Asymmetric electronic parts

• US 7,980,897 B2
• Filed: 08/23/2007
• Issued: 07/19/2011
• Est. Priority Date: 08/24/2006
• Status: Expired due to Fees

• Current Assignee: Polyplastics Co., Ltd. (Daicel Corporation)
• Original Assignee: Polyplastics Co., Ltd. (Daicel Corporation)
• Inventors: Nishikawa, Raita, Fukatsu, Hiroki, Ohshiba, Hirokazu, Kayukawa, Seiji
• Primary Examiner(s): WU, SHEAN CHIU
• Application Number:
  US12/310,130
• Publication Number:
  US 20090197471A1
• Time in Patent Office: 1,426 Days
• Field of Search: 252/299.01, 252/299.5, 174/50, 174/52.2, 439/625, 523/220
• US Class Current: 439/625
• CPC Class Codes: C08K 3/013 Fillers, pigments or reinforcing additives
• CPC Class Codes: C08K 7/14 Glass

Abstract

Provided is a material capable of forming a molded product which has good mechanical properties with low warpage while being excellent in any of the performance including heat resistance and flowability, even if the molded product is an asymmetric electronic parts. Specifically, the asymmetric electronic parts is prepared by molding a liquid crystalline polymer composition comprising (A) a fibrous filler having an average fiber diameter within the range of 5 to 30 μm, having a weight average fiber length within the range of 250 to 350 μm, excluding 10 μm or shorter fiber length, and having a content of a fibrous filler being 700 μm or longer within the range of 5% by weight or less; and (B) a plate-like filler having an average particle size within the range of 0.5 to 200 μm, the total filling amount of (A) and (B) components in the composition being within the range of 40 to 60% by weight, the weight ratio of (A) component being within the range of 10 to 20% by weight, the weight ratio of (B) component being within the range of 30 to 40% by weight, the molded product having no symmetry in any of the axial plane XY, the axial plane YZ, and the axial plane XZ of the molded product.

Claims

1. An asymmetric electronic part, prepared by molding a liquid crystalline polymer composition comprising (A) a fibrous filler having an average fiber diameter within the range of 5 to 30 μ

m, having a weight average fiber length within the range of 250 to 350 μ

m, excluding 10 μ

m or shorter fiber length, and having a content of a fibrous filler being 700 μ

m or longer within the range of 5% by weight or less; and

(B) a plate-like filler having an average particle size within the range of 0.5 to 200 μ

m, the total filling amount of (A) and (B) components in the composition being within the range of 40 to 60% by weight, the weight percentage of (A) component being within the range of 10 to 20% by weight, the weight percentage of (B) component being within the range of 30 to 40% by weight, the molded product having no symmetry in any of the axial plane XY, the axial plane YZ, and the axial plane XZ of the molded product.

2. The asymmetric electronic part according to claim 1, wherein the average fiber diameter of the (A) fibrous filler is within the range of 5 to 9 μ

m.

3. The asymmetric electronic part according to claim 1 being a connector.

4. The asymmetric electronic part according to claim 1, being a connector for a memory module, having a pitch length of 1.0 mm or less, the total product length of 60.0 mm or more, a height of 6.0 mm or less and the number of pins of 100 or more.

5. The asymmetric electronic part according to claim 1, being a memory card socket having a rail structure and having a height of 6.0 mm or less.

6. The asymmetric electronic part according to claim 2 being a connector.

7. The asymmetric electronic part according to claim 1 being a socket.

8. The asymmetric electronic part according to claim 2 being a socket.