled to the resonator loop.

19. The RFID device of claim 15 wherein the resonator loop is placed in proximity and not in physical contact with the antenna for an inductive coupling between the integrated circuit and the antenna.

20. The RFID device of claim 15 wherein the resonator loop and the integrated circuit is each formed on a separate substrate.

21. The RFID device of claim 15 wherein the resonator loop has a double-loop configuration.

22. An RFID device comprising:

an antenna; and

a resonator assembly comprising a first substrate having an integrated circuit coupled to a resonator loop, wherein the resonator loop has an inductance to cancel a capacitance of the integrated circuit, wherein the antenna is electrically coupled to the integrated circuit via the resonator loop that lacks direct contact with the antenna, wherein a size of the resonator loop is selected to have the inductance to cancel the capacitance of the integrated circuit, wherein the first substrate includes a receptor site, the integrated circuit being at least partially embedded within the receptor site.

23. A method for forming a device, the method comprising:

forming a resonator assembly, the resonator assembly comprising an integrated circuit connected to a resonator loop; and

electrically coupling an antenna to the integrated circuit via an inductor in the resonator loop, the resonator loop lacking direct contact with the antenna, wherein a size of the resonator loop is selected to have the inductance to cancel the capacitance of the integrated circuit.

24. The method of claim 23, further comprising

forming an antenna on a first substrate.

25. The method of claim 23 wherein the forming the resonator assembly comprises

forming a resonator loop on a second substrate.

26. The method of claim 23, further comprising

forming a dielectric layer between the resonator loop and the antenna.

27. The method of claim 23, wherein the forming the resonator assembly comprises

forming the integrated circuit on a third substrate.

28. The method of claim 23, wherein the forming the resonator assembly comprises

selecting an inductor of the resonator loop to cancel the capacitance of the integrated circuit.

29. The method of claim 23, wherein the forming the resonator assembly comprises

selecting a shape of the resonator loop to couple to the antenna for a operation at a predetermined frequency range.