Fusion quad flat semiconductor package
First Claim
Patent Images
1. A semiconductor package comprising:
- a generally planar die paddle defining multiple peripheral edge segments;
a plurality of first leads which each include first and second downsets formed therein in spaced relation to each other, the first leads being segregated into at least two sets which extend along respective ones of at least two peripheral edge segments of the die paddle;
a plurality of second leads, at least some of which include a downset formed therein, the second leads being segregated into at least two sets which extend along respective ones of at least two peripheral edge segments of the die paddle;
a semiconductor die attached to the die paddle and electrically connected to at least one of each of the first and second leads; and
a package body defining a generally planar bottom surface and multiple side surfaces, the package body at least partially encapsulating the first and second leads and the semiconductor die such that the first and second downsets of the first leads and the downsets of the second leads are covered by the package body, at least portions of the die paddle and the first leads are exposed in and substantially flush with the bottom surface of the package body, and portions of the second leads protrude from respective ones of the side surfaces of the package body.
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Abstract
A semiconductor package which includes a generally planar die paddle defining multiple peripheral edge segments and a plurality of leads which are segregated into at least two concentric rows. Connected to the top surface of the die paddle is at least one semiconductor die which is electrically connected to at least some of the leads of each row. At least portions of the die paddle, the leads, and the semiconductor die are encapsulated by a package body, the bottom surfaces of the die paddle and the leads of at least one row thereof being exposed in a common exterior surface of the package body.
351 Citations
20 Claims
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1. A semiconductor package comprising:
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a generally planar die paddle defining multiple peripheral edge segments; a plurality of first leads which each include first and second downsets formed therein in spaced relation to each other, the first leads being segregated into at least two sets which extend along respective ones of at least two peripheral edge segments of the die paddle; a plurality of second leads, at least some of which include a downset formed therein, the second leads being segregated into at least two sets which extend along respective ones of at least two peripheral edge segments of the die paddle; a semiconductor die attached to the die paddle and electrically connected to at least one of each of the first and second leads; and a package body defining a generally planar bottom surface and multiple side surfaces, the package body at least partially encapsulating the first and second leads and the semiconductor die such that the first and second downsets of the first leads and the downsets of the second leads are covered by the package body, at least portions of the die paddle and the first leads are exposed in and substantially flush with the bottom surface of the package body, and portions of the second leads protrude from respective ones of the side surfaces of the package body. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A semiconductor package comprising:
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a generally planar die paddle defining multiple peripheral edge segments; a plurality of first leads segregated into at least two sets which extend along respective ones of at least two peripheral edge segments of the die paddle; a plurality of second leads which each include first and second downsets formed therein in spaced relation to each other, the second leads being segregated into at least two sets which extend along respective ones of at least two peripheral edge segments of the die paddle; a plurality of third leads, at least some of which include a downset formed therein, the third leads being segregated into at least two sets which extend along respective ones of at least two peripheral edge segments of the die paddle; a semiconductor die attached to the die paddle and electrically connected to at least one of each of the first, second and third leads; and a package body defining a generally planar bottom surface and multiple side surfaces, the package body at least partially encapsulating the first, second and third leads and the semiconductor die such that the first and second downsets of the second leads and the downsets of the third leads are covered by the package body, at least portions of the die paddle and the first and second leads are exposed in and substantially flush with the bottom surface of the package body, and portions of the third leads protrude from respective ones of the side surfaces of the package body. - View Dependent Claims (9, 10, 11, 12, 13, 14, 15, 16, 17, 18)
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19. A semiconductor package comprising:
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a die paddle; a plurality of first leads extending along the die paddle; a plurality of second leads which each include first and second downsets formed therein in spaced relation to each other, the second leads extending along the die paddle; a plurality of third leads, at least some of which include a downset formed therein, the third leads extend along the die paddle; a semiconductor die attached to the die paddle and electrically connected to at least one of each of the first, second and third leads; and a package body defining a bottom surface and multiple side surfaces, the package body at least partially encapsulating the first, second and third leads and the semiconductor die such that the first and second downsets of the second leads and the downsets of the third leads are covered by the package body, at least portions of the die paddle and the first and second leads are exposed in the bottom surface of the package body, and portions of the third leads protrude from respective ones of the side surfaces of the package body. - View Dependent Claims (20)
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Specification