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Substrate bonding with bonding material having rare earth metal

  • US 7,981,765 B2
  • Filed: 05/04/2009
  • Issued: 07/19/2011
  • Est. Priority Date: 09/10/2008
  • Status: Active Grant
First Claim
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1. A method of bonding a MEMS wafer to a second wafer, the method comprising:

  • providing the MEMS wafer with a two-dimensional array of MEMS devices;

    providing the second wafer;

    depositing a metal alloy onto one or both the MEMS wafer and the second wafer, the metal alloy comprising a rare earth metal;

    aligning the MEMS wafer and the second wafer;

    forming an intermediate apparatus having the metal alloy between the MEMS wafer and the second wafer;

    heating the intermediate apparatus at least to within 75 degrees C. of the melting point of the metal alloy between the MEMS wafer and the second wafer; and

    cooling the wafers to form a plurality of conductive hermetic sealing rings about the plurality of the MEMS devices on the MEMS wafer, the sealing rings bonding the MEMS wafer to the second wafer.

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