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Microfeature workpieces having conductive interconnect structures formed by chemically reactive processes, and associated systems and methods

  • US 7,973,411 B2
  • Filed: 11/23/2009
  • Issued: 07/05/2011
  • Est. Priority Date: 08/28/2006
  • Status: Active Grant
First Claim
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1. A microfeature workpiece;

  • comprising;

    a microfeature substrate material having a via with opposing via wall portions;

    a first conductive material disposed in a layer adjacent to the opposing wall portions; and

    a second conductive material disposed adjacent to the first conductive material, the second conductive material entirely filling a cross-sectional dimension and a length of the via between opposing portions of the layer over at least part of a length of the via, the second conductive material including a chemical compound that in turn includes a constituent of the layer.

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