Method of electrochemical fabrication

• US 7,981,269 B2
• Filed: 10/29/2007
• Issued: 07/19/2011
• Est. Priority Date: 04/04/1997
• Status: Expired due to Fees

• Current Assignee: University of Southern California
• Original Assignee: University of Southern California
• Inventors: Cohen, Adam L.
• Primary Examiner(s): Van; Luan V
• Application Number:
  US11/927,369
• Publication Number:
  US 20080121618A1
• Time in Patent Office: 1,359 Days
• Field of Search: 205/118, 205/122, 205/170, 205/206, 216/38, 216/39
• US Class Current: 205/118
• CPC Class Codes: B33Y 10/00 Processes of additive manufacturing
• CPC Class Codes: B81C 1/00126 Static structures not provided for in groups B81C1/00031 - B81C1/00119
• CPC Class Codes: B81C 2201/0181 Physical Vapour Deposition [PVD], i.e. evaporation, sputtering, ion plating or plasma assisted deposition, ion cluster beam technology
• CPC Class Codes: B81C 2201/0197 Processes for making multi-layered devices not provided for in groups B81C2201/0176 - B81C2201/0192
• CPC Class Codes: B81C 2201/032 LIGA process
• CPC Class Codes: C25D 1/00 Electroforming
• CPC Class Codes: C25D 1/003 3D structures, e.g. superposed patterned layers
• CPC Class Codes: C25D 17/06 Suspending or supporting devices for articles to be coated
• CPC Class Codes: C25D 5/022 using masking means
• CPC Class Codes: C25D 5/10 Electroplating with more than one layer of the same or of different metals for bearings C25D7/10
• CPC Class Codes: C25D 5/12 at least one layer being of nickel or chromium
• CPC Class Codes: C25D 5/22 Electroplating combined with mechanical treatment during the deposition
• CPC Class Codes: C25D 5/611 Smooth layers
• CPC Class Codes: H01L 21/2885 using an external electrical current, i.e. electro-deposition
• CPC Class Codes: H05K 3/241 characterised by the electroplating method; means therefor, e.g. baths or apparatus
• CPC Class Codes: Y10T 428/12486 Laterally noncoextensive components [e.g., embedded, etc.]
• CPC Class Codes: Y10T 428/239 Complete cover or casing

Abstract

An electroplating method that includes: a) contacting a first substrate with a first article, which includes a substrate and a conformable mask disposed in a pattern on the substrate; b) electroplating a first metal from a source of metal ions onto the first substrate in a first pattern, the first pattern corresponding to the complement of the conformable mask pattern; and c) removing the first article from the first substrate, is disclosed. Electroplating articles and electroplating apparatus are also disclosed.

Claims

1. An electroplating method for fabricating a multi-layer three-dimensional structure, comprising:

(i) forming a first layer comprising depositing a first structural material and a first sacrificial material and planarizing the deposited first structural material and first sacrificial material to set a boundary level of the first layer;

(ii) forming additional layers with an initial additional layer formed on and adhered to the first layer and with subsequent additional layers formed on and adhered to previously formed additional layers, wherein the forming of each additional layer comprises depositing an additional structural material and depositing an additional sacrificial material and planarizing the deposited additional structural material and additional sacrificial material to set a boundary level for each additional layer;

wherein the depositing of a material selected from the group consisting of the additional sacrificial material and the additional structural material for a given one of the additional layers comprises;

a) depositing a first portion of the selected material for the given layer using a first patterned mask; and

b) depositing a second portion of the selected material for the given layer using a second patterned mask, which is different from the first patterned mask;

(iii) removing at least a portion of the sacrificial material deposited on a plurality of layers after formation of the additional layers to at least partially release the three-dimensional structure from the sacrificial material,

wherein at least a portion of the depositing steps are electroplating steps.

2. The method of claim 1 wherein the deposition of the sacrificial material for at least a portion of the additional layers occurs selectively via a mask placed in contact with a previously formed additional layer.

3. The method of claim 2 wherein the deposition of the structural material for at least a portion of the additional layers occurs via a blanket deposition.

4. The method of claim 3 wherein the additional structural material for at least a portion of the additional layers comprises a metal and the additional sacrificial material for at least a portion of the additional layers comprises a different metal.

5. The method of claim 1 wherein the additional structural material for at least a portion of the additional layers comprises a metal and the additional sacrificial material for at least a portion of the additional layers comprises a metal.

6. The method of claim 1 wherein the depositing of the second portion of the additional structural material for the given layer laterally overlaps, in part, the deposited first portion of the additional structural material for the given layer.

7. The method of claim 6 wherein the deposition of the sacrificial material for at least a portion of the additional layers occurs selectively via a mask placed in contact with a previously formed additional layer.

8. The method of claim 6 wherein the deposition of the structural material for at least a portion of the additional layers occurs via a blanket deposition.

9. The method of claim 8 wherein the additional structural material for at least a portion of the additional layers comprises a metal and the additional sacrificial material for at least a portion of the additional layers comprises a different metal.

10. The method of claim 6 wherein the additional structural material for at least a portion of the additional layers comprises a metal and the additional sacrificial material for at least a portion of the additional layers comprises a metal.

11. The method of claim 1 wherein the depositing of the second portion of the additional structural material for the given layer does not laterally overlap the deposited first portion of the additional structural material for the given layer.

12. The method of claim 11 wherein the deposition of the sacrificial material for at least a portion of the additional layers occurs selectively via a mask placed in contact with a previously formed additional layer.

13. The method of claim 12 wherein the deposition of the structural material for at least a portion of the additional layers occurs via a blanket deposition.

14. The method of claim 13 wherein the additional structural material for at least a portion of the additional layers comprises a metal and the additional sacrificial material for at least a portion of the additional layers comprises a different metal.

15. The method of claim 11 wherein the additional structural material for at least a portion of the additional layers comprises a metal and the additional sacrificial material for at least a portion of the additional layers comprises a metal.

16. The method of claim 1 wherein the depositing of the second portion of the additional structural material deposits the same material as deposited when depositing the first portion of the additional structural material.