Method of adhering a pair of members

• US 7,993,417 B2
• Filed: 01/22/2007
• Issued: 08/09/2011
• Est. Priority Date: 01/20/2006
• Status: Expired due to Fees

• Current Assignee: H&S Hightech Corp.
• Original Assignee: LS Cable Limited (LS Corporation)
• Inventors: Chung, Yoon-Jae, Moon, Hyuk-Soo, Park, Jeong-Beom, Lee, Kyung-Joon, Han, Yong-Seok, Han, Chul-Jong, Choi, Sung-Uk, Jang, Jong-Yoon, Cho, Il-Rae
• Primary Examiner(s): ARBES, CARL J
• Application Number:
  US12/161,487
• Publication Number:
  US 20090000807A1
• Time in Patent Office: 1,660 Days
• Field of Search: 29/250.1, 298/25, 298/32, 298/33, 298/40, 438/612
• US Class Current: 29/25.01
• CPC Class Codes: H05K 2201/091 Locally and permanently deformed areas including dielectric material
• CPC Class Codes: H05K 2203/0278 Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
• CPC Class Codes: H05K 3/323 by applying an anisotropic conductive adhesive layer over an array of pads
• CPC Class Codes: H05K 3/361 Assembling flexible printed circuits with other printed circuits
• CPC Class Codes: Y10T 29/49117 Conductor or circuit manufacturing
• CPC Class Codes: Y10T 29/49124 On flat or curved insulated base, e.g., printed circuit, etc.
• CPC Class Codes: Y10T 29/4913 Assembling to base an electrical component, e.g., capacitor, etc.
• CPC Class Codes: Y10T 29/49131 by utilizing optical sighting device
• CPC Class Codes: Y10T 29/49144 by metal fusion

Abstract

A connecting structure of PCB using an anisotropic conductive film according to the present invention having members connected to each other by heat-compression using the anisotropic conductive film including an insulating adhesive as a base material and conductive particles dispersed in the insulating adhesive, wherein at least any one of the members has a flexible property, and a surface roughness value (Ra) of the member having a flexible property is 0.1 to 5.0 μm due to dents formed by heat-compression.

Claims

1. A method for adhering to a pair of members, the method comprising:

(a) arranging an anisotropic conductive film including an insulating adhesive and conductive particles dispersed in the insulating adhesive, on one surface of a first member;

(b) applying predetermined heat and pressure to heat-compress the anisotropic conductive film to the first member;

(c) arranging a second member having a flexible property on a surface of the anisotropic conductive film opposite to the surface to which the first member is adhered; and

(d) applying predetermined heat and pressure to heat-compress the anisotropic conductive film to the second member,

wherein the step (d) includes controlling compression pressure, temperature and time such that a surface roughness value of dents formed on the surface of the second member is in the range of 0.1 to 5.0 μ

m.

2. The method for adhering to a pair of members of claim 1, wherein, in the step (d), the compression pressure is 2 MPa to 12 MPa.

3. The method for adhering to a pair of members of claim 1, wherein, in the step (d), the compression temperature is in the range of 120°

C. to 220°

C.

4. The method for adhering to a pair of members of claim 1, herein, in the step (d), the compression time is in the range of 3 to 30 seconds.