System for heat treatment of semiconductor device

• US 7,989,736 B2
• Filed: 11/13/2006
• Issued: 08/02/2011
• Est. Priority Date: 05/12/2004
• Status: Expired due to Fees

• Current Assignee: Viatron Technologies, Inc.
• Original Assignee: Viatron Technologies, Inc.
• Inventors: Kim, Jung Bae, Ahn, Young Jae, Kim, Hyoung June, Shin, Dong Hoon, Park, Wang Jun
• Primary Examiner(s): PELHAM, JOSEPH MOORE
• Application Number:
  US11/598,447
• Publication Number:
  US 20070122936A1
• Time in Patent Office: 1,723 Days
• Field of Search: None
• US Class Current: 219/388
• CPC Class Codes: H01L 21/67109 mainly by convection
• CPC Class Codes: H01L 21/67115 mainly by radiation
• CPC Class Codes: H01L 21/67173 in-line arrangement
• CPC Class Codes: H01L 21/67207 comprising a chamber adapted to a particular process
• CPC Class Codes: H01L 21/67236 the substrates being processed being not semiconductor wafers, e.g. leadframes or chips

Abstract

Disclosed is a heat treatment system for semiconductor devices. The heat treatment system is used in a heat treatment process for semiconductor devices, such as a crystallization process for an amorphous silicon thin film or a dopant activation process for a poly-crystalline silicon thin film formed on a surface of a glass substrate of a flat display panel including a liquid crystal display (LCD) or an organic light emitting device (OLED). The heat treatment system transfers a semiconductor device after uniformly preheating the semiconductor device in order to prevent deformation of the semiconductor device during the heat treatment process, rapidly performs the heat treatment process under the high temperature condition by heating the semiconductor device using a lamp heater and induction heat derived from induced electromotive force, and unloads the semiconductor device after uniformly cooling the semiconductor device such that the semiconductor device is prevented from being deformed when the heat treatment process has been finished. The heat treatment system rapidly performs the heat treatment process while preventing deformation of the semiconductor device by gradually heating or cooling the semiconductor device.

Claims

1. A heat treatment system for a semiconductor device, the heat treatment system comprising:

a loading unit for conveying the semiconductor device and a support plate, on which the semiconductor device is rested, after preheating the semiconductor device and the support plate at a predetermined preheating temperature, wherein the loading unit includes a susceptor, which has at an upper center portion thereof insulative slots and on which the support plate is placed, a heating device for heating the susceptor, a lifting device for moving the susceptor up and down, and a horizontal conveyance device for horizontally moving the support plate;

a heating unit including at least two furnaces, the temperatures of which are individually controlled and increased step by step up to a predetermined heat treatment temperature for the semiconductor device, wherein the semiconductor device is adapted to be conveyed to the heating unit from the loading unit and heated at the predetermined heat treatment temperature by the heating unit;

a cooling unit including at least two furnaces, the temperatures of which are individually controlled and decreased step by step and between the predetermined heat treatment temperature and a predetermined cooling temperature, wherein the semiconductor device is adapted to be conveyed to the cooling unit from the heating unit and cooled at the predetermined cooling temperature by the cooling unit; and

an unloading unit for discharging the semiconductor device, after uniformly cooling the semiconductor device at a predetermined unloading temperature.

2. The heat treatment system as claimed in claim 1, further comprising a processing unit installed adjacent to the heating unit in order to heat the semiconductor device at a predetermined heat treatment temperature by using heat generated from a lamp heater and induction heat derived from induced electromotive force.

3. The heat treatment system as claimed in claim 1, wherein the susceptor is made from a material selected from the group consisting of aluminum, aluminum alloys, graphite, aluminum oxide, aluminum nitride, and boron nitride.

4. The heat treatment system as claimed in claim 1, wherein the susceptor has an area larger than an area of the support plate.

5. The heat treatment system as claimed in claim 1, wherein the insulative slots have an area corresponding to 20 to 70% of the area of the support plate rested on an upper surface of the susceptor.

6. The heat treatment system as claimed in claim 1, wherein a plurality of insulative slots are provided in form of trenches.

7. The heat treatment system as claimed in claim 6, wherein the width of each of the trenches is identical to or smaller than an interval between the trenches.

8. The heat treatment system as claimed in claim 6, wherein the width of a center portion of each of the trenches is larger than widths of both side ends of the trenches.

