Method for manufacturing a microelectromechanical component, and a microelectromechanical component

• US 7,982,291 B2
• Filed: 05/09/2006
• Issued: 07/19/2011
• Est. Priority Date: 11/23/2005
• Status: Active Grant

• Current Assignee: Murata Manufacturing Co Limited
• Original Assignee: VTI Technologies Oy (Murata Manufacturing Co Limited)
• Inventors: Kuisma, Heikki
• Primary Examiner(s): Tran; Thien F
• Application Number:
  US11/430,035
• Publication Number:
  US 20070114623A1
• Time in Patent Office: 1,897 Days
• Field of Search: 257/415, 257/417, 257/676, 257/704, 438/51
• US Class Current: 257/676
• CPC Class Codes: B81B 2207/012 the micromechanical device and the control or processing electronics being separate parts in the same package
• CPC Class Codes: B81B 2207/015 the micromechanical device and the control or processing electronics being integrated on the same substrate
• CPC Class Codes: B81B 7/02 containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS] B81B7/04 takes precedence
• CPC Class Codes: B81C 1/0023 Packaging together an electronic processing unit die and a micromechanical structure die MEMS packages B81B7/0032; MEMS packaging processes B81C1/00261
• CPC Class Codes: B81C 2203/0792 Forming interconnections between the electronic processing unit and the micromechanical structure
• CPC Class Codes: G01C 19/56 Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
• CPC Class Codes: G01C 19/5783 Mountings or housings not specific to any of the devices covered by groups G01C19/5607 - G01C19/5719
• CPC Class Codes: G01L 9/0042 Constructional details associated with semiconductive diaphragm sensors, e.g. etching, or constructional details of non-semiconductive diaphragms details about the integration or bonding of piezoresistor in or on the diaphragm G01L9/0052 and G01L9/0057 respectively
• CPC Class Codes: G01P 1/023 for acceleration measuring devices
• CPC Class Codes: G01P 15/0802 Details
• CPC Class Codes: H01L 2224/16145 the bodies being stacked
• CPC Class Codes: H01L 2224/1703 Bump connectors having different sizes, e.g. different diameters, heights or widths
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/48145 the bodies being stacked
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/10253 : Silicon [Si]
• CPC Class Codes: H01L 2924/1461 : MEMS
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/3011 : Impedance
• CPC Class Codes: H01L 2924/3025 : Electromagnetic shielding

Abstract

The invention relates to microelectromechanical components, like microelectromechanical gauges used in measuring e.g. acceleration, angular acceleration, angular velocity, or other physical quantities. The microelectromechanical component, according to the invention, comprises a microelectromechanical chip part, sealed by means of a cover part, and an electronic circuit part, suitably bonded to each other. The aim of the invention is to provide an improved method of manufacturing a microelectromechanical component, and to provide a microelectromechanical component, which is applicable for use particularly in small microelectromechanical sensor solutions.

Claims

1. A method for manufacturing a microelectromechanical component, in which method a microelectromechanical chip part is sealed by means of a cover part, which cover part contains lead-in structures for bringing electric connections through the cover part and conductive areas extending through the cover part, wherein at least one conductive area passes through a middle length-wise portion of the cover part, wherein, in the method, a first part is one of the following, and a second part is another one than the first part and one of the following:

said microelectromechanical chip part sealed by means of the cover part, or

an electronic circuit part, such that

the first part is bonded to the second part by means of first bonding members, and that

the second part is larger than the first part, and that, close to the first part, second bonding members are manufactured onto the surface of the second part, for external connections of the microelectromechanical component.

2. Method according to claim 1, wherein the cover part is mainly made of glass, such that, into the cover part, conductive areas extending through the glass element are manufactured out of silicon.

3. Method according to claim 2, wherein the cover part and/or the glass insulators are made of some other known dielectric material instead of glass.

4. Method according to claim 2, wherein the cover part and/or the conductive areas are made of some other known conductive material instead of silicon.

5. Method according to claim 1, wherein the cover part is mainly made of silicon, and into which cover part glass insulation is manufactured, such that, into the cover part, conductive areas extending through the glass insulation are manufactured out of silicon.

6. Method according to claim 1, wherein the cover part is mainly made of silicon, and into which cover part glass insulators are manufactured, such that the cover part is divided into strip-like conducting areas.

7. Method according to claim 1, wherein the cover part is mainly made of silicon, and into which cover part glass insulation is manufactured, such that the cover part is divided into insular conductive areas.

8. Method according to claim 1, wherein the formation of an electric connection between the conductive lead-in of the cover part and the microelectromechanical chip part is implemented by means of a direct bond.

