LED lamp assembly with temperature control and method of making the same
First Claim
Patent Images
1. A light emitting diode lamp assembly comprising:
- a base;
a ballast circuit mounted on a circuit board and operable to provide a desired output current; and
a light emitting diode electrically connected to the ballast and driven by the output current of the ballast circuit to provide light;
wherein the base is filled with a thermally conductive substance and the circuit board is mounted in the base and in thermal contact with the thermally conductive substance such that heat is drawn away from the light emitting diode through the circuit board and into the thermally conductive substance to the base.
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Abstract
An light emitting diode lamp assembly in accordance with an embodiment of the present application includes a base, a ballast circuit mounted on a circuit board and operable to provide a desired output current and a light emitting diode electrically connected to the ballast and driven by the output current of the ballast circuit to provide light. The base is filled with a thermally conductive substance and the circuit board is mounted in the base and in thermal contact with the thermally conductive substance such that heat is drawn away from the light emitting diode through the circuit board and into the thermally conductive substance to the base.
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Citations
18 Claims
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1. A light emitting diode lamp assembly comprising:
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a base; a ballast circuit mounted on a circuit board and operable to provide a desired output current; and a light emitting diode electrically connected to the ballast and driven by the output current of the ballast circuit to provide light; wherein the base is filled with a thermally conductive substance and the circuit board is mounted in the base and in thermal contact with the thermally conductive substance such that heat is drawn away from the light emitting diode through the circuit board and into the thermally conductive substance to the base. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 16)
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- 13. The light emitting diode lamp assembly of claim I, further comprising a rectangular circuit board extending upward from a center section of the circuit board, wherein the light emitting diode is mounted on a top end of the rectangular circuit board.
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17. A method of making an LED lamp assembly including a base, a ballast circuit mounted on a bottom surface of a printed circuit board and a light emitting diode mounted on a top surface of the printed circuit board, the method comprising:
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attaching the light emitting diode to the top surface of the printed surface board using surface mount techniques; inverting the printed circuit board; connecting components of the ballast circuit on a bottom surface of the printed circuit board using through-hole techniques; passing the top surface of the printed circuit board through a solder bath such that the all components mounted on the printed circuit board are soldered thereto in a single step while the printed circuit board is inverted; returning the printed circuit board to an upright position; connecting the ballast circuit to a positive and neutral terminal on the base; filling the base with a thermally conductive substance; mounting the printed circuit board in the base with the thermally conductive substance; and attaching a glass envelope to the base to enclose the light emitting diode.
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18. A method of making an LED lamp assembly including a base, a ballast circuit mounted on a bottom surface of a first printed circuit board and a light emitting diode mounted on a rectangular second printed circuit board thermally connected to the top surface of the first printed circuit board, the method comprising:
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attaching control components to the top surface of the first printed surface board using surface mounting techniques; inverting the printed circuit board; connecting components of the ballast circuit on a bottom surface of the printed circuit board using through hole terminals; mounting the second printed circuit board in a slot formed on the first printed circuit board; mounting the light emitting diode on the second printed circuit board; passing the top surface of the printed circuit board through a solder bath such that the all components mounted on the printed circuit board are soldered thereto in a single step while the printed circuit board is inverted; connecting the ballast circuit to a positive and neutral terminal on the base; filling the base with a thermally conductive substance; mounting the printed circuit board in the base with the thermally conductive substance in the inverted position such that the second printed circuit board extends upward away from the base; and attaching a glass envelope to the base to enclose the light emitting diode.
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Specification