Semiconductor device, electronic device, and method of producing semiconductor device
First Claim
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1. A semiconductor device comprising:
- a substrate;
a first insulating film that includes a first opening reaching the substrate and that is provided on the substrate;
a second insulating film that includes a second opening reaching the substrate through the first opening of the first insulating film and that covers the first insulating film, the second insulating film comprising a reflow film, and the second opening having upper shoulder parts each of which has a rounded shape; and
a conductive pattern that is provided on the second insulating film so as to be in electrical communication with the substrate through the second opening of the second insulating film.
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Abstract
A semiconductor device includes a first insulating film that includes a first opening reaching a substrate and that is provided on the substrate, a second insulating film that includes a second opening reaching the substrate through the first opening of the first insulating film and that covers the first insulating film, and a conductive pattern that is provided on the second insulating film so as to be in contact with the substrate through the second opening of the second insulating film.
39 Citations
7 Claims
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1. A semiconductor device comprising:
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a substrate; a first insulating film that includes a first opening reaching the substrate and that is provided on the substrate; a second insulating film that includes a second opening reaching the substrate through the first opening of the first insulating film and that covers the first insulating film, the second insulating film comprising a reflow film, and the second opening having upper shoulder parts each of which has a rounded shape; and a conductive pattern that is provided on the second insulating film so as to be in electrical communication with the substrate through the second opening of the second insulating film. - View Dependent Claims (2, 3, 4, 5, 6)
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7. An electronic device comprising a semiconductor device, the semiconductor device comprising:
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a substrate; a first insulating film that includes a first opening reaching the substrate and that is provided on the substrate; a second insulating film that includes a second opening reaching the substrate through the first opening of the first insulating film and that covers the first insulating film, the second insulating film comprising a reflow film, and the second opening having upper shoulder parts each of which has a rounded shape; and a conductive pattern that is provided on the second insulating film so as to be connected to a conductive layer provided on the surface of the substrate through the second opening of the second insulating film.
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Specification