Solid-state image pickup device and method for manufacturing the same

• US 7,968,961 B2
• Filed: 04/17/2009
• Issued: 06/28/2011
• Est. Priority Date: 11/02/2006
• Status: Active Grant

• Current Assignee: Toppan Printing Co., Ltd. (TOPPAN Holdings, Inc.)
• Original Assignee: Toppan Printing Co., Ltd. (TOPPAN Holdings, Inc.)
• Inventors: Yamamoto, Katsumi
• Primary Examiner(s): Le; Thao X
• Assistant Examiner(s): Kraig; William F
• Application Number:
  US12/385,762
• Publication Number:
  US 20090200630A1
• Time in Patent Office: 802 Days
• Field of Search: 257/685, 257/704, 257/432, 257/433, 257/E21.499, 257/E31.11, 438/7, 438/51, 438/64, 438/106, 438/116
• US Class Current: 257/433
• CPC Class Codes: H01L 2224/02377 Fan-in arrangement
• CPC Class Codes: H01L 2224/05548 Bonding area integrally formed with a redistribution layer on the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/05573 Single external layer
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/13 of an individual bump connector
• CPC Class Codes: H01L 27/14618 Containers
• CPC Class Codes: H01L 27/14683 Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof not peculiar thereto H01L21/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Abstract

A solid-state image pickup device which includes a solid-state image pickup chip, a transparent plate disposed to face a light-receiving surface of the solid-state image pickup chip, a frame-like spacer disposed on a peripheral portion of the light-receiving surface of the solid-state image pickup chip for maintaining a space between the solid-state image pickup chip and the transparent plate, and an adhesion layer sealing a circumferential gap formed between the solid-state image pickup chip and the transparent plate, wherein the spacer includes a plurality of partition walls.

Claims

1. A solid-state image pickup device which comprises:

a solid-state image pickup chip;

a transparent plate disposed to face a light receiving surface of the solid-state image pickup chip;

a frame-like spacer disposed on a peripheral portion of the light-receiving surface of the solid-state image pickup chip to maintain a space between the solid-state image pickup chip and the transparent plate; and

an adhesion layer sealing a circumferential gap formed between the solid-state image pickup chip and the transparent plate;

wherein the frame-like spacer has three partition walls including one higher partition wall and two lower partition walls positioned side by side on inner and outer sides of the higher partition wall.

2. The solid-state image pickup device according to claim 1, wherein the frame-like spacer is formed of at least one resin selected from the group consisting of polyimide resin, epoxy resin and epoxy-acrylate resin.

3. The solid-state image pickup device according to claim 1, wherein at least one of the partition walls which is positioned on the outermost side of the three partition walls is provided with a cut for use as an air vent.

4. A method of manufacturing a solid-state image pickup device claimed in claim 1, comprising:

forming the frame-like spacer having the three frame-like partition walls including the one higher partition wall and the two lower partition walls positioned side by side on the inner and outer sides of the higher partition wall which are formed on a surface of a wafer having a plurality of solid-state image pickup chips and/or on a surface of the transparent plate in such a manner that each of the three frame-like partition walls is positioned at a peripheral portion of each of the solid-state image pickup chips or at that portion of the transparent plate which corresponds to said peripheral portion of each of the solid-state image pickup chips;

laminating the wafer on the transparent plate with said three frame-like partition walls being interposed therebetween by making use of the adhesion layer attached to the peripheral portion of each of the solid-state image pickup chips mounted on the wafer to thereby create a laminated structure; and

cutting the laminated structure to separate the solid-state image pickup chips individually.

5. The method according to claim 4, wherein the frame-like spacer is formed of at least one resin selected from the group consisting of polyimide resin, epoxy resin and epoxy-acrylate resin.

6. The method according to claim 4, which further comprises forming a cut for use as an air vent in at least one of the three frame-like partition walls which is positioned on the outermost side of the three frame-like partition walls.