Light emitting diode backlight module and liquid crystal display
First Claim
Patent Images
1. A light emitting diode package, comprising:
- a base;
a semiconductor chip formed at the base for providing light beams;
an encapsulating cover for sealing the semiconductor chip, the encapsulating cover comprising a lateral surface surrounding the semiconductor chip and a top surface above the semiconductor chip; and
two optical layers being capable of blocking the light beams and covering two opposite parts of the lateral surface of the encapsulating cover respectively and exposing another two opposite parts of the lateral surface of the encapsulating cover to define two intervals between the two optical layers;
wherein at least part of the light beams emitted by the semiconductor chip towards the lateral surface are transmitted out of the light emitting diode package through the intervals along at least two lateral directions.
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Accused Products
Abstract
An exemplary light emitting diode (200) includes a base (18), a semiconductor chip (20), a cover (28), and two optical layers (30). The semiconductor chip is formed on the base. The cover is formed on the base and covers the semiconductor chip. The optical layers cover part of a peripheral side of the cover respectively.
15 Citations
20 Claims
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1. A light emitting diode package, comprising:
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a base; a semiconductor chip formed at the base for providing light beams; an encapsulating cover for sealing the semiconductor chip, the encapsulating cover comprising a lateral surface surrounding the semiconductor chip and a top surface above the semiconductor chip; and two optical layers being capable of blocking the light beams and covering two opposite parts of the lateral surface of the encapsulating cover respectively and exposing another two opposite parts of the lateral surface of the encapsulating cover to define two intervals between the two optical layers; wherein at least part of the light beams emitted by the semiconductor chip towards the lateral surface are transmitted out of the light emitting diode package through the intervals along at least two lateral directions. - View Dependent Claims (2, 3, 7, 8, 9, 10)
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4. A liquid crystal display, comprising:
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a backlight module comprising a plurality of light emitting diodes, each of the light emitting diodes having a semiconductor chip for emitting light beams, an encapsulating cover sealing the semiconductor chip, and two optical layers formed on the encapsulating cover, each of the optical layers configured for blocking light beams incident thereon; and a liquid crystal panel arranged at the backlight module; wherein the encapsulating cover comprises a lateral surface surrounding the semiconductor chip and a top surface above the semiconductor chip, the two optical layers cover two opposite parts of the lateral surface of the encapsulating cover respectively and exposing another two opposite parts of the lateral surface of the encapsulating cover to define two opposite intervals between the two optical layers, the intervals of each color emitting diode are arranged along a same line, and at least part of the light beams emitted by the semiconductor chip towards the lateral surface are transmitted out of the light emitting diode package through the intervals along at least two lateral directions. - View Dependent Claims (5, 6, 11, 12, 13, 14, 15)
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16. A light emitting diode string, comprising:
a plurality of light emitting diodes arranged along a line, each light emitting diode comprising; a base; a semiconductor chip formed at the base for providing light beams; an encapsulating cover sealing the semiconductor chip, the encapsulating cover comprising a lateral surface surrounding the semiconductor chip and a top surface above the semiconductor chip; and two optical layers being capable of blocking the light beams and covering two opposite parts of the lateral surface of the encapsulating cover respectively and exposing another two opposite parts of the lateral surface of the encapsulating cover to define two intervals between the two optical layers; wherein the intervals of each light emitting diode are arranged along a same line, and at least part of the light beams emitted by the semiconductor chip towards the lateral surface are transmitted out of the light emitting diode package through the intervals along at least two lateral directions. - View Dependent Claims (17, 18, 19, 20)
Specification