Membrane grating for beam steering device and method of fabricating same

• US 7,989,250 B2
• Filed: 04/03/2008
• Issued: 08/02/2011
• Est. Priority Date: 04/06/2007
• Status: Expired due to Fees

• Current Assignee: Rosemount Aerospace, Inc. (Raytheon Technologies Corporation d/b/a RTX)
• Original Assignee: Rosemount Aerospace, Inc. (Raytheon Technologies Corporation d/b/a RTX)
• Inventors: Nesnidal, Michael Paul
• Primary Examiner(s): Lebentritt; Michael
• Assistant Examiner(s): KUSUMAKAR, KAREN M
• Application Number:
  US12/062,205
• Publication Number:
  US 20080247043A1
• Time in Patent Office: 1,216 Days
• Field of Search: 438 57- 98, 359577-590, 216 24- 26, 257 79-103
• US Class Current: 438/56
• CPC Class Codes: G02B 26/0808 by means of one or more diffracting elements
• CPC Class Codes: G02B 27/0087 Phased arrays
• CPC Class Codes: G02B 27/4277 being separated by an air space
• CPC Class Codes: G02B 5/1857 using exposure or etching means, e.g. holography, photolithography, exposure to electron or ion beams
• CPC Class Codes: G02B 5/1871 Transmissive phase gratings

Abstract

A method of fabricating a membrane structure for a diffractive phased array assembly is provided. The method includes the steps of providing a wafer having a body and at least a membrane layer and a backside layer disposed on opposite faces of the body, forming a grating pattern on a surface of the membrane layer, and forming a window through the wafer to expose a back surface of the membrane, thereby allowing light to pass through the membrane.

Claims

1. A method of fabricating a membrane structure for a diffractive phased array assembly, comprising the steps of:

a) providing a wafer having a body and at least a membrane layer and a backside layer disposed on opposite faces of the body, and an etch-stop layer underlying the membrane layer;

b) forming a grating pattern in the surface of the membrane layer adjacent the wafer body;

c) forming a window through the wafer to expose a back surface of the membrane, thereby allowing light to pass through the membrane;

d) etching through the wafer and etching through the etch-stop layer to the membrane layer to form the window; and

e) mounting the membrane structure in a protective fixture prior to the step of etching through the etch stop layer, in order to protect the membrane layer.

2. A method of fabricating a membrane structure according to claim 1, wherein the step of forming a window through the backside layer and wafer body is performed through a photolithographic technique, and includes:

a) applying a photoresist layer on the face of the backside layer;

b) exposing the photoresist in a pattern to define the window;

c) removing the photoresist in regions where etching is to occur;

d) etching through at least the backside layer to partially form the window.

3. A method of fabricating a membrane structure according to claim 2, wherein the photoresist layer has a thickness of about 7 μ

m.

4. A method of fabricating a membrane structure according to claim 2, wherein the wafer body is first etched to a predetermined depth with a first etching technique, and subsequently etched with a second etching technique to complete the etch of the wafer body.

5. A method of fabricating a membrane structure according to claim 4, wherein the first etching technique is deep reactive ion etching, and the second etching technique is a chemical etch using tetramethylammonium hydroxide.

6. A method of fabricating a membrane structure according to claim 4, wherein the predetermined depth is about 100 μ

m.

7. A method of fabricating a membrane structure according to claim 2, wherein the thickness of the membrane layer is between about 10 and 75 μ

m.

8. The method of fabricating a membrane structure according to claim 1, wherein the etch stop layer is removed with a buffered oxide etch.

9. A method of fabricating a membrane structure according to claim 1, wherein the materials of the wafer body, backside layer, the etch stop layer, and the membrane layer are selected so that when a window is formed through the wafer up to the membrane layer, the materials therein exhibit hoop stresses sufficient to provide tension to the membrane layer, to maintain the membrane layer substantially flat.

10. A method of fabricating a membrane structure according to claim 1, wherein the wafer body is formed of silicon, the backside layer is formed of silicon nitride, the etch stop layer is formed of silicon dioxide, and the membrane layer is formed of silicon.

11. A method of fabricating a membrane structure according to claim 1, further comprising the step of confirming that the flatness of the membrane structure is within allowable limits.

12. A method of fabricating a membrane structure for a diffractive phased array assembly, comprising the steps of:

a) providing a wafer having a body and at least a membrane layer and a backside layer disposed on opposite faces of the body;

b) forming a grating pattern in the surface of the membrane layer adjacent the wafer body;

c) forming a window through the wafer to expose a back surface of the membrane, thereby allowing light to pass through the membrane; and

d) confirming that the flatness of the membrane structure is within allowable limits.

13. A method of fabricating a membrane structure according to claim 12, wherein the step of forming a window through the backside layer and wafer body is performed through a photolithographic technique, and includes:

a) applying a photoresist layer on the face of the backside layer;

b) exposing the photoresist in a pattern to define the window;

c) removing the photoresist in regions where etching is to occur;

d) etching through at least the backside layer to partially form the window.

14. A method of fabricating a membrane structure according to claim 13, wherein the photoresist layer has a thickness of about 7 μ

m.

15. A method of fabricating a membrane structure according to claim 13, wherein the wafer body is first etched to a predetermined depth with a first etching technique, and subsequently etched with a second etching technique to complete the etch of the wafer body.

16. A method of fabricating a membrane structure for a diffractive phased array assembly, comprising the steps of:

a) providing a wafer having a body and at least a membrane layer and a backside layer disposed on opposite faces of the body;

b) forming a grating pattern in the surface of the membrane layer adjacent the wafer body; and

c) forming a window through the wafer to expose a back surface of the membrane, thereby allowing light to pass through the membrane; and

d) baking the membrane structure for a length of time at a temperature and humidity sufficient to promote native oxide growth on the membrane.

17. A method of fabricating a membrane structure according to claim 16, wherein the step of forming a window through the backside layer and wafer body is performed through a photolithographic technique, and includes:

a) applying a photoresist layer on the face of the backside layer;

b) exposing the photoresist in a pattern to define the window;

c) removing the photoresist in regions where etching is to occur;

d) etching through at least the backside layer to partially form the window.

18. A method of fabricating a membrane structure according to claim 17, wherein the photoresist layer has a thickness of about 7 μ

m.

19. A method of fabricating a membrane structure according to claim 17, wherein the wafer body is first etched to a predetermined depth with a first etching technique, and subsequently etched with a second etching technique to complete the etch of the wafer body.