×

Electrostatic chuck and method of forming

  • US 7,983,017 B2
  • Filed: 12/19/2007
  • Issued: 07/19/2011
  • Est. Priority Date: 12/26/2006
  • Status: Active Grant
First Claim
Patent Images

1. A Coulombic electrostatic chuck comprising:

  • a substrate;

    a conductive layer overlying the substrate;

    an arc elimination layer overlying the conductive layer, wherein the arc elimination layer comprises a normalized resistance of not less than about 104 Ohms/cm2 and an ionic conductor; and

    a high-k dielectric layer overlying the arc elimination layer, wherein the high-k dielectric layer has a dielectric constant of not less than about 10 and a resistivity of not less than about 1011 Ohm-cm.

View all claims
  • 1 Assignment
Timeline View
Assignment View
    ×
    ×