Systems and methods for wafer translation
First Claim
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1. A wafer translation apparatus, comprising:
- a transfer arm including an incoming load pad for receiving an edge of an incoming wafer to be processed;
an incoming gripping mechanism positioned on the transfer arm and capable of gripping the edge of the incoming wafer received in the incoming load pad, the incoming load pad and incoming gripping mechanism capable of releasably supporting the incoming wafer therebetween;
a first rotational assembly capable of rotating the transfer arm about a first rotational axis such that the incoming wafer supported by the incoming load pad and incoming gripping mechanism can be rotated between a substantially horizontal orientation and a substantially vertical orientation;
a second rotational assembly capable of rotating the transfer arm about a second rotational axis, the second rotational axis being orthogonal to the first rotational axis, wherein rotation of the transfer arm about the first and second rotational axes causes the incoming wafer to be translated from a first location and first orientation to a second location and second orientation; and
a process elevator that is adapted to receive the incoming wafer positioned in the second location and the second orientation, wherein the process elevator is adapted to transfer the incoming wafer to a processing chamber.
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Abstract
A two-axis automation system can be used to transfer and rotate wafers between horizontal and vertical orientations necessary for differing steps in a semiconductor fabrication process. The two rotational axes allow for the transfer and rotation to be done in a minimal space and with a minimum amount of swept volume. A transfer arm of the automation system can include a pair of load pads capable of loading and unloading a wafer processing chamber in a single sweep.
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Citations
26 Claims
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1. A wafer translation apparatus, comprising:
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a transfer arm including an incoming load pad for receiving an edge of an incoming wafer to be processed; an incoming gripping mechanism positioned on the transfer arm and capable of gripping the edge of the incoming wafer received in the incoming load pad, the incoming load pad and incoming gripping mechanism capable of releasably supporting the incoming wafer therebetween; a first rotational assembly capable of rotating the transfer arm about a first rotational axis such that the incoming wafer supported by the incoming load pad and incoming gripping mechanism can be rotated between a substantially horizontal orientation and a substantially vertical orientation; a second rotational assembly capable of rotating the transfer arm about a second rotational axis, the second rotational axis being orthogonal to the first rotational axis, wherein rotation of the transfer arm about the first and second rotational axes causes the incoming wafer to be translated from a first location and first orientation to a second location and second orientation; and a process elevator that is adapted to receive the incoming wafer positioned in the second location and the second orientation, wherein the process elevator is adapted to transfer the incoming wafer to a processing chamber. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15)
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16. A wafer translation apparatus, comprising:
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a transfer arm including an incoming load pad for receiving an edge of an incoming wafer to be processed; an incoming gripping mechanism positioned on the transfer arm and capable of gripping the edge of the incoming wafer received in the incoming load pad, the incoming load pad and incoming gripping mechanism capable of releasably supporting the incoming wafer therebetween; a first rotational assembly capable of rotating the transfer arm about a first rotational axis such that the incoming wafer supported by the incoming load pad and incoming gripping mechanism can be rotated between a substantially horizontal orientation and a substantially vertical orientation; a second rotational assembly capable of rotating the transfer arm about a second rotational axis, the second rotational axis being orthogonal to the first rotational axis, wherein rotation of the transfer arm about the first and second rotational axes causes the incoming wafer to be translated from a first location and first orientation to a second location and second orientation; an outgoing load pad and outgoing gripping mechanism on the transfer arm, the outgoing load pad and outgoing gripping mechanism capable of releasably supporting an outgoing wafer therebetween; and the outgoing and incoming load pads are skewed with respect to another at an angle of approximately 15°
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17. A translation apparatus for transferring a wafer to a processing station, comprising:
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a process elevator having a wafer receiving end effector, wherein the process elevator is adapted to transfer an incoming wafer to a processing station which is adapted to process a substrate in a vertical orientation; a transfer arm for receiving a plurality of wafers, wherein the transfer arm comprises; an incoming load pad that is adapted to support the incoming wafer; and an outgoing load pad that is adapted to support an outgoing wafer; a first rotational assembly capable of rotating the transfer arm about a first rotational axis such that the incoming wafer can be rotated between a substantially horizontal orientation and a substantially vertical orientation; and a second rotational assembly capable of rotating the transfer arm about a second rotational axis, wherein rotation of the transfer arm about the first and second rotational axes causes the incoming wafer to be translated from a first location and first orientation to a second location and second orientation, and the wafer is in position to be received by the end effector. - View Dependent Claims (18, 19)
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20. A method for translating and rotating a wafer for processing, comprising:
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receiving the edge of an incoming wafer into an incoming load pad of a transfer arm; gripping the edge of the incoming wafer received in the incoming load pad with an incoming gripping mechanism, the incoming load pad and incoming gripping mechanism capable of releasably supporting the incoming wafer therebetween; rotating the transfer arm about a first rotational axis such that the incoming wafer supported by the incoming load pad and incoming gripping mechanism can be rotated between a substantially horizontal and a substantially vertical orientation; rotating the transfer arm about a second rotational axis, the second rotational axis being orthogonal to the first rotational axis, wherein rotation of the transfer arm about the first and second rotational axes causes the incoming wafer to be translated from an initial location and initial orientation to a transfer location and processing orientation; transferring the wafer from the incoming load pad to an end effector; and positioning the wafer disposed on the end effector in a desired position within a process chamber by use of a transferring mechanism. - View Dependent Claims (21, 22, 25, 26)
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23. A method for translating and rotating a wafer for processing, comprising:
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receiving a wafer on an incoming load pad coupled to a transfer arm assembly; rotating the transfer arm about a first rotational axis such that the wafer can be rotated between a substantially horizontal and substantially vertical orientation; rotating the transfer arm about a second rotational axis, the second rotational axis being orthogonal to the first rotational axis, wherein rotation of the transfer arm about the first and second rotational axes causes the wafer to be translated from an initial location and horizontal orientation to a transfer location and vertical orientation; transferring the wafer from the incoming load pad to an end effector; positioning the wafer disposed on the end effector in a desired position within a vertically oriented process chamber by use of a transferring mechanism; and transferring the wafer from the end effector to an outgoing load pad coupled to the transfer arm assembly. - View Dependent Claims (24)
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Specification