9. Method according to claim 1, wherein the formation of an electric connection between the conductive lead-in of the cover part and the microelectromechanical chip part is implemented by means of metal layers located on the surface.

10. Method according to claim 1, wherein the formation of an electric connection between the conductive lead-in of the cover part and the microelectromechanical chip part is implemented by means of a soldering bump.

11. Method according to claim 1, wherein prior to bonding the cover part to the microelectromechanical chip part a redistribution layer is manufactured onto the surface of the cover part.

12. Method according to claim 11, wherein a conductive connection is created between the conductive areas of the cover part and first bonding members, by means of the redistribution layer.

13. Method according to claim 11, wherein a conductive connection is created between the first bonding members and the second bonding members, by means of the redistribution layer.

14. Method according to claim 11, wherein prior to manufacturing the redistribution layer, a dielectric layer is manufactured onto the surface of the cover part.

15. Method according to claim 11, wherein a protective layer is manufactured on top of the redistribution layer.

16. Method according to claim 1, wherein after bonding the cover part to the microelectromechanical chip part, a redistribution layer is manufactured onto the surface of the cover part.

17. Method according to claim 1, wherein the first bonding members are manufactured onto the surface of the circuit part.

18. Method according to claim 17, wherein the electronic circuit part is bonded by means of a flip-flop method to the surface of the cover part protecting the microelectromechanical chip part.

19. Method according to claim 17, wherein the electronic circuit part is smaller than the microelectromechanical chip part.

20. Method according to claim 17, wherein the narrow gap between the electronic circuit part and the cover part of the microelectromechanical chip part is filled with an underfill.

21. Method according to claim 17, wherein the second bonding members of the microelectromechanical component are implemented by means of wire connections.

22. Method according to claim 21, wherein a plastic cast capsule is cast over the microelectromechanical component.

23. Method according to claim 17, wherein the second bonding members of the microelectromechanical component are implemented by means of bump connectors.

24. Method according to claim 23, wherein the height of the bump connectors is at least equal to the total height of the electronic circuit part and the first bonding members.

25. Method according to claim 23, wherein the bump connectors are manufactured prior to the flip-flop bonding.

26. Method according to claim 23, wherein the bump connectors are manufactured interleaved with the manufacturing of the flip-flop bonding.

27. Method according to claim 23, wherein the microelectromechanical component is attached to the surface of a circuit board by means of the flip-flop method, such that the connection bumps line up with connection areas of the circuit board.

28. Method according to claim 17, wherein that the second bonding members of the microelectromechanical component are implemented by means of adhesive joints.

29. Method according to claim 28, wherein the second bonding members form a conductive connection to the capsule structure of the microelectromechanical component, which capsule structure is provided with conductive coatings.

30. Method according to claim 28, wherein the capsule structure of the microelectromechanical component is suitably designed to match the microelectromechanical component.

31. Method according to claim 17, wherein the second bonding members of the microelectromechanical component are implemented by means of direct soldering joints.

32. Method according to claim 1, wherein the first bonding members are manufactured on top of the redistribution layer of the cover part, into openings in the protective layer.

33. Method according to claim 1, wherein the first bonding members are manufactured onto the surface of the electronic circuit part.

34. Method according to claim 33, wherein the microelectromechanical chip part, by means of the flip-flop method, is bonded to the surface of the electronic circuit part, the cover part facing the surface of the electronic circuit part.

35. Method according to claim 33, wherein the microelectromechanical chip part is smaller than the electronic circuit part.

36. Method according to claim 33, wherein the narrow gap between the electronic circuit part and the cover part of the microelectromechanical chip part is filled with an underfill.

37. Method according to claim 33, wherein the second bonding members of the of the microelectromechanical component are implemented by means of wire connections.

38. Method according to claim 37, wherein a plastic cast capsule is cast over the microelectromechanical component.

39. Method according to claim 33, wherein the second bonding members of the microelectromechanical component are implemented by means of bump connectors.

40. Method according to claim 39, wherein the height of the bump connectors is at least equal to the total height of the microelectromechanical chip part and the first bonding member.

41. Method according to claim 39, wherein the bump connectors are manufactured prior to the flip-flop bonding.

42. Method according to claim 39, wherein the bump connectors are manufactured interleaved with the manufacturing of the flip-flop bonding.

43. Method according to claim 39, wherein the microelectromechanical component is attached to the surface of a circuit board by means of a flip-flop method, such that the connection bumps line up with connection areas of the circuit board.

44. Method according to claim 33, wherein that the second bonding members of the microelectromechanical component are implemented by means of adhesive joints.