9. The heat treatment system as claimed in claim 1, wherein the insulative slots have polygonal sectional shapes.

10. The heat treatment system as claimed in claim 1, wherein the heating device is accommodated in the susceptor or positioned at a lower portion of the susceptor.

11. The heat treatment system as claimed in claim 1, wherein the heating device includes a resistance heater or a lamp heater.

12. The heat treatment system as claimed in claim 1, wherein the lifting device includes a pneumatic cylinder, a ball screw unit or a timing belt installed at a lower portion of the susceptor.

13. The heat treatment system as claimed in claim 1, wherein the horizontal conveyance device includes a roller and a motor for rotating the roller, the roller being accommodated in a roller recess formed at an upper surface of the susceptor with a predetermined length in order to convey the support plate making contact with an upper portion of the roller.

14. The heat treatment system as claimed in claim 2, wherein the processing unit includes an inner housing forming a heat treatment space for the semiconductor device, a lamp heater having a plurality of lamps installed at an inner upper portion or an inner lower portion of the inner housing, a first heat body having a single plate shape or consisting of a plurality of blocks and being installed in an area formed between the inner housing and the lamp heater, a magnetic core having a block shape and being installed at an outside of the inner housing corresponding to upper and lower portions of the inner housing, and an induction coil wound around the magnetic core.

15. The heat treatment system as claimed in claim 14, wherein the processing unit further includes a second heat body aligned in the inner housing in opposition to the first heat body about the semiconductor device.

16. The heat treatment system as claimed in claim 14, wherein the processing unit further includes a roller installed at a lower portion of the inner housing in order to convey the semiconductor device and the support plate while supporting the semiconductor device and the support plate.

17. The heat treatment system as claimed in claim 14, wherein the processing unit further includes an insulative plate installed between the inner housing and the magnetic core.

18. The heat treatment system as claimed in claim 14, wherein the lamp heater includes a halogen lamp.

19. The heat treatment system as claimed in claim 15, wherein the first and second heat bodies include silicon carbide or a carbon member coated with silicon carbide.

20. The heat treatment system as claimed in claim 17, wherein the inner housing and the insulative plate are made from quartz.

21. The heat treatment system as claimed in claim 14, wherein the induction coil is installed in an induction coil recess formed in the magnetic core while facing the inner housing.

22. The heat treatment system as claimed in claim 14, wherein the magnetic core is spaced from the insulative plate by a predetermined distance and is cooled by means of cooling gas fed onto the magnetic core from an exterior.

23. The heat treatment system as claimed in claim 14, wherein the magnetic core includes composite materials including epoxy and ferrite powder or iron.

24. The heat treatment system as claimed in claim 2, wherein the processing unit includes an inner housing forming a heat treatment space for the semiconductor device, a lamp heater installed at an inner upper portion and an inner lower portion of the inner housing, a heat body having a plate shape installed at an inner upper portion and an inner lower portion of the lamp heater, a magnetic core having a block shape and installed at an outside of the inner housing, and an induction coil wound around the magnetic core.

25. The heat treatment system as claimed in claim 24, wherein the heat body includes silicon carbide or a carbon member coated with silicon carbide.

26. The heat treatment system as claimed in claim 1, wherein the unloading unit includes a gas spraying nozzle for spraying gas to the support plate and the semiconductor device with a predetermined spraying angle when the support plate and the semiconductor device are conveyed to the unloading unit from the cooling unit, a cooling susceptor, which is formed at a predetermined region thereof with spraying holes for spraying gas and on which the support plate is rested, a lifting device for moving the cooling susceptor up and down, and a horizontal conveyance device for horizontally conveying the support plate.

27. The heat treatment system as claimed in claim 26, wherein the unloading unit further includes an upper heating device installed above the cooling susceptor in order to heat upper portions of the support plate and the semiconductor device.

28. The heat treatment system as claimed in claim 26, wherein the cooling susceptor is made from a material selected from the group consisting of aluminum, aluminum alloys, graphite, aluminum oxide, aluminum nitride, and boron nitride.

29. The heat treatment system as claimed in claim 26, wherein the cooling susceptor has an area larger than an area of the support plate.

30. The heat treatment system as claimed in claim 26, wherein the predetermined region of the cooling susceptor formed with the spraying holes has an area corresponding to at least 50% of the area of the support plate rested on an upper surface of the cooling susceptor.

31. The heat treatment system as claimed in claim 26, wherein the spraying holes have circular sectional shapes or polygonal sectional shapes.

32. The heat treatment system as claimed in claim 31, wherein each of the spraying holes has a diameter or a width in range of about 0.5 to 3 mm.

