PCBA mounting assembly for tool-less attachment and release

• US 7,983,057 B2
• Filed: 04/03/2009
• Issued: 07/19/2011
• Est. Priority Date: 04/03/2009
• Status: Active Grant

• Current Assignee: Oracle America, Inc. (Oracle Corporation)
• Original Assignee: Oracle America, Inc. (Oracle Corporation)
• Inventors: Zheng, An-Sheng Anson, Milo, Michael T., Ong, Brett C.
• Primary Examiner(s): Gandhi; Jayprakash N
• Assistant Examiner(s): THAKER, NIDHI VIVEK
• Application Number:
  US12/417,908
• Publication Number:
  US 20100254078A1
• Time in Patent Office: 837 Days
• Field of Search: 361/807, 361/810, 361728-729, 361752-753, 361758-759, 361/801, 361/804, 361/742, 361/770, 174/138.E, 411/517, 411/530, 411/353, 439/92, 439/95, 439325-328, 297/39, 297/57, 298/32, 294/50, 294/56
• US Class Current: 361/810
• CPC Class Codes: H05K 7/142 Spacers not being card guides

Abstract

A mounting assembly is provided for use in mounting a printed circuit board to a computer chassis. The mounting assembly includes standoffs attached to the chassis wall to extend outward into the chassis. Each standoff includes an elongated body and a neck extending from the body and having a smaller diameter than outer dimensions of the body. Each standoff includes a head extending from the neck. The mounting assembly includes retention assemblies that are mounted to the printed circuit board. Each retention assembly includes a spring-force retention member (such as a single coil of a ring spring) with an inner passageway with an at rest diameter smaller than the head. The printed circuit board is mounted to the chassis wall by pressing the printed circuit board onto the standoff elements, which are clasped by a spring force applied by each of the spring-force retention members on the standoff necks.

Claims

1. A mounting assembly for retention and extraction of a printed circuit board to a support surface, the printed circuit board having at least two holes for facilitating mounting, comprising:

a plurality of standoff elements extending from a support surface toward an interior space of a computer enclosure, each of the standoff elements comprising an elongated body, a neck extending from the body with a smaller diameter than the body, and a head extending from the neck; and

a plurality of retention assemblies mounted to a surface of the printed circuit board, each of the retention assemblies comprising a spring-force retention member with a passageway with an at rest diameter smaller than at least a portion of the head, wherein the spring-force retention member is expandable to allow the head to pass through the passageway during mounting of the printed circuit board onto the plurality of standoff elements;

wherein the spring-force retention member comprises a single coil of a ring spring with an inner diameter smaller than about a diameter of the head of the standoff element as measured proximate to the neck;

wherein the head of each of the standoff elements comprises a shoulder adjacent to the neck and a tip distal to the shoulder, the shoulder having a diameter greater than a diameter of the tip to define an outward sloping contact surface on the head; and

wherein the neck of each of the standoff elements has a height greater than about a combined thickness of the printed circuit board and the spring-force retention member and the neck of each of the standoff elements has a circular cross section when viewed along a longitudinal axis of the standoff elements having a diameter greater than about the at rest diameter of the passageway through the spring-force retention member.

2. The assembly of claim 1, wherein the spring-force retention member further comprises a gap between a first and second end, whereby the ring spring expands when the head of the standoff element is forced through the passageway of the spring-force retention member.

3. The assembly of claim 1, wherein each of the retention assemblies comprises a retainer retaining the spring-force retention member adjacent one of the holes on the printed circuit board, the retainer being attached to the surface of the printed circuit board and the retainer having a sidewall spaced apart from an outer surface of the spring-force retention member to allow a predetermined quantity of expansion of the spring-force retention member.

4. The assembly of claim 1, wherein the support surface comprises a surface of a computer chassis and wherein the printed circuit board includes four of the mounting holes and wherein the plurality of standoff elements comprises four of the standoff elements that are affixed to the surface of the computer chassis with a longitudinal axis extending through the body, neck, and head of each of the standoff elements and with the longitudinal axes being substantially parallel.

