Method and apparatus for creating RFID devices

• US 7,989,313 B2
• Filed: 04/16/2008
• Issued: 08/02/2011
• Est. Priority Date: 05/04/2005
• Status: Active Grant

• Current Assignee: Avery Dennison Corporation
• Original Assignee: Avery Dennison Corporation
• Inventors: Kian, Kouroche, Tanabe, Akiko, Akhave, Jay, Edwards, Dave N., Licon, Mark, Mehrabi, Ali, Wang, Haochuan
• Primary Examiner(s): Thai; Luan C
• Application Number:
  US12/104,156
• Publication Number:
  US 20080194059A1
• Time in Patent Office: 1,203 Days
• Field of Search: 438/458, 438/460, 438/462, 438/464, 438/128, 257/620, 257/E21.596, 257/E21.599
• US Class Current: 438/458
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: H01L 21/50 Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
• CPC Class Codes: H01L 21/6835 using temporarily an auxiliary support
• CPC Class Codes: H01L 21/6836 Wafer tapes, e.g. grinding or dicing support tapes adhesive tapes in general C09J7/20
• CPC Class Codes: H01L 2221/68327 used during dicing or grinding
• CPC Class Codes: H01L 2221/68336 involving stretching of the auxiliary support post dicing
• CPC Class Codes: H01L 2221/68354 used to support diced chips prior to mounting
• CPC Class Codes: H01L 2224/0401 Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 2224/83192 wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00011 Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/07811 Extrinsic, i.e. with electrical conductive fillers

Abstract

A process is disclosed for creating semiconductor devices such as RFID assemblies wherein an array of dies mounted to a substrate is spaced apart at a first pitch, and the substrate is removed after the positions of the dies in the array is fixed by a solidifiable substance. The solidifiable substance is then removed without changing the relative positions of the dies in the array. All or a selected portion of the array of dies is then electrically attached to a plurality of straps or interposers arranged in a corresponding array. The spacing, or pitch, between the dies in the die array may be changed before or after the substrate is removed to match the pitch of the straps or interposers in the corresponding array. An RFID device created using the process inventive is also disclosed.

Claims

1. A method for transferring a plurality of semiconductor dies from a first substrate, the method comprising:

filling an interstitial space between the plurality of dies arranged on the first substrate in an array having a first dimension with a solidifiable substance;

solidifying the substance such that a respective position of each of the dies in the array is fixed;

removing the first substrate from the plurality of dies;

removing the solidified substance from between the plurality of dies such that the plurality of dies remain arrayed at the first dimension;

providing, where each die in the array of dies includes at least one contact and each die in the array of dies is set off from another die by a first pitch as measured between the respective contacts of each die, a plurality of electrical components arranged in an array on a second substrate, the plurality of electrical components having attachment locations disposed at the first pitch;

registering the second substrate with the array of dies such that respective attachment locations of the plurality of electrical components are matched with the respective at least one contact of the dies; and

,

electrically coupling respective ones of the plurality of electrical components to respective, corresponding ones of the dies in the array of dies.

2. The method of claim 1, further comprising after removing the solidified substance:

providing a grid containing an array of apertures;

placing the grid over the dies such that the grid is disposed parallel to the array of dies and each of the dies is disposed in a respective one of the apertures in the array of apertures; and

displacing the grid by a selected amount in at least a first direction and parallel to a support surface on which the array of dies rests.

3. The method of claim 2, further comprising displacing the grid by a second selected amount in a second direction orthogonal to the first direction.

4. The method of claim 1, further comprising:

providing a comb comprising a plurality of teeth;

placing the comb over a first line of dies in the plurality of dies such that at least one of the dies in the first line of dies is disposed in one of a plurality of slots, each slot being defined by a pair of teeth in the plurality of teeth; and

,

displacing the comb by a selected amount in at least a first direction and parallel to a plane defined by the array of dies.

5. The method of claim 4, further comprising displacing the comb by a second selected amount in a second direction orthogonal to the first direction.

6. The method of claim 4, further comprising:

disengaging the comb from the line of dies;

rotating the comb by a predetermined amount while maintaining the plurality of slots parallel to the plane; and

,

placing the comb over a second line of dies of the plurality of dies such that each of the dies in the second line of dies is disposed in a respective one of the plurality of slots, the second line of dies being perpendicular to the first line of dies.

7. The method of claim 1, wherein each die in the plurality of dies has a size, further comprising:

providing a planar material with an array of apertures, wherein each aperture comprises;

1) a first opening located on a first surface of the planar material, the first opening being larger than the size of each die in the plurality of dies, and

2) a second opening located on a second surface of the planar material, the second opening being smaller than the first opening but no larger than the size of the dies; and

placing the planar material in contact with the plurality of dies such that the planar material is parallel to a plane defined by the array of dies and each of the dies is disposed in a respective one of the first openings of the array of apertures and held in place by corresponding one of the second openings.

8. A method for creating an arrangement of integrated circuits comprising:

providing a wafer with an array of dies, each containing an integrated circuit, disposed on a substrate, the array of dies having a first dimensional size;

stretching the substrate so that the array of dies reaches a second dimensional size;

fixing the array of dies at the second dimensional size with a solid material before removal of the substrate; and

removing the solid material by a gasification process, wherein the array of dies remains at the second dimensional size after the removal of the solid material.

9. The method of claim 8, wherein fixing the array of dies with the solid material comprises:

introducing a solidifiable substance between the dies; and

changing the solidifiable substance into a solid.

10. The method of claim 9, wherein the solidifiable substance is a liquid.

11. The method of claim 8, wherein removing the solid material by a gasification process comprises sublimating the solid material.

12. A method for making an RFID assembly comprising:

providing a wafer comprising an array of dies, the array of dies having a length and a width;

attaching a substrate to the array of dies;

stretching the substrate such that at least one of the length and width of the array of dies is increased from a first dimension to a selected second dimension and each die in the array is spaced apart from adjacent ones of the dies by a selected pitch;

fixing the array of dies at the second selected dimension and die pitch;

introducing a liquid into the separation between each die;

solidifying the liquid into a solid;

removing the substrate; and

converting the solid into a gas.

13. The method of claim 12, wherein the liquid comprises water, and solidifying the liquid into the solid comprises freezing the water.

14. The method of claim 13, further comprising sublimating the frozen liquid and leaving the array of dies at the second dimensional size.

15. The method of claim 12, wherein the liquid comprises a polymer, and solidifying the liquid into the solid comprises reacting the polymer.