Process for forming a patterned thin film structure for in-mold decoration

• US 7,972,472 B2
• Filed: 12/18/2006
• Issued: 07/05/2011
• Est. Priority Date: 04/24/2002
• Status: Expired due to Fees

• Current Assignee: SiPix Imaging, Inc. (E Ink Holdings Incorporated), ETANSI, Inc.
• Original Assignee: SiPix Imaging, Inc. (E Ink Holdings Incorporated), ETANSI, Inc.
• Inventors: Kiluk, Sean, Tseng, Scott, Liang, Rong-Chang, Chaug, Yi-Shung, Wang, Xiaojia, Zang, HongMei
• Primary Examiner(s): Tucker; Philip C
• Assistant Examiner(s): Chan; Sing P
• Application Number:
  US11/612,364
• Publication Number:
  US 20070160762A1
• Time in Patent Office: 1,660 Days
• Field of Search: 156/344, 156/247, 156/277, 156/278, 156/584, 427154-156, 427272-274, 427/282, 427/259, 101/114, 101/128.21, 101/129, 118/504, 438/478, 438/759, 438/763
• US Class Current: 156/701
• CPC Class Codes: B29C 2045/14704 ink decorations
• CPC Class Codes: B29C 45/14688 Coating articles provided with a decoration
• CPC Class Codes: B29K 2705/00 Use of metals, their alloys or their compounds, for preformed parts, e.g. for inserts
• CPC Class Codes: B44C 1/1729 Hot stamping techniques
• CPC Class Codes: Y10T 156/11 Methods of delaminating, per se; i.e. , separating at bonding face

Abstract

A process for forming a patterned thin film structure on a substrate or in-mold decoration film is disclosed. A pattern is printed with a material, such as a masking coating or ink, on the substrate, the pattern being such that, in one embodiment, the desired structures will be formed in the areas where the printed material is not present, i.e., a negative image of thin film structure to be formed is printed. In another embodiment, the pattern is printed with a material that is difficult to strip from the substrate, and the desired thin film structures will be formed in the areas where the printed material is present, i.e., a positive image of the thin film structure is printed. The thin film material is deposited on the patterned substrate, and the undesired area is stripped, leaving behind the patterned thin film structure.

Claims

1. A process for forming a patterned thin film structure on a substrate, comprising:

printing a pattern on the substrate using a printable material, the printed printable material defining a positive image of a decorative design to be formed on the substrate, such that the printable material is printed in areas where the thin film structure is to be formed;

depositing a thin film material on the patterned substrate, wherein the thin film material, the printable material, and the substrate are chosen so that the thin film material adheres more strongly to the printable material than to the substrate; and

stripping the thin film material formed directly on the substrate using a stripping process that does not strip the thin film material from the printable material such that the thin film material remains on the printable material used to define the pattern in which the thin film structure is to be formed;

wherein the substrate and the patterned thin film structure formed thereon are suitable for use as an IMD decorated film, the printable material comprises a first adhesive, adhesion promoting or tie material, and the stripping process comprises;

applying a second adhesive layer to the substrate after the thin film deposition step; and

removing the thin film material without removing the first adhesive, adhesion promoting or tie material by peeling off the second adhesive layer,

wherein the adhesion strength between thin film material and the substrate is the weakest as compared to the cohesion strength of the second adhesive layer, the cohesion strength of the first adhesive, adhesion promoting or tie material, the cohesion strength of the thin film material, the adhesion strength between the thin film material and the second adhesive layer, and the adhesion between the thin film material and the first adhesive, adhesion promoting or tie material.

2. The process for forming a patterned thin film structure on a substrate as recited in claim 1, wherein the printable material comprises a primer coating, adhesive, tie coat, or adhesion promoting material.

3. The process for forming a patterned thin film structure on a substrate as recited in claim 1, wherein the printable material comprises ink.

4. The process for forming a patterned thin film structure on a substrate as recited in claim 1, wherein the printable material is radiation curable or thermal curable.

5. The process for forming a patterned thin film structure on a substrate as recited in claim 1, wherein the stripping process comprises using mechanical pressure.

6. The process for forming a patterned thin film structure on a substrate as recited in claim 5, wherein using mechanical pressure comprises brushing or using a spray nozzle.