Light-emitting diode chip package body and packaging method thereof

• US 7,989,817 B2
• Filed: 01/09/2008
• Issued: 08/02/2011
• Est. Priority Date: 01/16/2004
• Status: Expired due to Fees

• Current Assignee: Suzhou Industrial Park Tony Lighting Technology Co., Ltd.
• Original Assignee: Suzhou Industrial Park Tony Lighting Technology Co., Ltd.
• Inventors: Shen, Yu-Nung
• Primary Examiner(s): Loke; Steven
• Assistant Examiner(s): Thomas; Kimberly M
• Application Number:
  US12/007,276
• Publication Number:
  US 20080173888A1
• Time in Patent Office: 1,301 Days
• Field of Search: 257 79- 82, 257/98, 257/99
• US Class Current: 257/79
• CPC Class Codes: H01L 2224/1147 using a lift-off mask
• CPC Class Codes: H01L 2224/13016 in side view
• CPC Class Codes: H01L 2224/13099 Material
• CPC Class Codes: H01L 2224/13144 Gold [Au] as principal constituent
• CPC Class Codes: H01L 2224/13583 Three-layer coating
• CPC Class Codes: H01L 2224/13624 Aluminium [Al] as principal constituent
• CPC Class Codes: H01L 2224/13644 Gold [Au] as principal constituent
• CPC Class Codes: H01L 2224/13655 Nickel [Ni] as principal constituent
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 24/13 of an individual bump connector
• CPC Class Codes: H01L 24/16 of an individual bump connector
• CPC Class Codes: H01L 2924/00013 Fully indexed content
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/12041 LED
• CPC Class Codes: H01L 33/46 Reflective coating, e.g. dielectric Bragg reflector
• CPC Class Codes: H01L 33/54 having a particular shape
• CPC Class Codes: H01L 33/60 Reflective elements
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

AN LED chip package body provides an LED chip with a pad-installed surface, a plurality of pads disposed on the pad-installed surface and a rear surface formed opposite the pad-installed surface. The LED chip package body further has a light-reflecting coating disposed on the pad-installed surface of the LED chip and a plurality of pad-exposed holes for exposure of the corresponding pads of the LED chip. The LED chip package body further comprises a light-transparent element disposed on the rear surface of the LED chip and a plurality of conductive projecting blocks. Each of the conductive projecting blocks is disposed on the corresponding pad of the LED chip.

Claims

1. A light-emitting diode chip package body, comprising:

a light-emitting diode chip having a pad-installed surface formed thereon, a plurality of pads installed on the pad-installed surface and a rear surface formed on an opposite side of the pad-installed surface;

a light-reflecting coating disposed on the rear surface of the light-emitting diode chip;

an insulative protective layer formed on the light-reflecting coating;

an insulative layer disposed on the pad-installed surface of the light-emitting diode chip, and having a central through hole for exposure of a central portion of the pad-installed surface and a plurality of pad-exposed holes for exposure of the corresponding pads;

a first light-transparent element received in the central through hole of the insulative layer and having a planar top portion; and

a plurality of conductive projecting blocks, each conductive projecting block being disposed on a corresponding pad of the light-emitting diode.

2. The package body as claimed in claim 1, further comprising a second light-transparent element disposed on the planar top portion of the first light-transparent element, both the first and the second light-transparent elements being doped with light-polarizing compounds with different wavelengths.

5. The package body as claimed in claim 1, further comprising a bonded metal layer formed on the corresponding pad.

6. The package body as claimed in claim 5, wherein each of the conductive projecting blocks comprises:

a protrusion made of a nonconductive material and disposed on a corresponding bonded metal layer;

a first metal layer formed on the corresponding bonded metal layer for covering a corresponding surface of the bonded metal layer and the protrusion of the corresponding bonded metal layer; and

a second metal layer formed on the corresponding first metal layer.

7. The package body as claimed in claim 6, wherein each of the second metal layers is composed of a nickel layer and a gold layer.

8. The package body as claimed in claim 1, wherein the conductive projecting blocks are made of gold.

3. A light-emitting diode chip package body, comprising:

a light-emitting diode chip having a pad-installed surface formed thereon, a plurality of pads installed on the pad-installed surface and a rear surface formed on an opposite side of the pad-installed surface;

a light-reflecting coating disposed on the rear surface of the light-emitting diode chip;

an insulative protective layer formed on the light-reflecting coating;

an insulative layer disposed on the pad-installed surface of the light-emitting diode chip, and having a central through hole for exposure of a central portion of the pad-installed surface and a plurality of pad-exposed holes for exposure of the corresponding pads;

a first light-transparent element received in the central through hole of the insulative layer; and

a plurality of conductive projecting blocks, each conductive projecting block being disposed on a corresponding pad of the light-emitting diode, each of the conductive projecting blocks comprises;

a protrusion made of a nonconductive material and disposed on the corresponding pad of the light-emitting diode chip;

a first metal layer formed on the corresponding pad of the light-emitting diode chip for covering a corresponding surface of the pad and the protrusion of the corresponding pad; and

a second metal layer formed on the corresponding first metal layer.

4. The package body as claimed in claim 3, wherein each of the second metal layers is composed of a nickel layer and a gold layer.

9. A light-emitting diode chip package body, comprising:

a light-emitting diode chip having a pad-installed surface formed thereon, a plurality of pads installed on the pad-installed surface and a rear surface formed on an opposite side of the pad-installed surface;

a light-reflecting coating disposed on the rear surface of the light-emitting diode chip;

an insulative protective layer formed on the light-reflecting coating;

an insulative layer disposed on the pad-installed surface of the light-emitting diode chip, and having a central through hole for exposure of a central portion of the pad-installed surface and a plurality of pad-exposed holes for exposure of the corresponding pads;

a first light-transparent element received in the central through hole of the insulative layer; and

a plurality of conductive projecting blocks, each conductive projecting block being disposed on a corresponding pad of the light-emitting diode, each of the conductive projecting blocks comprises;

a conductive contact point disposed on the corresponding pad of the light-emitting diode chip; and

a conductive welded point disposed on the corresponding conductive contact point.