Collecting debris from a tool

• US 7,983,789 B2
• Filed: 09/14/2007
• Issued: 07/19/2011
• Est. Priority Date: 09/14/2007
• Status: Active Grant

• Current Assignee: Seagate Technology LLC (Seagate Technology Holdings Plc)
• Original Assignee: Seagate Technology LLC (Seagate Technology Holdings Plc)
• Inventors: Subramaniam, VigneswaraRao, Ng, HwaLiang, Thomas, George P., Lutz, Joseph Charles, Yu, YongLing
• Primary Examiner(s): Patel; Ramesh B
• Assistant Examiner(s): Rapp; Chad
• Application Number:
  US11/855,708
• Publication Number:
  US 20090076656A1
• Time in Patent Office: 1,404 Days
• Field of Search: 700/32, 700/174, 700/175
• US Class Current: 700/175
• CPC Class Codes: B23Q 11/0042 Devices for removing chips B23Q11/02, B23Q11/0875 take precedence
• CPC Class Codes: G05B 2219/49042 Remove chips from probe, tool by blowing them away
• CPC Class Codes: G05B 2219/49055 Remove chips from probe, tool by vibration

Abstract

An apparatus and associated method for collecting debris from a tool, wherein programming instructions are stored in memory and executed by a machine tool controller, and wherein the controller is responsive to an intermittent debris collect signal in altering an operative path of the tool in order to engage the tool with a debris collecting device.

Claims

1. An apparatus that processes a workpiece, comprising:

a surface that is sized to support the workpiece;

a tool that is configured to impart a predefined process to the workpiece while the workpiece is supported on the surface; and

a controller executing programming instructions stored in memory to move the tool along a predetermined operative tool path to impart the predefined process, wherein the controller is responsive to an intermittent debris collect signal in altering a trajectory of the operative tool path in order to engage the tool with a debris collecting device having a collecting feature that operably collects the debris from the tool.

2. The apparatus of claim 1 wherein the controller imparts the operative path to the tool with respect to an article that is presented to the tool via a transport device.

3. The apparatus of claim 2 wherein the debris collecting device is presented to the tool via the transport device.

4. The apparatus of claim 3, wherein the debris collecting device is capable of collecting debris from the transport device.

5. The apparatus of claim 3 wherein the debris collecting device is supported by a body that also supports a communicative device associated with the debris collect signal.

6. The apparatus of claim 4 wherein the transport device comprises a conveyor.

7. The apparatus of claim 3 wherein the debris collecting device comprises an exposed adhesive surface.

8. The apparatus of claim 7 wherein the debris collecting device comprises multiple layers of adhesive-coated film.

9. A method comprising:

executing a first control mode on a tool imparting an operative path associated with operating the tool;

receiving a debris collect signal; and

executing a second control mode in response to the debris collect signal altering a trajectory of the operative path to engage the tool with a debris collecting device having a collecting feature that collects the debris from the tool.

10. The method of claim 9 wherein the executing steps are characterized by programming instructions stored in memory that are executed by a processor based controller.

11. The method of claim 10 wherein the receiving step is performed intermittently in relation to the first control mode.

12. The method of claim 11 wherein the executing a first control mode step is characterized by transporting an article to a predetermined position in relation to the operative path.

13. The method of claim 12 wherein the executing a second control mode step is characterized by transporting the debris collecting device to a predetermined position in relation to the tool.

14. The method of claim 13 further comprising collecting debris from a transport device with the debris collecting device.

15. The method of claim 13 wherein the receiving a debris collect signal step is characterized in association with an arrival of the debris collecting device at the predetermined position.

16. The method of claim 15 wherein the receiving debris collect signal step is characterized by a communication signal selected from a set consisting of an RFID signal and a bar code scanner signal.

17. The method of claim 16 wherein the executing a second control mode step is characterized by contacting the tool against an exposed adhesive surface.

18. An apparatus that processes a workpiece, comprising:

a surface that is sized to support the workpiece;

a tool that is configured to impart a predefined process to the workpiece while the workpiece is supported on the surface;

a debris monitor that non-manually generates a debris collect signal when a predefined criteria exceeds a threshold; and

a controller executing programming instructions stored in memory to move the tool along a predetermined operative tool path to impart the predefined process, the controller being responsive to the generated debris collect signal in altering a trajectory of the operative tool path in order to engage the tool with a debris collecting device having a collecting feature capable of collecting debris from the tool.

19. The apparatus of claim 18 wherein the debris monitor generates the debris collect signal when a number of the process cycles exceeds the threshold number of process cycles.

20. The apparatus of claim 18 wherein the debris monitor generates the debris collect signal when an amount of debris accumulated on the tool exceeds the threshold amount of debris.

21. The apparatus of claim 18 wherein the debris monitor generates the debris collect signal when an elapsed time exceeds threshold interval of time.