45. Method according to claim 44, wherein the second bonding members form a conductive connection to the capsule structure of the microelectromechanical component, which capsule structure is provided with conductive coatings.

46. Method according to claim 44, wherein the capsule structure of the microelectromechanical component is suitably designed to match the microelectromechanical component.

47. Method according to claim 33, wherein the second bonding members of the microelectromechanical component are implemented by means of direct soldering joints.

48. Method according to claim 1, wherein the first bonding members are manufactured onto the redistribution layer of the cover part into openings in the protective layer.

49. Method according to claim 1, wherein the electronic circuit part of the microelectromechanical component possesses electrical signal processing capability.

50. Method according to claim 1, wherein a plate-like substrate comprising a set of second parts serves as a substrate for installing a first part.

51. Method according to claim 50, wherein a set of first parts are installed one by one onto the surface of the plate-like substrate comprising the set of second parts.

52. Method according to claim 51, wherein only first parts having passed testing are installed only onto the surface of second parts having passed testing.

53. Method according to claim 50, wherein the plate-like substrate comprising a second part is diced only after the installation phases.

54. Method according to claim 50, wherein the plate-like substrate comprising a second part is diced only after final testing.

55. A microelectromechanical component comprising:

a microelectromechanical chip part sealed by means of a cover part, which cover part contains lead-in structures for bringing electric connections through the cover part and conductive areas extending through the cover part, wherein at least one conductive area passes through a middle length-wise portion of the cover part, and

an electronic circuit part,

wherein a first part is one of the following, and a second part is another one than the first part and one of the following;

said microelectromechanical chip part sealed by means of the cover part, or

said electronic circuit part,

such that

the first part is bonded to the second part by means of first bonding members,

the second part is larger than the first part, and that, close to the first part, second bonding members are manufactured onto the surface of the second part, for external connections of the microelectromechanical component.

56. Microelectromechanical component according to claim 55, wherein the cover part is mainly made of glass, such that, into the cover part, the conductive areas extending through the glass element are manufactured out of silicon.

57. Microelectromechanical component according to claim 56, wherein the cover part is made of some other known dielectric material instead of glass.

58. Microelectromechanical component according to claim 55, wherein the cover part is mainly made of silicon, and into which cover part glass insulation is manufactured, such that, into the cover part, conductive areas extending through the glass insulation are manufactured out of silicon.

59. Microelectromechanical component according to claim 55, wherein the cover part is mainly made of silicon, and into which cover part glass insulators are manufactured, such that the cover part is divided into strip-like conducting areas.

60. Microelectromechanical component according to claim 55, wherein the cover part is mainly made of silicon, and into which cover part glass insulation is manufactured, such that the cover part is divided into insular conductive areas.

61. Microelectromechanical component according to claim 55, wherein the cover part is mainly made of some other known conductive material instead of silicon, such that, into the cover part, the conductive areas extending through the glass element made of some other known conductive material instead of silicon.

62. Microelectromechanical component according to claim 55, wherein the formation of the electric connection between the conductive lead-in of the cover part and the microelectromechanical chip part is implemented by means of a direct bond.

63. Microelectromechanical component according to claim 55, wherein the formation of the electric connection between the lead-in structures of the cover part and the microelectromechanical chip part is implemented by means of metal layers located on the surface of the cover part.

64. Microelectromechanical component according to claim 55, wherein the formation of the electric connection between the conductive lead-in of the cover part and the microelectromechanical chip part is implemented by means of a soldering bump.

65. Microelectromechanical component according to claim 55, wherein a redistribution layer is manufactured onto the surface of the cover part.

66. Microelectromechanical component according to claim 65, wherein a conductive connection is created between the conductive areas of the cover part and first bonding members, by means of the redistribution layer.

67. Microelectromechanical component according to claim 65, wherein a conductive connection is created between the first bonding members and the second bonding members, by means of the redistribution layer.

68. Microelectromechanical component according to claim 65, wherein prior to manufacturing the redistribution layer, a dielectric layer is manufactured onto the surface of the cover part.

69. Microelectromechanical component according to claim 65, wherein a protective layer is manufactured on top of the redistribution layer.

70. Microelectromechanical component according to claim 69, wherein the first bonding members are manufactured on top of the redistribution layer of the cover part into openings in the protective layer.

71. Microelectromechanical component according to claim 55, wherein the first bonding members are manufactured onto the surface of the electronic circuit part.

72. Microelectromechanical component according to claim 71, wherein the electronic circuit part is bonded to the surface of the cover part protecting the microelectromechanical chip part.