5. A tool-less mounting mechanism for use with a board used in a computing device, the mechanism comprising:

a plurality of retention assemblies each comprising a spring holder attached to a surface of a board and including a passageway aligned with a hole in the board, wherein each of the retention assemblies includes a ring-shaped retention member with a first diameter; and

a plurality of standoff elements extending outward from a surface of the computing device, each of the standoff elements comprising an elongated body, a neck extending from the body with a smaller diameter than the body, and a head extending from the neck;

wherein the head of each of the standoff elements comprises a shoulder adjacent to the neck and a tip distal to the shoulder, the shoulder having a diameter greater than a diameter of the tip to define an outward sloping contact surface on the head;

wherein the tip and shoulder diameters of the head of each of the standoff elements is less than about a diameter of the hole with the shoulder diameter being greater than the first diameter, whereby the board is retained on the plurality of standoff elements by the ring-shaped retention members that each expand to a second diameter equal to about the shoulder diameter to allow the heads to each pass through the passageway of the corresponding one of the retention assemblies and spring back toward the first diameter to apply a retention force; and

wherein the neck of each of the standoff elements has a height greater than about a combined thickness of the board and the ring-shaped retention member and the neck of each of the standoff elements has a circular cross section when viewed along a longitudinal axis of the standoff elements having a diameter greater than about the first diameter of the ring-shaped retention member.

6. The mechanism of claim 5, wherein the body of each of the standoff elements has an outer dimension greater than the diameter of the hole in the board to provide a shelf for receiving a surface of the board proximate to the hole.

7. The mechanism of claim 6, wherein the neck of each of the standoff elements has a circular cross section with a diameter less than about the diameter of the hole and greater than about the first diameter of the ring-shaped retention member, whereby the retention force applied by the retention member is applied to the neck.

8. The mechanism of claim 7, wherein each of the retention members comprises a single coil of a ring spring and the coil includes a gap between its ends, whereby the coil is expandable to the second diameter.

9. The mechanism of claim 8, wherein the spring holder comprises a sidewall extending about an outer surface of the coil and wherein the sidewall is spaced apart from the outer surface when the retention member has the first diameter.

10. The mechanism of claim 5, wherein the board is rectangular in shape and includes four of the holes positioned proximate to each corner of the board and wherein the plurality of retention assemblies comprises four of the retention assemblies and the plurality of standoff elements comprises four of the standoff elements, the standoff elements extending outward from the wall with parallel longitudinal axes and being arranged in a pattern matching a pattern of the four holes on the board.

11. A computer device with a board mounted for tool-less installation and removal, comprising:

a computer chassis with a mounting surface;

a plurality of standoffs extending from the mounting surface toward an interior space of the computer chassis, each of the standoffs comprising an elongated body, a neck extending from the body with a smaller diameter than the body, and a head extending from the neck;

wherein the head of each of the standoffs comprises a shoulder adjacent to the neck and a tip distal to the shoulder, the shoulder having a diameter greater than a diameter of the tip to define an outward sloping contact surface on the head;

a printed circuit board comprising a plurality of mounting holes;

a plurality of retainers each attached to a surface of the printed circuit board adjacent one of the mounting holes; and

within each of the retainers, a retention member with an expandable passageway extending therethrough, wherein the printed circuit board is attached to the standoffs by pressing the sloping contact surface of each of the standoffs through one of the expandable passageways causing the expandable passageway to expand from a first diameter to a second diameter and to spring back toward the first diameter and abut the neck;

wherein the retention members each comprises a ring spring defining a loop with an at rest inner diameter equal to the first diameter; and

wherein the neck of each of the standoffs has a height greater than about a combined thickness of the printed circuit board and the retention member and the neck of each of the standoffs has a circular cross section when viewed along a longitudinal axis of the standoffs having a diameter greater than about the first diameter of the retention member.

12. The computer device of claim 11, wherein each of the retainers comprises a sidewall retaining one of the ring springs proximate to the surface of the printed circuit board and having an inner diameter greater than an external diameter of the retained one of the ring springs.

13. The computer device of claim 12, wherein the height of each of the sidewalls as measured from the surface of the printed circuit board is less than about 5, millimeters and wherein the first diameter of each of the retention members is less than about 3, millimeters.

14. The computer device of claim 11, wherein each of the retention members comprises a single coil of the ring spring with a gap between ends of the coil.

15. The computer device of claim 11, wherein the elongated body of each of the standoffs having an outer dimension greater than a diameter of a paired one of the mounting holes, and the outer dimension being greater than an outer dimension of the neck positioned adjacent the elongated body.