Vertical electrical device

• US 7,989,915 B2
• Filed: 07/11/2006
• Issued: 08/02/2011
• Est. Priority Date: 07/11/2006
• Status: Active Grant

• Current Assignee: Teledyne Scientific & Imaging, LLC (Teledyne Technologies Incorporated)
• Original Assignee: Teledyne Licensing, LLC
• Inventors: DeNatale, Jeffrey F., Lauxtermann, Stefan C., Pettersson, Per-Olov
• Primary Examiner(s): Brewster, William M.
• Application Number:
  US11/485,034
• Publication Number:
  US 20080122031A1
• Time in Patent Office: 1,848 Days
• Field of Search: 257/532, 257/664, 257/E23.141, 257/E21.495, 438/386, 438/619
• US Class Current: 257/532
• CPC Class Codes: H01G 4/005 Electrodes
• CPC Class Codes: H01G 4/06 Solid dielectrics
• CPC Class Codes: H01G 4/40 Structural combinations of fixed capacitors with other electric elements, the structure mainly consisting of a capacitor, e.g. RC combinations
• CPC Class Codes: H01L 21/486 Via connections through the substrate with or without pins
• CPC Class Codes: H01L 21/76898 formed through a semiconductor substrate
• CPC Class Codes: H01L 2223/6622 Coaxial feed-throughs in active or passive substrates
• CPC Class Codes: H01L 23/49827 Via connections through the substrates, e.g. pins going through the substrate, coaxial cables H01L23/49822, H01L23/49833, H01L23/4985, H01L23/49861 take precedence
• CPC Class Codes: H01L 23/50 for integrated circuit devices, e.g. power bus, number of leadsH01L23/482 - H01L23/498 take precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/3011 Impedance

Abstract

A vertical electrical device includes a region in a substrate extending from a surface of the substrate, the region having an inner wall and an outer wall circumscribing the inner wall. An inner electrically conductive layer is disposed on the inner wall and an outer electrically conductive layer is disposed on the outer wall, with an electrically insulative material disposed between the inner and outer layers. An electrical conductor in the substrate is bounded by the inner electrically conductive layer.

Claims

1. A vertical electrical device, comprising:

a region in a substrate extending from a surface of the substrate, the region having an inner wall and an outer wall circumscribing the inner wall;

an inner electrically conductive layer disposed on said inner wall;

an outer electrically conductive layer disposed on said outer wall;

an electrically insulative material disposed between said inner and outer electrically conductive layers; and

an electrical conductor in said substrate and bounded by said inner electrically conductive layer;

wherein the electrical conductor and the outer electrically conductive layer extend beyond the substrate at the first surface wherein a portion of said electrically insulative region covers said inner metal electrically conductive layer at said second surface.

2. The device of claim 1, further comprising:

a first electrical connection between said device and a first electronic circuit on a first circuit layer.

3. The device of claim 2, wherein said first electrical connection comprises a first planar conductor connecting said first electronic circuit to said electrical conductor.

4. The device of claim 2, further comprising:

a second electrical connection between said device and a second electronic circuit on a second circuit layer.

5. The device of claim 1, wherein said inner electrically conductive layer comprises an inner electrically conductive metal layer and said outer electrically conductive layer comprises an outer electrically conductive metal layer.

6. The device of claim 1, wherein said electrically insulative material comprises an organic material.

7. The device of claim 6, wherein said organic electrically insulative material comprises parylene.

8. The device of claim 1, wherein said electrically insulative material comprises an inorganic material.

9. The device of claim 8, wherein said electrically insulative material comprises an inorganic material selected from the group consisting of oxides and nitrides.

10. The device of claim 1, wherein said substrate comprises a semiconductive substrate.

11. The device of claim 10, wherein said semiconductive substrate comprises a silicon substrate.

12. The device of claim 1, wherein the region comprises a cylindrical region.

13. The device of claim 1, wherein the electrical conductor and the outer electrically conductive layer extend beyond the substrate at the second surface.

14. The device of claim 1, wherein a portion of the electrical conductor proximate said surface of the substrate is reduced in size relative to the remaining portion of the conductor.

15. The device of claim 1, wherein said insulative material and said outer conductive layer provide high frequency signal isolation for said electrical conductor, the device operable thereby as a high frequency shielded electrical conductor.

16. The device of claim 15, wherein the inner electrically conductive layer, the outer electrically conductive layer, the electrically insulative material, and the electrical conductor are fabricated with dimensions and of materials selected to optimize the radio frequency properties of the device.

17. A vertical high frequency shielded electrical conductor, comprising:

a cylindrical region in a semiconductive substrate extending from a first surface of the substrate, the region having an inner wall, an outer wall circumscribing the inner wall, and a bottom surface between the outer and inner walls;

an inner metal electrically conductive layer disposed on said inner wall;

an outer metal electrically conductive layer disposed on said outer wall;

an electrically insulative region disposed between said inner and outer electrically conductive layers and substantially filling the region;

an electrical conductor in said substrate, bounded by said inner electrically conductive layer, and extending through a second surface of said substrate, the electrical conductor thereby forming an electrical interconnect via through said substrate, a portion of said electrically insulative region covering said inner metal electrically conductive layer at said second surface, said insulative region and said outer conductive layer providing high frequency isolation for the electrical interconnect;

wherein said outer conductive layer comprises a first electrode, said electrical conductor comprises a second electrode, and said electrically insulative material is a dielectric material, the device configured thereby as a coaxial capacitor.

18. The device of claim 17, wherein a portion of the second electrode proximate said surface of the substrate is reduced in size relative to the remaining portion of the electrode.