Increased I/O leadframe and semiconductor device including same

• US 7,989,933 B1
• Filed: 10/06/2008
• Issued: 08/02/2011
• Est. Priority Date: 10/06/2008
• Status: Active Grant

• Current Assignee: Amkor Technology Singapore Holding Pte., Ltd. (Amkor Technology Incorporated)
• Original Assignee: Amkor Technology Incorporated
• Inventors: Kim, Wan Jong, Kim, Gi Jeong, Choi, Yeon Ho
• Primary Examiner(s): Andújar; Leonardo
• Assistant Examiner(s): Klein; Jordan
• Application Number:
  US12/246,226
• Time in Patent Office: 1,030 Days
• Field of Search: 257666-677, 257692-696, 257/E23.011, 257/E23.031
• US Class Current: 257/676
• CPC Class Codes: H01L 2224/05554 being square
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45124 Aluminium (Al) as principal constituent
• CPC Class Codes: H01L 2224/45139 Silver (Ag) as principal constituent
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/45147 Copper (Cu) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48257 connecting the wire to a die pad of the item
• CPC Class Codes: H01L 2224/49109 outside the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/49433 outside the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/92 Specific sequence of method steps
• CPC Class Codes: H01L 2224/92247 the second connecting process involving a wire connector
• CPC Class Codes: H01L 23/3107 the device being completely enclosed
• CPC Class Codes: H01L 23/49503 characterised by the die pad
• CPC Class Codes: H01L 23/49541 Geometry of the lead-frame
• CPC Class Codes: H01L 23/49551 characterised by bent parts
• CPC Class Codes: H01L 24/45 of an individual wire connector
• CPC Class Codes: H01L 24/48 : of an individual wire connector
• CPC Class Codes: H01L 24/49 : of a plurality of wire connectors
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/10162 : with a square active surface
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/207 : Diameter ranges

Abstract

In accordance with the present invention, there is provided a semiconductor package (e.g., a QFP package) including a uniquely configured leadframe sized and configured to maximize the available number of exposed leads in the semiconductor package. More particularly, the semiconductor package of the present invention includes a generally planar die pad or die paddle defining multiple peripheral edge segments. In addition, the semiconductor package includes a plurality of leads. Some of these leads include exposed bottom surface portions which are provided in at least two concentric rows or rings which at least partially circumvent the die pad, with other leads including portions which protrude from respective side surfaces of a package body of the semiconductor package. Connected to the top surface of the die pad is at least one semiconductor die which is electrically connected to at least some of the leads. At least portions of the die pad, the leads, and the semiconductor die are encapsulated by the package body, with at least portions of the bottom surfaces of the die paddle and some of the leads being exposed in a common exterior surface of the package body.

Claims

1. A leadframe for a semiconductor package, comprising:

a generally planar die pad defining multiple peripheral edge segments;

a land connecting bar at least partially circumventing the die pad;

a dambar connected at least partially circumventing the land connecting bar;

a plurality of land leads connected to the land connecting bar and extending inwardly toward the die pad;

a plurality of extension leads connected to the land connecting bar and extending outwardly toward the dambar, each of the extension leads including first and second downsets formed therein in spaced relation to each other so as to define at least first, second and third segments which reside on respective ones of three spaced, generally parallel planes;

a plurality of inner leads connected to the dambar and extending inwardly toward the land connecting bar, at least some of the inner leads including a downset formed therein so as to define at least first and second segments which reside on respective ones of a spaced, generally parallel pair of planes; and

a plurality of outer leads connected to the dambar and extending outwardly therefrom, each of the outer leads being aligned with and integrally connected to a respective one of the inner leads;

the second and third segments of the extension leads extending in generally co-planar relation to respective ones of the first and second segments of the inner leads.

2. The leadframe of claim 1 wherein the die pact has a generally quadrangular configuration, and the land, extension, inner and outer leads are segregated into at least four sets which each extend along a respective one of the peripheral edge segments of the die pad.

3. The leadframe of claim 2 wherein the land connecting bar and the dambar each have a generally quadrangular configuration, the land connecting bar being concentrically positioned within the dambar.

