Method of lifting off and fabricating array substrate for liquid crystal display device using the same
First Claim
1. A method of lifting off, comprising:
- forming a first material layer on a substrate;
forming a photoresist pattern including first and second holes and on the first material layer;
patterning the first material layer by using the photoresist pattern as a patterning mask to form a material pattern having first and second grooves within the material pattern, the first and second grooves corresponding to the first and second holes, respectively;
forming a second material layer on an entire surface of the substrate including the photoresist pattern and the first and second grooves; and
removing the photoresist pattern and the second material layer on the photoresist pattern at the same time,wherein a portion of the material pattern between the first and second grooves and portions of the material pattern at sides of the first and second grooves constitute a conductive line as a whole.
1 Assignment
0 Petitions
Accused Products
Abstract
A method of lifting off includes forming a first material layer on a substrate; forming a photoresist pattern including first and second holes and on the first material layer; patterning the first material layer using the photoresist pattern as a patterning mask to form a material pattern having first and second grooves within the material pattern, the first and second grooves corresponding to the first and second holes, respectively; forming a second material layer on an entire surface of the substrate including the photoresist pattern and the first and second grooves; and removing the photoresist pattern and the second material layer on the photoresist pattern at the same time, wherein a portion of the material pattern between the first and second grooves and portions of the material pattern at sides of the first and second grooves constitute a line as a whole.
-
Citations
5 Claims
-
1. A method of lifting off, comprising:
-
forming a first material layer on a substrate; forming a photoresist pattern including first and second holes and on the first material layer; patterning the first material layer by using the photoresist pattern as a patterning mask to form a material pattern having first and second grooves within the material pattern, the first and second grooves corresponding to the first and second holes, respectively; forming a second material layer on an entire surface of the substrate including the photoresist pattern and the first and second grooves; and removing the photoresist pattern and the second material layer on the photoresist pattern at the same time, wherein a portion of the material pattern between the first and second grooves and portions of the material pattern at sides of the first and second grooves constitute a conductive line as a whole. - View Dependent Claims (2, 3, 4, 5)
-
Specification