In vivo imaging device and method of manufacture thereof

• US 7,967,745 B2
• Filed: 09/28/2006
• Issued: 06/28/2011
• Est. Priority Date: 09/28/2006
• Status: Expired due to Fees

• Current Assignee: Given Imaging Limited (Medtronic Plc)
• Original Assignee: Given Imaging Limited (Medtronic Plc)
• Inventors: Gilad, Zvika
• Primary Examiner(s): Leubecker; John P
• Assistant Examiner(s): CHANG, JEFFREY HAO-WEI
• Application Number:
  US11/528,628
• Publication Number:
  US 20080081949A1
• Time in Patent Office: 1,734 Days
• Field of Search: 600/109, 600/130, 600/160, 600/178, 600/179, 600/302, 600/920, 128/899, 348/76, 439/55, 439/586, 439/591, 439/754, 439/759, 439/761, 439/775, 439/786, 439/816, 439/830, 439/865, 439/867, 439/869, 439/871, 439/872
• US Class Current: 600/160
• CPC Class Codes: A61B 1/0011 Manufacturing of endoscope parts
• CPC Class Codes: A61B 1/041 Capsule endoscopes for imaging
• CPC Class Codes: A61B 1/042 characterised by a proximal camera, e.g. a CCD camera
• CPC Class Codes: A61B 1/06 with illuminating arrangements
• CPC Class Codes: Y10S 600/92 Method of making endoscopes

Abstract

The present invention provides, according to some embodiments, an in vivo imaging device, comprising a mount having at least one illumination source. The mount may be in electrical communication with the illumination source. The device may further include a circuit board and a contact clip for securing the mount to the circuit board and for providing electrical communication therebetween.

Claims

1. A method of manufacturing an in vivo imaging device, comprising:

a) providing a mount having at least one illumination source, wherein said mount is in electrical communication with said illumination source;

b) placing said mount upon a flexible circuit board;

c) installing a contact clip for securing said mount to said circuit board and for providing electrical communication therebetween; and

d) folding said circuit board.

2. The method of claim 1, further comprising soldering said contact clip to said mount.

3. The method of claim 1, further comprising soldering said contact clip to said circuit board.

4. The method of claim 1, further comprising providing electrical communication between said contact clip and a power source.

5. The method of claim 1, further comprising positioning a base housing a lens between said mount and said circuit board.

6. The method of claim 1, further comprising inserting said circuit board into said in-vivo imaging device.