Substrate bonding with bonding material having rare earth metal
First Claim
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1. A method of bonding a MEMS wafer to a second wafer, the method comprising:
- providing the MEMS wafer with a two-dimensional array of MEMS devices;
providing the second wafer;
depositing a metal alloy onto one or both the MEMS wafer and the second wafer, the metal alloy comprising a rare earth metal;
aligning the MEMS wafer and the second wafer;
forming an intermediate apparatus having the metal alloy between the MEMS wafer and the second wafer;
heating the intermediate apparatus at least to within 75 degrees C. of the melting point of the metal alloy between the MEMS wafer and the second wafer; and
cooling the wafers to form a plurality of conductive hermetic sealing rings about the plurality of the MEMS devices on the MEMS wafer, the sealing rings bonding the MEMS wafer to the second wafer.
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Abstract
A microchip has a bonding material that bonds a first substrate to a second substrate. The bonding material has, among other things, a rare earth metal and other material.
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Citations
8 Claims
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1. A method of bonding a MEMS wafer to a second wafer, the method comprising:
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providing the MEMS wafer with a two-dimensional array of MEMS devices; providing the second wafer; depositing a metal alloy onto one or both the MEMS wafer and the second wafer, the metal alloy comprising a rare earth metal; aligning the MEMS wafer and the second wafer; forming an intermediate apparatus having the metal alloy between the MEMS wafer and the second wafer; heating the intermediate apparatus at least to within 75 degrees C. of the melting point of the metal alloy between the MEMS wafer and the second wafer; and cooling the wafers to form a plurality of conductive hermetic sealing rings about the plurality of the MEMS devices on the MEMS wafer, the sealing rings bonding the MEMS wafer to the second wafer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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Specification