Method for manufacturing thin film integrated circuit, and element substrate
First Claim
1. A method for manufacturing a thin film integrated circuit, comprising the steps of:
- forming a separation layer over an insulating substrate;
forming at least two thin film integrated circuits over the separation layer;
forming a groove between the two thin film integrated circuits to expose the separation layer;
attaching an antenna substrate provided with an opening and an antenna over the two thin film integrated circuits; and
separating the insulating substrate by introducing an etchant into the opening and removing the separation layer,wherein the two thin film integrated circuits are integrated by the antenna substrate.
0 Assignments
0 Petitions
Accused Products
Abstract
Application form of and demand for an IC chip formed with a silicon wafer are expected to increase, and further reduction in cost is required. An object of the invention is to provide a structure of an IC chip and a process capable of producing at a lower cost. In view of the above described object, one feature of the invention is to provide the steps of forming a separation layer over an insulating substrate and forming a thin film integrated circuit having a semiconductor film as an active region over the separation layer, wherein the thin film integrated circuit is not separated. There is less limitation on the shape of a mother substrate in the case of using the insulating substrate, when compared with the case of taking a chip out of a circular silicon wafer. Accordingly, reduction in cost of an IC chip can be achieved.
69 Citations
15 Claims
-
1. A method for manufacturing a thin film integrated circuit, comprising the steps of:
-
forming a separation layer over an insulating substrate; forming at least two thin film integrated circuits over the separation layer; forming a groove between the two thin film integrated circuits to expose the separation layer; attaching an antenna substrate provided with an opening and an antenna over the two thin film integrated circuits; and separating the insulating substrate by introducing an etchant into the opening and removing the separation layer, wherein the two thin film integrated circuits are integrated by the antenna substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15)
-
Specification