Flexible substrate with electronic devices and traces

• US 7,977,170 B2
• Filed: 10/03/2006
• Issued: 07/12/2011
• Est. Priority Date: 10/03/2006
• Status: Active Grant

• Current Assignee: Eastman Kodak Company
• Original Assignee: Eastman Kodak Company
• Inventors: Tredwell, Timothy J., Kerr, Roger S.
• Primary Examiner(s): Brewster; William M.
• Application Number:
  US11/538,173
• Publication Number:
  US 20080090338A1
• Time in Patent Office: 1,743 Days
• Field of Search: 438/151, 438/667, 438/780, 257/E29.158
• US Class Current: 438/151
• CPC Class Codes: H01L 27/124 with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits wiring structures per se H01L23/52
• CPC Class Codes: H01L 29/78603 characterised by the insulating substrate or support H01L29/78657 takes precedence
• CPC Class Codes: Y10T 156/10 Methods of surface bonding and/or assembly therefor

Abstract

A method of manufacturing an electronic device (10) provides a substrate (20) that has a plastic material and has a metallic coating on one surface. A portion of the metallic coating is etched to form a patterned metallic coating. A particulate material (16) is embedded in at least one surface of the substrate. A layer of thin-film semiconductor material is deposited onto the substrate (20).

Claims

1. A method of manufacturing an electronic device comprising:

a) depositing a metallic coating on a substrate to provide a substrate that comprises at least one plastic material having a metallic coating on one surface;

b) etching a portion of the metallic coating to form a patterned metallic coating;

c) embedding a non-doping particulate material at and below an opposite surface of the substrate wherein the embedded particles have high concentration at the surface and the concentration decreases with depth inside the substrate; and

d) forming a thin film electronic device on said opposite surface having said particulate material.

2. The method of claim 1 wherein said particulate material is a fiber.

3. The method of claim 1 wherein said electronic device comprises one or more thin film transistors.

4. The method of claim 1 further comprising forming a via extending between the thin-film electronic device and the patterned metallic coating.