Method for electroplating a substrate

• US 7,968,010 B2
• Filed: 02/10/2010
• Issued: 06/28/2011
• Est. Priority Date: 07/29/2006
• Status: Expired due to Fees

• Current Assignee: Littelfuse Incorporated
• Original Assignee: Shocking Technologies, Inc.
• Inventors: Kosowsky, Lex, Fleming, Robert
• Primary Examiner(s): Kopec; Mark
• Assistant Examiner(s): Thomas; Jaison P
• Application Number:
  US12/703,723
• Publication Number:
  US 20100147697A1
• Time in Patent Office: 503 Days
• Field of Search: 205/221, 205/205, 252/500, 427/101, 427/126.3
• US Class Current: 252/500
• CPC Class Codes: B82Y 10/00 Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
• CPC Class Codes: H01B 1/22 the conductive material comprising metals or alloys
• CPC Class Codes: H01B 1/24 the conductive material comprising carbon-silicon compounds, carbon or silicon
• CPC Class Codes: H01C 17/0652 containing carbon or carbides
• CPC Class Codes: H01C 7/1006 Thick film varistors
• CPC Class Codes: H01C 7/105 Varistor cores H01C7/12 takes precedence
• CPC Class Codes: H05K 1/0257 Overvoltage protection
• CPC Class Codes: H05K 1/0259 Electrostatic discharge [ESD] protection
• CPC Class Codes: H05K 1/0373 containing additives, e.g. fillers H05K1/036 takes precedence
• CPC Class Codes: H05K 1/167 incorporating printed resistors
• CPC Class Codes: H05K 2201/0248 Needles or elongated particles; Elongated cluster of chemically bonded particles microfibers H05K2201/0251; stacked conductors H05K2201/0379
• CPC Class Codes: H05K 2201/0257 Nanoparticles inks comprising nanoparticles H05K1/097
• CPC Class Codes: H05K 2201/026 Nanotubes or nanowires
• CPC Class Codes: H05K 2201/0272 Mixed conductive particles, i.e. using different conductive particles, e.g. differing in shape
• CPC Class Codes: H05K 2201/0738 Use of voltage responsive materials, e.g. voltage switchable dielectric or varistor materials
• CPC Class Codes: H05K 2203/0723 Electroplating, e.g. finish plating
• CPC Class Codes: H05K 2203/105 Using an electrical field; Special methods of applying an electric potential electroplating H05K2203/0723
• CPC Class Codes: H05K 3/188 by direct electroplating
• CPC Class Codes: Y10S 977/742 Carbon nanotubes, CNTs
• CPC Class Codes: Y10S 977/779 Possessing nanosized particles, powders, flakes, or clusters other than simple atomic impurity doping
• CPC Class Codes: Y10T 428/30 : Self-sustaining carbon mass or layer with impregnant or other layer
• CPC Class Codes: Y10T 428/31678 : Of metal

Abstract

One or more embodiments provide for a device that utilizes voltage switchable dielectric material having semi-conductive or conductive materials that have a relatively high aspect ratio for purpose of enhancing mechanical and electrical characteristics of the VSD material on the device.

Claims

1. A method for electroplating a substrate, the method comprising:

applying a voltage switchable dielectric (VSD) material onto a target region of a device, said VSD material comprising;

a binder;

high aspect ratio (HAR) particles that are conductive or semi-conductive and dispersed as nanoscale particles within the binder; and

conductor and/or semiconductor particles other than said HAR particles;

said conductor and/or semiconductor particles being distributed in the binder;

wherein HAR particles and said conductor and/or semiconductor particles are combined to provide said composition with a characteristic of being (i) dielectric in absence of a voltage that exceeds a characteristic voltage level, and (ii) conductive with application of said voltage exceeding said characteristic voltage level;

forming a pattern using the VSD material;

applying the voltage that exceeds the characteristic voltage level so that the VSD material is conductive;

while applying the voltage, exposing the target region of the device to an electrolytic medium;

and wherein said characteristic voltage level exceeds about 14 volts per mil across a gap formed by a thickness of the VSD material.