73. Microelectromechanical component according to claim 70, wherein the electronic circuit part is smaller than the microelectromechanical chip part.

74. Microelectromechanical component according to claim 70, wherein the narrow gap between the electronic circuit part and the cover part of the microelectromechanical chip part is filled with an underfill.

75. Microelectromechanical component according to claim 71, wherein the second bonding members of the microelectromechanical component are implemented by means of bump connectors.

76. Microelectromechanical component according to claim 75, wherein the height of the bump connectors is at least equal to the total height of the electronic circuit part and the first bonding members.

77. Microelectromechanical component according to claim 75, wherein the microelectromechanical component is attached to the surface of a circuit board, such that the connection bumps line up with connection areas of the circuit board.

78. Microelectromechanical component according to claim 71, wherein that the second bonding members of the microelectromechanical component are implemented by means of adhesive joints.

79. Microelectromechanical component according to claim 78, wherein the second bonding members form a conductive connection to the capsule structure of the microelectromechanical component, which capsule structure is provided with conductive coatings.

80. Microelectromechanical component according to claim 78, wherein the capsule structure of the microelectromechanical component is suitably designed to match the microelectromechanical component.

81. Microelectromechanical component according to claim 71, wherein the second bonding members of the microelectromechanical component are implemented by means of direct soldering joints.

82. Microelectromechanical component according to claim 55, wherein the microelectromechanical chip part is bonded to the surface of the electronic circuit part, the cover part facing the surface of the electronic circuit part.

83. Microelectromechanical component according to claim 55, wherein the microelectromechanical chip part is smaller than the electronic circuit part.

84. Microelectromechanical component according to claim 55, wherein the second bonding members of the microelectromechanical component are implemented by means of bump connectors.

85. Microelectromechanical component according to claim 84, wherein the height of the bump connectors is at least equal to the total height of the microelectromechanical chip part and the first bonding member.

86. Microelectromechanical component according to claim 84, wherein the microelectromechanical component is attached to the surface of a circuit board, such that the connection bumps line up with connection areas of the circuit board.

87. Microelectromechanical component according to claim 55, wherein that the second bonding members of the microelectromechanical component are implemented by means of adhesive joints.

88. Microelectromechanical component according to claim 87, wherein the second bonding members form a conductive connection to the capsule structure of the microelectromechanical component, which capsule structure is provided with conductive coatings.

89. Microelectromechanical component according to claim 87, wherein the capsule structure of the microelectromechanical component is suitably designed to match the microelectromechanical component.

90. Microelectromechanical component according to claim 55, wherein the second bonding members of the microelectromechanical component are implemented by means of direct soldering joints.

91. Microelectromechanical component according to claim 55, wherein the electronic circuit part of the microelectromechanical component possesses electrical signal processing capability.

92. A microelectromechanical component comprising:

a microelectromechanical chip part sealed by means of a cover part, which cover part contains lead-in structures for bringing electric connections through the cover part, and

an electronic circuit part,

wherein a first part is one of the following, and a second part is another one than the first part and one of the following;

said microelectromechanical chip part sealed by means of the cover part, or

said electronic circuit part,

such that

the first part is bonded to the second part by means of first bonding members,

the second part is larger than the first part, and that, close to the first part, second bonding members are manufactured onto the surface of the second part, for external connections of the microelectromechanical component,

wherein the first bonding members are manufactured onto the surface of the electronic circuit part, and

wherein the second bonding members of the microelectromechanical component are implemented by means of wire connections.

93. Microelectromechanical component according to claim 92, wherein a plastic cast capsule is cast over the microelectromechanical component.

94. A microelectromechanical acceleration sensor comprising:

a microelectromechanical chip part sealed by means of a cover part, which cover part contains lead-in structures for bringing electric connections through the cover part and conductive areas extending through the cover part, wherein at least one conductive area passes through a middle length-wise portion of the cover part, and

an electronic circuit part,

wherein a first part is one of the following, and a second part is another one than the first part and one of the following;

said microelectromechanical chip part sealed by means of the cover part, or

said electronic circuit part,

such that

the first part is bonded to the second part by means of first bonding members,

the second part is larger than the first part, and that, close to the first part, second bonding members are manufactured onto the surface of the second part, for external connections of the microelectromechanical acceleration sensor.

