Differential etch rate control of layers deposited by chemical vapor deposition
First Claim
1. A method for processing a substrate, comprising:
- depositing a first silicon-containing material layer having a first etch rate on the substrate surface from a silicon-containing precursor and a nitrogen-containing precursor, the nitrogen-containing precursor introduced into a processing chamber at a first flow rate;
depositing a second silicon-containing material layer having a second etch rate different than the first etch rate on the first silicon-containing material layer from the silicon-containing precursor and the nitrogen-containing precursor, the nitrogen-containing precursor having a second flow rate different than the first flow rate;
etching the first silicon-containing material layer and the second silicon-containing material layer; and
forming a taper etch profile in the first silicon-containing material layer and the second silicon-containing material layer.
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Accused Products
Abstract
A method and apparatus is provided for controlling the etch profile of a multilayer layer stack by depositing a first and second material layer with differential etch rates in the same or different processing chamber. In one embodiment of the invention, a process for etching substrate material is provided including depositing a first silicon-containing material layer having a first etch rate on the substrate surface from a nitrogen-containing precursor at a first flow rate and a silicon-containing precursor, depositing a second silicon-containing material layer having a second etch rate different than the first etch rate on the first silicon-containing material layer from the nitrogen-containing precursor at a second flow rate different than the first flow rate and the silicon-containing precursor, etching the first silicon-containing material layer and the second silicon-containing material layer, and forming a taper etch profile in the first silicon-containing material layer and the second silicon-containing material layer.
25 Citations
25 Claims
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1. A method for processing a substrate, comprising:
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depositing a first silicon-containing material layer having a first etch rate on the substrate surface from a silicon-containing precursor and a nitrogen-containing precursor, the nitrogen-containing precursor introduced into a processing chamber at a first flow rate; depositing a second silicon-containing material layer having a second etch rate different than the first etch rate on the first silicon-containing material layer from the silicon-containing precursor and the nitrogen-containing precursor, the nitrogen-containing precursor having a second flow rate different than the first flow rate; etching the first silicon-containing material layer and the second silicon-containing material layer; and forming a taper etch profile in the first silicon-containing material layer and the second silicon-containing material layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17)
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18. A method for processing a substrate, comprising:
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depositing a first silicon-containing material layer having a first etch rate on the substrate surface from a silicon-containing precursor and a nitrogen-containing precursor, the nitrogen-containing precursor introduced into a processing chamber at a first flow rate; adjusting the flow rate of the of the nitrogen-containing precursor to a second flow rate different than the first flow rate; depositing in situ a second silicon-containing material layer having a second etch rate different than the first etch rate; etching the first silicon-containing material layer and the second silicon-containing material layer; and forming an etch profile in the first silicon-containing material layer and the second silicon-containing material layer, the etch profile forming an etch angle less than 90°
with the substrate surface from the etched sidewalls of the first silicon-containing material layer to the etched sidewalls of the second silicon-containing material layer. - View Dependent Claims (19, 20, 21, 22)
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23. A method for processing a substrate, comprising:
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depositing a first silicon-containing material layer having a first etch rate on the substrate surface from a first nitrogen-containing precursor and a silicon-containing precursor; depositing a second silicon-containing material layer having a second etch rate different than the first etch rate on the first silicon-containing material layer from a second nitrogen-containing precursor and the silicon-containing precursor; etching the first silicon-containing material layer and the second silicon-containing material layer; and forming an etch profile in the first silicon-containing material layer and the second silicon-containing material layer, the etch profile forming an etch angle less than 90°
with the substrate surface from the etched sidewalls of the first silicon-containing material layer to the etched sidewalls of the second silicon-containing material layer. - View Dependent Claims (24, 25)
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Specification