Inductor

• US 7,986,211 B2
• Filed: 12/14/2010
• Issued: 07/26/2011
• Est. Priority Date: 12/15/2009
• Status: Expired due to Fees

• Current Assignee: Electronics and Telecommunications Research Institute
• Original Assignee: Electronics and Telecommunications Research Institute
• Inventors: Kim, Seong-il, Nam, Eun Soo, Lee, Jongmin, Kim, Hae Cheon, Yoon, Hyung Sup, Min, Byoung-Gue
• Primary Examiner(s): NGUYEN, TUYEN T
• Application Number:
  US12/968,022
• Publication Number:
  US 20110140825A1
• Time in Patent Office: 224 Days
• Field of Search: 336/65, 336/200, 336/232, 257/531
• US Class Current: 336/200
• CPC Class Codes: H01F 17/0006 Printed inductances printed coils for dynamo-electric machines H02K3/26; printed circuits H05K
• CPC Class Codes: H01F 2017/0086 on semiconductor substrate inductors for integrated circuits H01L28/10
• CPC Class Codes: H01L 28/10 Inductors

Abstract

Provided is an inductor. The inductor includes a first to a fourth conductive terminals formed in one direction within a semiconductor substrate, a first conductive line formed on one side of the semiconductor substrate and electrically connected to the second and third conductive terminals interiorly positioned among the first to fourth conductive terminals, a second conductive line formed on the one side of the semiconductor substrate and electrically connected to the first and fourth conductive terminals exteriorly positioned among the first to fourth conductive terminals, and a third conductive line formed on the other side of the semiconductor substrate and electrically connected to the first and third conductive terminals among the first to fourth conductive terminals.

Claims

1. An inductor, comprising:

a first to a fourth conductive pillars formed in one direction within a semiconductor substrate;

a first conductive line formed on one side of the semiconductor substrate and electrically connected to the second and third conductive pillars interiorly positioned among the first to fourth conductive pillars;

a second conductive line formed on the one side of the semiconductor substrate and electrically connected to the first and fourth conductive pillars exteriorly positioned among the first to fourth conductive pillars; and

a third conductive line formed on the other side of the semiconductor substrate and electrically connected to the first and third conductive pillars among the first to fourth conductive pillars.

2. The inductor of claim 1, wherein a length of the first conductive line is shorter than that of the second conductive line.

3. The inductor of claim 2, wherein each of the first conductive line and the second conductive line is implemented as a curve form.

4. The inductor of claim 1, further comprising a first and a second conductive terminals formed on the other side of the semiconductor substrate and electrically connected to the second and fourth conducive pillars respectively.

5. The inductor of claim 1, further comprising:

an insulating layer on the other side of the semiconductor substrate; and

a first and a second conductive layers formed on the insulating layer and electrically connected to the second and fourth conducive pillars respectively.

6. The inductor of claim 5, wherein the second and fourth conductive pillars penetrate the insulating layer.

7. The inductor of claim 1, further comprising:

a fifth to an eighth conductive pillars in the one direction within the semiconductor substrate;

a fourth conductive line formed on the one side of the semiconductor substrate and electrically connected to the sixth and seventh conductive pillars interiorly positioned among the fifth to eighth conductive pillars;

a fifth conductive line formed on the one side of the semiconductor substrate and electrically connected to the fifth and eighth conductive pillars exteriorly positioned among the fifth to eighth conductive pillars; and

a sixth conductive line formed on the other side of the semiconductor substrate and electrically connected to the first and third conductive pillars among the fifth to eighth conductive pillars.

8. The inductor of claim 7, further comprising a connection conductive line formed on the other side of the semiconductor substrate and electrically connected to the second and sixth conductive pillars.

9. The inductor of claim 8, further comprising an insulating layer on the other side of the semiconductor substrate, wherein the second and sixth conductive pillars penetrate the insulating layer and the connection conductive line is electrically connected to the second and sixth conductive pillars penetrating the insulating layer.

10. An inductor, comprising:

a plurality of conductive pillars penetrating a semiconductor substrate; and

a plurality of conductive lines forming a coil structure by connecting the plurality of conductive pillars,

wherein the plurality of conductive pillars comprising

a first conductive line formed on one side of the semiconductor substrate electrically connecting the second and third conductive pillars among the plurality of conductive pillars; and

a second conductive line formed on the one side of the semiconductor substrate electrically connecting the first and fourth conductive pillars among the plurality of conductive pillars,

wherein a length of the first conductive line is different from that of the second conductive line.

11. The inductor of claim 10, wherein the first to fourth conductive pillars are formed in one direction, and the second and third conductive pillars connected to the first conductive line are positioned at an inner side of the first and fourth conductive pillars connected to the second conductive line.

12. The inductor of claim 11, wherein the length of the first conductive line is shorter than that of the second conductive line.

13. The inductor of claim 12, wherein each of the first conductive line and the second conductive line is implemented as a curve form.

14. The inductor of claim 10, further comprising a third conductive line formed on the other side of the semiconductor substrate and electrically connected to one of the second and third conductive pillars connected to the first conductive line and to one of the first and fourth conductive pillars connected to the second conductive line.

15. The inductor of claim 14, further comprising:

a first conductive terminal formed on the other side of the semiconductor substrate and electrically connected to the other of the second and third conductive pillars connected to the first conductive line; and

a second conductive terminal formed on the other side of the semiconductor substrate and electrically connected to the other of the first and fourth conductive pillars connected to the second conductive line.

16. The inductor of claim 10, wherein the plurality of conductive lines further comprises:

a third conductive line formed on the one side of the semiconductor substrate electrically connecting the sixth and seven conductive pillars among the plurality of conducive pillars; and

a fourth conductive line formed on the one side of the semiconductor substrate electrically connecting the fifth and eighth conductive pillars among the plurality of conducive pillars.

17. The inductor of claim 16, wherein the fifth to eighth conducive pillars are formed in one direction, and the sixth and seven conductive pillars connected to the third conductive line are positioned at an inner side of the fifth and eighth conductive pillars connected to the fourth conductive line.

18. The inductor of claim 17, wherein the fifth to eighth conductive pillars are parallel to the first to fourth conductive pillars.

19. The inductor of claim 16, further comprising a connection conductive line formed on the other side of the semiconductor substrate electrically connecting one of the first to fourth conductive pillars to one of the fifth to eighth conductive pillars.

20. The inductor of claim 19, further comprising an insulating layer on the other side of the semiconductor substrate, wherein the one of the first to fourth conductive pillars and the one of the fifth to eighth conductive pillars penetrate the insulating layer.