Electrolytic capacitor for electric field modulation
First Claim
1. An apparatus for electrochemically processing a substrate with an electrolyte, comprising:
- a capacitive element having a surface in contact with the electrolyte, wherein the capacitive element is independently biased from the substrate, the capacitive element disposed in the electrolyte forms a capacitor having a first chargeable area inside the surface of the capacitive element and a second chargeable area outside the capacitor element in the electrolyte, and the capacitive element is connected to a charging power supply configured to charge and discharge the capacitive element in a controlled manner without inducing electrochemical reactions.
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Abstract
A method and apparatus for adjusting an electric field of an electrochemical processing cell are provided. In one embodiment, a capacitive element is disposed in the processing solution. The strength, shape, or direction of the electric field in the processing solution may be modulated by charging and discharging the capacitive element in a controlled manner. Because the electric field is modulated with out passing a current from the capacitive element to the processing solution, electrochemical reactions do not occur on the interface of the capacitive element and the processing solution, thus, reduces complications caused by unwanted electrochemical reactions.
22 Citations
19 Claims
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1. An apparatus for electrochemically processing a substrate with an electrolyte, comprising:
a capacitive element having a surface in contact with the electrolyte, wherein the capacitive element is independently biased from the substrate, the capacitive element disposed in the electrolyte forms a capacitor having a first chargeable area inside the surface of the capacitive element and a second chargeable area outside the capacitor element in the electrolyte, and the capacitive element is connected to a charging power supply configured to charge and discharge the capacitive element in a controlled manner without inducing electrochemical reactions. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. An apparatus for electroplating a substrate, comprising
a fluid basin configured to contain a plating solution therein; -
an anode in fluid communication with the plating solution, wherein the anode is adapted to a power supply configured to apply a plating bias between the anode and the substrate; and a capacitive element having a surface in contact with the electrolyte, wherein the capacitive element is independently biased from the substrate, the capacitive element disposed in the electrolyte forms a capacitor having a first chargeable area inside the surface of the capacitive element and a second chargeable area outside the capacitor element in the electrolyte, and the capacitive element is connected to a charging power supply configured to charge and discharge the capacitive element in a controlled manner without inducing electrochemical reactions. - View Dependent Claims (13, 14, 15, 16, 17, 18, 19)
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Specification