33. The heat treatment system as claimed in claim 26, wherein an interval between the spraying holes is larger than a diameter or a width of the spraying holes.

34. The heat treatment system as claimed in claim 26, wherein the gas spraying nozzle includes an upper nozzle and a lower nozzle, and the upper nozzle is spaced from the lower nozzle by a predetermined distance, which is larger than a total thickness of the semiconductor device and the support plate, in order to spray gas onto the upper and lower portions of the semiconductor device and the support plate.

35. The heat treatment system as claimed in claim 26, wherein the gas spraying nozzle sprays gas while forming an obtuse angle with respect to a conveying direction of the support plate.

36. The heat treatment system as claimed in claim 26, wherein a width of sprayed gas is at least the same as or larger than a width of the support plate.

37. The heat treatment system as claimed in claim 26, wherein the lifting device includes a pneumatic cylinder, a ball screw unit or a timing belt installed at a lower portion of the cooling susceptor.

38. The heat treatment system as claimed in claim 26, wherein the horizontal conveyance device includes a roller and a motor for rotating the roller, the roller being accommodated in a roller recess formed at an upper surface of the cooling susceptor with a predetermined length in order to convey the support plate making contact with an upper portion of the roller.

39. The heat treatment system as claimed in claim 27, wherein an installation area of the upper heating device installed above the cooling susceptor is larger than an area of the support plate so that the upper heating device effectively heats upper portions of the semiconductor device and the support plate.

40. The heat treatment system as claimed in claim 27, wherein the upper heating device includes a plurality of lamp heaters.

41. The heat treatment system as claimed in claim 1, wherein the semiconductor device includes a glass substrate, an amorphous silicon thin film deposited on the glass substrate, and a poly-crystalline silicon thin film deposited on the glass substrate.

42. The heat treatment system as claimed in claim 41, wherein the semiconductor device includes a thin film transistor used in a liquid crystal display or an organic light emitting display.

43. The heat treatment system as claimed in claim 2, wherein the heat treatment process includes one selected from the group consisting of a solid phase crystallization process for the amorphous silicon thin film, a metal induced crystallization process, a metal induced lateral crystallization process, an activation process for an ion-implanted poly-crystalline silicon thin film, and a pre-compaction process for the glass substrate.

44. The heat treatment system as claimed in claim 1, wherein the heat treatment process is performed in a temperature range of about 400 to 1000°

C.

45. The heat treatment system as claimed in claim 1, wherein the semiconductor device is conveyed while being rested on the support plate made from quartz having a thickness of about 3 to 10 mm.

46. The heat treatment system as claimed in claim 45, wherein a width and a length of the support plate are larger than those of the semiconductor device by at least 10 mm.

47. The heat treatment system as claimed in claim 45, wherein the support plate is formed with at least four vacuum holes, which are diagonally aligned in an installation area of the semiconductor device.

48. The heat treatment system as claimed in claim 47, wherein the vacuum holes are aligned within 10 mm from lateral sides of the semiconductor device and have a circular shape having a diameter less than 3 mm or a rectangular shape having a width less than 3 mm.

49. A heat treatment system for a semiconductor device which is conveyed while being rested on a support plate, the heat treatment system comprising:

a loading unit for heating the semiconductor device and the support plate at a predetermined preheating temperature,

wherein the loading unit includes a susceptor, which is formed at an upper center portion thereof with insulative slots and on which the support plate is placed, a heating device for heating the susceptor, a lifting device for moving the susceptor up and down, and a horizontal conveyance device for horizontally moving the support plate.

50. A heat treatment system for a semiconductor device which is conveyed while being rested on a support plate, the heat treatment system comprising:

an unloading unit for discharging the semiconductor device and the support plate, which have been heat-treated, after uniformly cooling the semiconductor device and the support plate at a predetermined unloading temperature, wherein

the unloading unit includes a cooling susceptor, which is formed at a predetermined region thereof with spraying holes for spraying gas and on which the support plate is rested, a gas spraying nozzle installed at one side of the cooling susceptor in order to spray gas onto the support plate and the semiconductor device with a predetermined spraying angle when the support plate and the semiconductor device are conveyed into the unloading unit, a lifting device for moving the cooling susceptor up and down, and a horizontal conveyance device for horizontally conveying the support plate.

51. The heat treatment system as claimed in claim 50, wherein the unloading unit further includes an upper heating device installed above the cooling susceptor in order to heat upper portions of the support plate and the semiconductor device.