Reactor design to reduce particle deposition during process abatement
First Claim
1. An apparatus for use during the abatement of a semiconductor manufacturing process comprising:
- a thermal reaction unit having;
an interior porous wall that defines a central chamber, the interior porous wall formed from a plurality of stacked porous sections;
at least one waste gas inlet in fluid communication with the central chamber and adapted to introduce a gaseous waste stream to the central chamber;
a thermal mechanism positioned within the central chamber and adapted to decompose the gaseous waste stream within the central chamber, thereby forming reaction products;
a fluid delivery system adapted to provide a fluid to the central chamber through the interior porous wall at a sufficient force to reduce deposition of reaction products on an inner surface of the interior porous wall of the central chamber;
a water quench unit coupled to the thermal reaction unit and adapted to receive a gas stream from the thermal reaction unit; and
a shield configured to be positioned between the quench unit and the interior porous wall and adapted to prevent water wetting a bottommost porous section of the plurality of stacked porous sections, the shield including an air knife inlet, wherein the air knife inlet injects an air knife to remove deposited material from the interior porous wall.
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Abstract
The present invention relates to systems and methods for controlled combustion and decomposition of gaseous pollutants while reducing deposition of unwanted reaction products from within the treatment systems. The systems include a novel thermal reaction chamber design having stacked reticulated ceramic rings through which fluid, e.g., gases, may be directed to form a boundary layer along the interior wall of the thermal reaction chamber, thereby reducing particulate matter buildup thereon. The systems further include the introduction of fluids from the center pilot jet to alter the aerodynamics of the interior of the thermal reaction chamber.
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Citations
27 Claims
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1. An apparatus for use during the abatement of a semiconductor manufacturing process comprising:
a thermal reaction unit having; an interior porous wall that defines a central chamber, the interior porous wall formed from a plurality of stacked porous sections; at least one waste gas inlet in fluid communication with the central chamber and adapted to introduce a gaseous waste stream to the central chamber; a thermal mechanism positioned within the central chamber and adapted to decompose the gaseous waste stream within the central chamber, thereby forming reaction products; a fluid delivery system adapted to provide a fluid to the central chamber through the interior porous wall at a sufficient force to reduce deposition of reaction products on an inner surface of the interior porous wall of the central chamber; a water quench unit coupled to the thermal reaction unit and adapted to receive a gas stream from the thermal reaction unit; and a shield configured to be positioned between the quench unit and the interior porous wall and adapted to prevent water wetting a bottommost porous section of the plurality of stacked porous sections, the shield including an air knife inlet, wherein the air knife inlet injects an air knife to remove deposited material from the interior porous wall. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17)
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18. An apparatus for use during the abatement of a semiconductor manufacturing process comprising:
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a upper reaction chamber having; an interior porous wall that defines a central chamber, the interior porous wall formed from a plurality of stacked, replaceable porous sections; a first exterior wall that surrounds and supports the stacked porous sections of the interior porous wall and that includes a plurality of perforations that allow passage of fluid through the first exterior wall to the interior porous wall; a second exterior wall that surrounds the first exterior wall and the interior porous wall and that defines an interior space between the second exterior wall and the first exterior wall; at least one waste gas inlet in fluid communication with the central chamber and adapted to introduce a gaseous waste stream to the central chamber; at least one fuel inlet in fluid communication with the central chamber and adapted to introduce fuel to the central chamber; a thermal mechanism positioned within the central chamber and adapted to decompose the gaseous waste stream within the central chamber, thereby forming reaction products; and a fluid delivery system adapted to provide a fluid to the central chamber through the interior porous wall at a sufficient force to reduce deposition of reaction products on an inner surface of the interior porous wall of the central chamber; and a lower reaction chamber coupled to the upper reaction chamber and having; a gas flow chamber in fluid communication with the central chamber, the gas flow chamber having an inlet and outlet for passing the gaseous waste stream and reaction products through the gas flow chamber; a water delivery system adapted to generate a flowing liquid film on an interior surface of the gas flow chamber so as to reduce deposition and accumulation of particulate solids on the interior surface of the gas flow chamber; and a shield configured to be positioned between the quench unit and the interior porous wall and adapted to prevent water wetting a bottommost porous section of the plurality of stacked porous sections, the shield including an air knife inlet, wherein the air knife inlet injects an air knife to remove deposited material from the interior porous wall. - View Dependent Claims (19, 20, 21, 22)
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23. A replacement part for use in an abatement system comprising:
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a shield including an air knife inlet, the shield configured to; be positioned between a quench unit and a porous wall that defines a central chamber of a thermal reactor for use during decomposition of gaseous waste from a semiconductor manufacturing process; and prevent the porous wall of the central chamber from getting wet during operation of the quench unit, and wherein the air knife inlet injects an air knife into the central chamber to remove deposited material from the interior porous wall. - View Dependent Claims (24, 25, 26, 27)
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Specification