Semiconductor device mounting structure, manufacturing method, and removal method of semiconductor device

• US 7,969,028 B2
• Filed: 04/14/2008
• Issued: 06/28/2011
• Est. Priority Date: 06/15/2007
• Status: Expired due to Fees

• Current Assignee: Panasonic Corporation (Panasonic Holdings Corporation)
• Original Assignee: Panasonic Corporation (Panasonic Holdings Corporation)
• Inventors: Yoshida, Hisahiko
• Primary Examiner(s): Wagner; Jenny L.
• Application Number:
  US12/102,359
• Publication Number:
  US 20080308930A1
• Time in Patent Office: 1,170 Days
• Field of Search: 257787-795, 257/E23.135
• US Class Current: 257/795
• CPC Class Codes: H01L 21/563 Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
• CPC Class Codes: H01L 2224/0554 External layer
• CPC Class Codes: H01L 2224/0555 Shape
• CPC Class Codes: H01L 2224/0556 Disposition
• CPC Class Codes: H01L 2224/0557 the external layer being disposed on a via connection of the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/05571 the external layer being disposed in a recess of the surface
• CPC Class Codes: H01L 2224/05573 Single external layer
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/06131 being uniform, i.e. having a uniform pitch across the array
• CPC Class Codes: H01L 2224/13111 Tin [Sn] as principal constituent
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/16227 the bump connector connecting to a bond pad of the item
• CPC Class Codes: H01L 2224/29099 Material
• CPC Class Codes: H01L 2224/29111 Tin [Sn] as principal constituent
• CPC Class Codes: H01L 2224/29199 Material of the matrix
• CPC Class Codes: H01L 2224/2929 with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/29299 Base material
• CPC Class Codes: H01L 2224/293 with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/73203 Bump and layer connectors
• CPC Class Codes: H01L 2224/81052 : Detaching bump connectors, e.g. after testing
• CPC Class Codes: H01L 2224/81191 : wherein the bump connectors are disposed only on the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/81801 : Soldering or alloying
• CPC Class Codes: H01L 2224/83104 : by applying pressure, e.g. by injection
• CPC Class Codes: H01L 2224/83194 : Lateral distribution of the layer connectors
• CPC Class Codes: H01L 2224/83851 : being an anisotropic conductive adhesive
• CPC Class Codes: H01L 23/295 : containing a filler H01L23/296 takes precedence
• CPC Class Codes: H01L 24/28 : Structure, shape, material or disposition of the layer connectors prior to the connecting process
• CPC Class Codes: H01L 24/81 : using a bump connector
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00013 : Fully indexed content
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 : Boron [B]
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/0105 : Tin [Sn]
• CPC Class Codes: H01L 2924/01075 : Rhenium [Re]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/0133 : Ternary Alloys
• CPC Class Codes: H01L 2924/15311 : being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/1579 : with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H05K 2201/0212 : Resin particles
• CPC Class Codes: H05K 2201/10734 : Ball grid array [BGA]; Bump grid array
• CPC Class Codes: H05K 2203/1476 : Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
• CPC Class Codes: H05K 2203/306 : Lifting the component during or after mounting; Increasing the gap between component and PCB
• CPC Class Codes: H05K 3/305 : Affixing by adhesive
• CPC Class Codes: H05K 3/3494 : Heating methods for reflowing of solder using integral heating means H05K1/0212
• CPC Class Codes: Y02P 70/50 : Manufacturing or production processes characterised by the final manufactured product

Abstract

A semiconductor device mounting structure includes a semiconductor device whose electrodes are aligned on its one main face; a circuit board having board electrodes electrically connected to the electrodes of the semiconductor device by solder bumps; and curable resin applied between at least the side face of the semiconductor device and the circuit board. Multiple types of thermally expandable particles with different expansion temperatures are mixed in this curable resin. This structure offers the semiconductor device mounting structure that is highly resistant to impact and suited for mass production, its manufacturing method, and a removal method of the semiconductor device. In addition, this structure facilitates repair and reworking, leaving almost no adhesive residue on the circuit board after repair. Stress applied to the circuit board during repair can also be minimized.

Claims

1. A semiconductor device mounting structure comprising:

a semiconductor device having an electrode aligned on its main face;

a circuit board having a board electrode, the board electrode being electrically connected to the electrode of the semiconductor device by a solder bump; and

curable resin in which different types of thermally expandable particles with different expansion temperatures are mixed, the curable resin being applied between at least a side face of the semiconductor device and the circuit board while providing an empty area between the semiconductor device and the circuit board.

2. The semiconductor device mounting structure of claim 1, wherein the curable resin is applied between at least an entire periphery of the side face of the semiconductor device and the circuit board.

3. The semiconductor device mounting structure of claim 1, wherein the curable resin is applied between at least only a plurality of discontinuing points on the entire periphery of the side face of the semiconductor device and the circuit board.

4. The semiconductor device mounting structure of claim 1, wherein the different types of thermally expandable particles include at least two types that are:

first thermally expandable particles that thermally expand at a first expansion temperature, and second thermally expandable particles that thermally expand at a second expansion temperature; and

a melting point of the solder bump is higher than the first expansion temperature and lower than the second expansion temperature.

5. The semiconductor device mounting structure of claim 4, wherein a density of the second thermally expandable particles on a boundary face between the curable resin and the circuit board is higher than a density of the second thermally expandable particles on a boundary face between the curable resin and the side face.

6. The semiconductor device mounting structure of claim 4, wherein the first expansion temperature is not less than 120°

C. and not more than 200°

C., and the second expansion temperature is not less than 220°

C. and not more than 240°

C.

7. The semiconductor device mounting structure of claim 5, wherein the first expansion temperature is not less than 120°

C. and not more than 200°

C., and the second expansion temperature is not less than 220°

C. and not more than 240°

C.