VLSI fabrication processes for introducing pores into dielectric materials
First Claim
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1. A method of forming a layer comprising conductive lines on a substrate, the method comprising:
- (a) providing a layer of composite dielectric material on the substrate, wherein the composite dielectric material comprises a dielectric network and a porogen, and wherein the dielectric network comprises carbon-carbon unsaturated bonds, wherein the dielectric network is formed using a precursor selected from the group consisting of ethynyltrimethylsilane (ETMS), propargyltrimethylsilane (PTMS), propargyloxytrimethylsilane (POTMS), bis(trimethylsilyl)acetylene (BTMSA), 1,3-diethynyltetramethyldisiloxane (DTDS), dimethylmethoxysilaneacetylene (DMMOSA), methyldimethoxysilaneacetylene (MDMOSA), dimethylethoxysilaneacetylene (DMESA), methyldiethoxysilaneacetylene (MDEOSA), dimethylsilane-diacetylene (DMSDA) and methylsilane-triacetylene (MSTA);
(b) patterning the layer of composite dielectric material to define paths for the conductive lines;
(c) filling the paths with conductive material;
(d) after filling the paths in (c), removing at least some of the porogen from the layer of composite dielectric material to produce a porous dielectric network.
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Abstract
Porous dielectric layers are produced by introducing pores in pre-formed composite dielectric layers. The pores may be produced after the barrier material, the metal or other conductive material is deposited to form a metallization layer. In this manner, the conductive material is provided with a relatively smooth continuous surface on which to deposit.
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15 Claims
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1. A method of forming a layer comprising conductive lines on a substrate, the method comprising:
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(a) providing a layer of composite dielectric material on the substrate, wherein the composite dielectric material comprises a dielectric network and a porogen, and wherein the dielectric network comprises carbon-carbon unsaturated bonds, wherein the dielectric network is formed using a precursor selected from the group consisting of ethynyltrimethylsilane (ETMS), propargyltrimethylsilane (PTMS), propargyloxytrimethylsilane (POTMS), bis(trimethylsilyl)acetylene (BTMSA), 1,3-diethynyltetramethyldisiloxane (DTDS), dimethylmethoxysilaneacetylene (DMMOSA), methyldimethoxysilaneacetylene (MDMOSA), dimethylethoxysilaneacetylene (DMESA), methyldiethoxysilaneacetylene (MDEOSA), dimethylsilane-diacetylene (DMSDA) and methylsilane-triacetylene (MSTA); (b) patterning the layer of composite dielectric material to define paths for the conductive lines; (c) filling the paths with conductive material; (d) after filling the paths in (c), removing at least some of the porogen from the layer of composite dielectric material to produce a porous dielectric network. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15)
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Specification