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Substrate processing method and storage medium

  • US 7,985,699 B2
  • Filed: 03/21/2007
  • Issued: 07/26/2011
  • Est. Priority Date: 03/22/2006
  • Status: Expired due to Fees
First Claim
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1. A substrate processing method for a substrate processing system having at least an etching apparatus that carries out plasma etching processing on a substrate, the etching apparatus having therein an electrostatic chuck that electrostatically attracts the substrate and is adapted to contact a rear surface of the substrate, the method comprising:

  • a first coating step of coating a rear surface of the substrate with curable resins;

    a curable resin curing step of curing the coated curable resins so as to form a resin protective film;

    an inverting step of inverting the substrate while holding a periphery of the substrate;

    a second coating step of coating a front surface of the substrate with resistant resins;

    a resistant resin curing step of curing the coated resistant resins;

    a resistant resin light exposure step of subjecting the cured resistant resins to light exposure processing;

    an etching step of carrying out the plasma etching processing on the front surface of the substrate; and

    a washing step of removing the cured curable resins and the coated resistant resins, whereinin said resistant resin light exposure step, the rear surface of the substrate is supported by pin-like projections such that the resin protective film is present between the rear surface of the substrate and the projections.

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