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Tactile surface inspection during device fabrication or assembly

  • US 7,989,229 B2
  • Filed: 09/10/2007
  • Issued: 08/02/2011
  • Est. Priority Date: 09/10/2007
  • Status: Expired due to Fees
First Claim
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1. A process for inspecting planarity and/or periodicity of an interconnect array surface, comprising:

  • contacting the interconnect array surface with a tactile sensor;

    forming a topographical image of the array surface, wherein forming the topographical image comprises capturing light intensity variations generated by the tactile sensor across the interconnect array surface, wherein the light intensity variations are a function of compressive localized stress, and wherein the light intensity variations are linearly proportional to the local stress; and

    inspecting planarity and/or periodicity of the interconnect array surface.

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  • 6 Assignments
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