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Method of manufacturing semiconductor chip and semiconductor module

  • US 7,989,227 B2
  • Filed: 06/05/2009
  • Issued: 08/02/2011
  • Est. Priority Date: 09/23/2008
  • Status: Active Grant
First Claim
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1. A method of manufacturing a semiconductor chip, comprising:

  • a comparison step that calculates, based on an equation of an FOM (figure of merit) of a semiconductor chip defined as a product of a term represented by electrical performance of a substrate and a term represented by a manufacturing cost of a semiconductor chip, FOMs of semiconductor chips on substrates of different type, to thereby compare magnitudes of calculation results;

    a selection step that selects a desired substrate from the substrates of different type, based on the magnitudes of the calculation results through the comparison step; and

    an element formation step that forms a semiconductor element on the desired substrate selected in the selection step.

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