×

Semiconductor device mounting structure, manufacturing method, and removal method of semiconductor device

  • US 7,969,028 B2
  • Filed: 04/14/2008
  • Issued: 06/28/2011
  • Est. Priority Date: 06/15/2007
  • Status: Expired due to Fees
First Claim
Patent Images

1. A semiconductor device mounting structure comprising:

  • a semiconductor device having an electrode aligned on its main face;

    a circuit board having a board electrode, the board electrode being electrically connected to the electrode of the semiconductor device by a solder bump; and

    curable resin in which different types of thermally expandable particles with different expansion temperatures are mixed, the curable resin being applied between at least a side face of the semiconductor device and the circuit board while providing an empty area between the semiconductor device and the circuit board.

View all claims
  • 2 Assignments
Timeline View
Assignment View
    ×
    ×