4. The leadframe of claim 3 wherein:

the land connecting bar comprises four peripheral segments which extend in spaced, generally parallel relation to respective ones of the peripheral edge segments of the die pad;

each of the peripheral segments of the land connecting bar includes a spaced pair of outer portions which are interconnected by a central portion; and

the outer portions are each of a first width, with the central portion being of a second width which exceeds the first width.

5. The leadframe of claim 4 wherein:

at least two tie bars are connected to and protrude from the die pad;

the land connecting bar and the dambar are each connected to the tie bars;

the outer portions of each peripheral segment of the land connecting bar each include a chamfered portion which is connected to a respective one of the tie bars.

6. The leadframe of claim 4 wherein the first width is in the range of about 85% to about 90% of the second width.

7. The leadframe of claim 4 wherein each peripheral segment of the land connecting bar is half etched.

8. The leadframe of claim 4 wherein the central portion of each peripheral segment of the land connecting bar is half etched.

9. The leadframe of claim 4 wherein the central portion of each peripheral segment of the land connecting bar is partially etched to have a reverse tapered configuration.

10. The lead frame of claim 4 wherein each peripheral segment of the land connecting bar includes a plurality of dimples formed thereon.

11. The leadframe of claim 10 wherein the dimples are disposed at respective points of intersection between the land leads and the land connecting bar, and between the extension leads and the land connecting bar.

12. The leadframe of claim 4 wherein each peripheral segment of the land connecting bar includes a plurality of half-etched portions disposed at respective points of intersection between the land leads and the land connecting bar, and between the extension leads and the land connecting bar.

13. The leadframe of claim 4 wherein the central portion of each peripheral segment of the land connecting bar has a serpentine configuration.

14. The leadframe of claim 3 wherein at least some of the extension leads each include a tie bar portion which is connected to the dambar.

15. The leadframe of claim 14 wherein the tie bar portion of each of the extension leads including a tie bar portion includes at least one dimple and an opposed pair of notches formed therein.

16. The leadframe of claim 1 wherein the land leads of each set thereof are linearly aligned with respective ones of the extension leads of a corresponding set thereof.

17. The leadframe of claim 1 further comprising a plurality a support bars connected to and extending between the die pad and the land connecting bar.

18. The leadframe of claim 17 wherein at least one of the support bars is connected to a respective one of the land leads.

19. A leadframe for a semiconductor package, comprising:

a die pad;

at least two tie bars connected to and protruding from the die pad;

a dambar at least partially circumventing the die pad;

a plurality of land leads disposed between the dambar and the die pad;

a plurality of extension leads disposed between the dambar and the die pad;

means for connecting the land leads to the extension leads;

a plurality of inner leads connected to the dambar and extending inwardly toward the die pad; and

a plurality of outer leads connected to the dambar and extending outwardly therefrom, each of the outer leads being aligned with and integrally connected to a respective one of the inner leads;

each of the extension leads being bent so as to define at least two segments which reside on respective ones of a spaced, generally parallel pair of planes.

20. A leadframe for a semiconductor package comprising:

a generally planar die pad;

a land connecting bar at least partially circumventing the die pad;

at least two support bars connected to and extending between the die pad and the land connecting bar;

a dambar at least partially circumventing the land connecting bar;

a plurality of land leads connected to the land connecting bar and extending inwardly toward the die pad;

a plurality of extension leads connected to the land connecting bar and extending outwardly toward the dambar, each of the extension leads including first and second downsets formed therein in spaced relation to each other so as to define at least first, second and third segments which reside on respective ones of three spaced, generally parallel planes;

a plurality of inner leads connected to the dambar and extending inwardly toward the land connecting bar, at least some of the inner leads including a downset formed therein so as to define at least first and second segments which reside on respective ones of a spaced, generally parallel pair of planes; and

a plurality of outer leads connected to the dambar and extending outwardly therefrom, each of the outer leads being aligned with and integrally connected to a respective one of the inner leads;

the second and third segments of the extension leads extending in generally co-planar relation to respective ones of the first and second segments of the inner leads.