95. A microelectromechanical sensor of angular acceleration, comprising:

a microelectromechanical chip part sealed by means of a cover part, which cover part contains lead-in structures for bringing electric connections through the cover part and conductive areas extending through the cover part, wherein at least one conductive area passes through a middle length-wise portion of the cover part, and

an electronic circuit part,

wherein a first part is one of the following, and a second part is another one than the first part and one of the following;

said microelectromechanical chip part sealed by means of the cover part, or

said electronic circuit part,

such that

the first part is bonded to the second part by means of first bonding members,

the second part is larger than the first part, and that, close to the first part, second bonding members are manufactured onto the surface of the second part, for external connections of the microelectromechanical sensor of angular acceleration.

96. A microelectromechanical sensor of angular velocity, comprising:

a microelectromechanical chip part sealed by means of a cover part, which cover part contains lead-in structures for bringing electric connections through the cover part and conductive areas extending through the cover part, wherein at least one conductive area passes through a middle length-wise portion of the cover part, and

an electronic circuit part,

wherein a first part is one of the following, and a second part is another one than the first part and one of the following;

said microelectromechanical chip part sealed by means of the cover part, or

said electronic circuit part,

such that

the first part is bonded to the second part by means of first bonding members,

the second part is larger than the first part, and that, close to the first part, second bonding members are manufactured onto the surface of the second part, for external connections of the microelectromechanical sensor of angular velocity.

97. A microelectromechanical pressure sensor, comprising:

a microelectromechanical chip part sealed by means of a cover part, which cover part contains lead-in structures for bringing electric connections through the cover part and conductive areas extending through the cover part, wherein at least one conductive area passes through a middle length-wise portion of the cover part, and

an electronic circuit part,

wherein a first part is one of the following, and a second part is another one than the first part and one of the following;

said microelectromechanical chip part sealed by means of the cover part, or

said electronic circuit part,

such that

the first part is bonded to the second part by means of first bonding members,

the second part is larger than the first part, and that, close to the first part, second bonding members are manufactured onto the surface of the second part, for external connections of the microelectromechanical pressure sensor.

98. A microelectromechanical stabilizer of frequency of oscillation, comprising:

a microelectromechanical chip part sealed by means of a cover part, which cover part contains lead-in structures for bringing electric connections through the cover part and conductive areas extending through the cover part, wherein at least one conductive area passes through a middle length-wise portion of the cover part, and

an electronic circuit part,

wherein a first part is one of the following, and a second part is another one than the first part and one of the following;

said microelectromechanical chip part sealed by means of the cover part, or

said electronic circuit part,

such that

the first part is bonded to the second part by means of first bonding members,

the second part is larger than the first part, and that, close to the first part, second bonding members are manufactured onto the surface of the second part, for external connections of the microelectromechanical stabilizer of frequency of oscillation.

99. A microelectromechanical filter of an electrical signal, comprising:

a microelectromechanical chip part sealed by means of a cover part, which cover part contains lead-in structures for bringing electric connections through the cover part and conductive areas extending through the cover part, wherein at least one conductive area passes through a middle length-wise portion of the cover part, and

an electronic circuit part,

wherein a first part is one of the following, and a second part is another one than the first part and one of the following;

said microelectromechanical chip part sealed by means of the cover part, or

said electronic circuit part,

such that

the first part is bonded to the second part by means of first bonding members,

the second part is larger than the first part, and that, close to the first part, second bonding members are manufactured onto the surface of the second part, for external connections of the microelectromechanical filter of an electrical signal.

100. A microelectromechanical switching component for an electrical signal, comprising:

a microelectromechanical chip part sealed by means of a cover part, which cover part contains lead-in structures for bringing electric connections through the cover part, and

an electronic circuit part and conductive areas extending through the cover part, wherein at least one conductive area passes through a middle length-wise portion of the cover part,

wherein a first part is one of the following, and a second part is another one than the first

part and one of the following;

said microelectromechanical chip part sealed by means of the cover part, or

said electronic circuit part,

such that

the first part is bonded to the second part by means of first bonding members,

the second part is larger than the first part, and that, close to the first part, second bonding members are manufactured onto the surface of the second part, for external connections of the microelectromechanical switching component for an electrical signal.

101. A microelectromechanical electric impedance matching device, comprising:

a microelectromechanical chip part sealed by means of a cover part, which cover part contains lead-in structures for bringing electric connections through the cover part and conductive areas extending through the cover part, wherein at least one conductive area passes through a middle length-wise portion of the cover part, and

an electronic circuit part,

wherein a first part is one of the following, and a second part is another one than the first part and one of the following;

said microelectromechanical chip part sealed by means of the cover part, or

said electronic circuit part,

such that

the first part is bonded to the second part by means of first bonding members,

the second part is larger than the first part, and that, close to the first part, second bonding members are manufactured onto the surface of the second part, for external connections of the microelectromechanical electric impedance matching device.