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Substrate inductive devices and methods

  • US 7,982,572 B2
  • Filed: 07/15/2009
  • Issued: 07/19/2011
  • Est. Priority Date: 07/17/2008
  • Status: Active Grant
First Claim
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1. A wire-less inductive device, comprising:

  • at least three substrates comprising a top substrate, a bottom substrate and one or more middle substrates, at least one of said at least three substrates comprised of an exterior surface which is at least partly copper plated, with said at least one substrate having one or more windings formed thereon;

    a plurality of extended conductors, at least a portion of said plurality of extended conductors extending from said exterior copper plated surface and substantially through said substrate;

    a magnetically permeable core, said core disposed at least partly between two or more of said at least three substrates; and

    a second magnetically permeable core, said second magnetically permeable core in combination with said at least three substrates, an incorporated electronic component and said magnetically permeable core, form a complete filter circuit.

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