Power system module and method of fabricating the same

• US 7,986,531 B2
• Filed: 03/11/2010
• Issued: 07/26/2011
• Est. Priority Date: 04/20/2006
• Status: Active Grant

• Current Assignee: Semiconductor Components Industries LLC (ON Semiconductor Corporation)
• Original Assignee: Fairchild Korea Semiconductor Limited (ON Semiconductor Corporation)
• Inventors: Paek, Seung-han, Park, Sung-min, Lee, Keun-hyuk, Lim, Seung-won
• Primary Examiner(s): Bui; Hung S
• Application Number:
  US12/722,153
• Publication Number:
  US 20100165576A1
• Time in Patent Office: 502 Days
• Field of Search: 361/600, 361/715, 361752-753, 361/790, 361/797, 361/800, 361/807, 361/810, 361/748, 361/760, 361/772, 361/773, 361728-730, 174/138.E, 174/138.G
• US Class Current: 361/752
• CPC Class Codes: H01L 25/165 Containers
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H02M 7/003 Constructional details, e.g. physical layout, assembly, wiring or busbar connections
• CPC Class Codes: H05K 7/1432 specially adapted for power drive units or power converters
• CPC Class Codes: H05K 7/14322 wherein the control and power circuits of a power converter are arranged within the same casing
• CPC Class Codes: Y10T 29/49002 Electrical device making

Abstract

Provided are a power system module allowing a user'"'"'s requirements to be easily met, and having economic practicality and high integration, and a manufacturing method thereof. The power system module includes a plastic case, a molding type power module package, a control circuit board, and at least one external terminal. The plastic case defines a bottom and a side wall. The molding type power module package is fixed to the bottom of the plastic case and includes at least a power device therein. The control circuit board is fixed to the side wall of the plastic case, includes at least a control device mounted thereon which is electrically connected to the power module package. The external terminal protrudes to outside the plastic case and is electrically connected to the control circuit board.

Claims

1. A power system module comprising:

a plastic case having a first region and a second region;

a molded power module package fixed in the first region of the plastic case, the molded power module package including at least a power device and at least one lead electrically connected to the power device;

a control circuit board fixed in the second region of the plastic case, the control circuit board including at least one first hole, at least one second hole, and at least a control device mounted thereon;

at least one external terminal protruding outside the plastic case, the external terminal passing through the first hole; and

the plastic case further comprising a fixing member outside the molded power module package and fixed to the external terminal,

wherein the lead is positioned to pass through the second hole.

2. The power system module of claim 1, wherein the external terminal is fixed to the plastic case through a coupling inside the fixing member.

3. The power system module of claim 1, wherein the second hole is positioned between the first hole and a center of the control circuit board.

4. The power system module of claim 1, wherein the lead is positioned within the plastic case.

5. The power system module of claim 1, wherein a height of the external terminal is greater than a height of the lead.

6. The power system module of claim 1, wherein the lead and the external terminal are electrically connected to the control circuit board by conductive solder.

7. The power system module of claim 1, wherein the plastic case comprises a floor and a sidewall, where the first region is defined by the floor and the second region is defined by the sidewall.

8. The power system module of claim 7, wherein the floor of the plastic case comprises a through hole exposing at least a portion of the first region to the outside.

9. The power system module of claim 8, wherein the power module package further comprises a heat sink passing through the through hole of the plastic case and being exposed to the outside.

10. The power system module of claim 7, wherein the sidewall of the plastic case comprises a groove into which the control circuit board is fixed.

11. The power system module of claim 1, wherein the power module package further comprises a passive device, and the control circuit board further comprises another active device or a passive device mounted thereon.

12. The power system module of the claim 1, wherein the external terminal is in direct contact with the plastic case.

13. The power system module of the claim 1, wherein the fixing member is in direct contact with the external terminal.

14. The power system module of the claim 1, wherein the fixing member is in direct contact with the control circuit board.

15. A power system module comprising:

a plastic case having a first and second region;

a molded power module package fixed in the first region of the plastic case, the molded power module package including at least a power device and at least one lead electrically connected to the power device;

a control circuit board fixed in the second region of the plastic case, the control circuit board including at least one first hole, at least one second hole, and at least a control device mounted thereon; and

at least one external terminal protruding outside the plastic case, the external terminal passing through the first hole,

wherein the lead is positioned to pass through the second hole,

wherein the second hole is positioned between the first hole and a center of the control circuit board.

16. A power system module comprising:

a plastic case having a base, a wall around the periphery of the base, a first region and a second region;

a molded power module package fixed in the first region of the plastic case, the molded power module package including at least a power device and at least one lead electrically connected to the power device;

a control circuit board fixed in the second region of the plastic case, the control circuit board including at least one first hole, at least one second hole, and at least a control device mounted thereon;

at least one fixing member for supporting an external lead, said fixing member disposed on the base and spaced from the molded power module; and

at least one external terminal supported by the fixing member and protruding outside the plastic case, the external terminal passing through the first hole,

wherein the lead is positioned to pass through the second hole, and

wherein an upper portion of the external terminal is at a height greater than an upper portion of the lead.

17. The power system module of the claim 16, wherein the fixing member is disposed between the control circuit board and the plastic case.