Thin film integrated circuit device, IC label, container comprising the thin film integrated circuit, manufacturing method of the thin film integrated circuit device, manufacturing method of the container, and management method of product having the container
First Claim
1. A flexible integrated circuit capable of performing data transmission wirelessly, comprising:
- a substrate;
an adhesive over the substrate;
a metal oxide over the adhesive;
an insulating film over the metal oxide;
a transistor comprising a semiconductor film, a gate insulating film, and a gate electrode which are provided over the insulating film;
an interlayer insulating film over the transistor;
a wiring formed on the interlayer insulating film, wherein the wiring is directly connected to an impurity region of the semiconductor film; and
an antenna formed on the interlayer insulating film, wherein the antenna is formed from a same layer as the wiring.
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Accused Products
Abstract
The present invention provides an ultrathin thin film integrated circuit and a thin film integrated circuit device including the thin film integrated circuit device. Accordingly, the design of a product is not spoilt while an integrated circuit formed from a silicon wafer, which is thick and produces irregularities on the surface of the product container. The thin film integrated circuit according to the present invention includes a semiconductor film as an active region (for example a channel region in a thin film transistor), unlike an integrated circuit formed from a conventional silicon wafer. The thin film integrated circuit according to the present invention is thin enough that the design is not spoilt even when a product such as a card or a container is equipped with the thin film integrated circuit.
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Citations
52 Claims
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1. A flexible integrated circuit capable of performing data transmission wirelessly, comprising:
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a substrate; an adhesive over the substrate; a metal oxide over the adhesive; an insulating film over the metal oxide; a transistor comprising a semiconductor film, a gate insulating film, and a gate electrode which are provided over the insulating film; an interlayer insulating film over the transistor; a wiring formed on the interlayer insulating film, wherein the wiring is directly connected to an impurity region of the semiconductor film; and an antenna formed on the interlayer insulating film, wherein the antenna is formed from a same layer as the wiring. - View Dependent Claims (2, 3, 4, 5)
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6. A container comprising a flexible integrated circuit capable of performing data transmission wirelessly,
wherein the flexible integrated circuit comprises: -
a substrate; an adhesive over the substrate; a metal oxide over the adhesive; an insulating film over the metal oxide; a transistor comprising a semiconductor film, a gate insulating film, and a gate electrode which are provided over the insulating film; an interlayer insulating film over the transistor; a wiring provided on the interlayer insulating film, wherein the wiring is directly connected to an impurity region of the semiconductor film; and an antenna provided on the interlayer insulating film, wherein the antenna is formed from a same layer as the wiring. - View Dependent Claims (7, 8, 9, 10)
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11. A flexible integrated circuit capable of performing data transmission wirelessly, comprising:
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an integrated circuit disposed over a substrate, the integrated circuit comprising a thin film transistor including an impurity region; an interlayer insulating film over the thin film transistor; and an antenna provided on the interlayer insulating film, wherein the antenna is formed from a same layer as a wiring directly connected to the impurity region, wherein the substrate has a flexibility. - View Dependent Claims (12, 13, 14, 15, 16)
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17. A flexible integrated circuit capable of performing data transmission wirelessly, comprising:
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an integrated circuit attached to a substrate with an adhesive interposed therebetween, the integrated circuit comprising a thin film transistor including an impurity region; an interlayer insulating film over the thin film transistor; and an antenna provided on the interlayer insulating film, wherein the antenna is formed from a same layer as a wiring directly connected to the impurity region, wherein the substrate has a flexibility. - View Dependent Claims (18, 19, 20, 21, 22)
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23. A flexible integrated circuit capable of performing data transmission wirelessly, comprising:
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an integrated circuit disposed over a substrate, the integrated circuit comprising a thin film transistor including an impurity region; an interlayer insulating film over the thin film transistor; an antenna provided on the interlayer insulating film, wherein the antenna is formed from a same layer as a wiring directly connected to the impurity region; and a protective film covering the antenna, wherein the substrate has a flexibility. - View Dependent Claims (24, 25, 26, 27, 28)
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29. A flexible integrated circuit capable of performing data transmission wirelessly, comprising:
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an integrated circuit attached to a substrate with an adhesive interposed therebetween, the integrated circuit comprising a thin film transistor including an impurity region; an interlayer insulating film over the thin film transistor; an antenna provided on the interlayer insulating film, wherein the antenna is formed from a same layer as a wiring directly connected to the impurity region; and a protective film covering the antenna, wherein the substrate has a flexibility. - View Dependent Claims (30, 31, 32, 33, 34)
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35. A flexible integrated circuit capable of performing data transmission wirelessly, comprising:
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an integrated circuit including a memory disposed over a substrate, the integrated circuit comprising a thin film transistor including an impurity region; an interlayer insulating film over the thin film transistor; and an antenna provided on the interlayer insulating film, wherein the antenna is formed from a same layer as a wiring directly connected to the impurity region, wherein the substrate has a flexibility. - View Dependent Claims (36, 37, 38, 39, 40, 41, 42)
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43. A flexible integrated circuit capable of performing data transmission wirelessly, comprising:
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a substrate; an adhesive over the substrate; an insulating film over the substrate with the adhesive therebetween; a transistor comprising a semiconductor film, a gate insulating film, and a gate electrode which are provided over the insulating film; an interlayer insulating film over the transistor; a wiring formed on the interlayer insulating film, wherein the wiring is directly connected to an impurity region of the semiconductor film; and an antenna formed on the interlayer insulating film, wherein the antenna is formed from a same layer as the wiring. - View Dependent Claims (44, 45, 46, 47)
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48. A container comprising a flexible integrated circuit capable of performing data transmission wirelessly,
wherein the flexible integrated circuit comprises: -
a substrate; an adhesive over the substrate; an insulating film over the substrate with the adhesive therebetween; a transistor comprising a semiconductor film, a gate insulating film, and a gate electrode which are provided over the insulating film; an interlayer insulating film over the transistor; a wiring provided on the interlayer insulating film, wherein the wiring is directly connected to an impurity region of the semiconductor film; and an antenna provided on the interlayer insulating film, wherein the antenna is formed from a same layer as the wiring. - View Dependent Claims (49, 50, 51, 52)
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Specification