Component attach methods and related device structures

• US 7,993,940 B2
• Filed: 12/05/2007
• Issued: 08/09/2011
• Est. Priority Date: 12/05/2007
• Status: Expired due to Fees

• Current Assignee: Luminus Devices Incorporated (Sanan Optoelectronics Company Limited)
• Original Assignee: Luminus Devices Incorporated (Sanan Optoelectronics Company Limited)
• Inventors: Pumyea, Warren P.
• Primary Examiner(s): Stark; Jarrett J
• Assistant Examiner(s): TOBERGTE, NICHOLAS J
• Application Number:
  US11/950,934
• Publication Number:
  US 20090146172A1
• Time in Patent Office: 1,343 Days
• Field of Search: None
• US Class Current: 438/15
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 2224/27013 for holding or confining the layer connector, e.g. solder flow barrier
• CPC Class Codes: H01L 2224/29101 the principal constituent melting at a temperature of less than 400°C
• CPC Class Codes: H01L 2224/29109 Indium [In] as principal constituent
• CPC Class Codes: H01L 2224/29111 Tin [Sn] as principal constituent
• CPC Class Codes: H01L 2224/2919 with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/4847 the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
• CPC Class Codes: H01L 2224/49111 the connectors connecting two common bonding areas, e.g. Litz or braid wires
• CPC Class Codes: H01L 2224/49175 Parallel arrangements
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/81121 Active alignment, i.e. by apparatus steering, e.g. optical alignment using marks or sensors
• CPC Class Codes: H01L 2224/81143 Passive alignment, i.e. self alignment, e.g. using surface energy, chemical reactions, thermal equilibrium
• CPC Class Codes: H01L 2224/81801 Soldering or alloying
• CPC Class Codes: H01L 2224/83002 being a removable or sacrificial coating
• CPC Class Codes: H01L 2224/83051 Forming additional members, e.g. dam structures
• CPC Class Codes: H01L 2224/83143 : Passive alignment, i.e. self alignment, e.g. using surface energy, chemical reactions, thermal equilibrium
• CPC Class Codes: H01L 2224/83192 : wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/83801 : Soldering or alloying
• CPC Class Codes: H01L 2224/92247 : the second connecting process involving a wire connector
• CPC Class Codes: H01L 24/29 : of an individual layer connector
• CPC Class Codes: H01L 24/32 : of an individual layer connector
• CPC Class Codes: H01L 24/48 : of an individual wire connector
• CPC Class Codes: H01L 24/49 : of a plurality of wire connectors
• CPC Class Codes: H01L 24/75 : Apparatus for connecting with bump connectors or layer connectors
• CPC Class Codes: H01L 24/81 : using a bump connector
• CPC Class Codes: H01L 24/83 : using a layer connector
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 : Boron [B]
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01012 : Magnesium [Mg]
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01014 : Silicon [Si]
• CPC Class Codes: H01L 2924/01015 : Phosphorus [P]
• CPC Class Codes: H01L 2924/01023 : Vanadium [V]
• CPC Class Codes: H01L 2924/01024 : Chromium [Cr]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/0103 : Zinc [Zn]
• CPC Class Codes: H01L 2924/01031 : Gallium [Ga]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/01049 : Indium [In]
• CPC Class Codes: H01L 2924/0105 : Tin [Sn]
• CPC Class Codes: H01L 2924/01051 : Antimony [Sb]
• CPC Class Codes: H01L 2924/01074 : Tungsten [W]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/01083 : Bismuth [Bi]
• CPC Class Codes: H01L 2924/0132 : Binary Alloys
• CPC Class Codes: H01L 2924/0133 : Ternary Alloys
• CPC Class Codes: H01L 2924/0134 : Quaternary Alloys
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/0665 : Epoxy resin
• CPC Class Codes: H01L 2924/0781 : being an ohmic electrical conductor
• CPC Class Codes: H01L 2924/10329 : Gallium arsenide [GaAs]
• CPC Class Codes: H01L 2924/10336 : Aluminium gallium arsenide [AlGaAs]
• CPC Class Codes: H01L 2924/12041 : LED
• CPC Class Codes: H01L 2924/1461 : MEMS
• CPC Class Codes: H01L 2924/15724 : Aluminium [Al] as principal constituent
• CPC Class Codes: H01L 2924/15738 : the principal constituent melting at a temperature of greater than or equal to 950 C and less than 1550 C
• CPC Class Codes: H01L 2924/15747 : Copper [Cu] as principal constituent
• CPC Class Codes: H01L 33/486 : adapted for surface mounting
• CPC Class Codes: H01L 33/62 : Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

A method, and associated apparatus, for attaching a component (e.g., an electronic and/or optoelectronic component) is provided which can facilitate low-voiding of an attachment layer. The method includes disposing an attachment material layer over a surface, providing the component having a backside surface, disposing a portion of the backside surface of the component over a first portion of the attachment material layer such that a substantial portion of the backside surface of the component is not disposed over the attachment material layer, and moving the component such that the component is attached to at least a portion of the attachment material layer that is substantially larger than the first portion of the attachment material layer. The attachment material can include a solder. A light-emitting device is also described that comprises a component including a light-emitting die, wherein the component is supported by a substrate, and wherein the light-emitting die comprises a light emission surface and a backside surface disposed opposite the light emission surface. The light emission surface of the light-emitting die has an area greater than or equal to 1 mm² and an attachment material layer is disposed between the backside surface of the light-emitting die and the substrate, wherein the attachment material layer has voiding of less than 5% of an area of the backside surface.

Claims

1. A method of attaching a component, the method comprising:

disposing an attachment material layer over a surface;

providing the component having a backside surface;

disposing a portion of the backside surface of the component over a first portion of the attachment material layer such that a substantial portion of the backside surface of the component is not disposed over the attachment material layer; and

moving the component relative the surface such that the component is attached to at least a portion of the attachment material layer that is substantially larger than the first portion of the attachment material layer.

2. The method of claim 1, wherein the attachment material comprises a solder.

3. The method of claim 2, wherein the surface comprises a solderable portion and a non-solderable portion, and wherein the solder is constrained to the solderable portion of the surface.

4. The method of claim 3, wherein the substantial portion of the backside surface of the component that is not disposed over the attachment material layer is disposed over the non-solderable portion of the surface.

5. The method of claim 2, further comprising disposing flux material between the solder and the backside surface of the component.

6. The method of claim 5, wherein moving the component comprises heating the solder.

7. The method of claim 6, wherein heating the solder comprises increasing the temperature of the solder from less than or equal to an activation temperature of the flux material to at least a reflow temperature of the solder within less than one minute.

8. The method of claim 2, wherein disposing an attachment material layer over the surface comprises disposing a preformed solder over the surface.

9. The method of claim 8, wherein the preformed solder has a substantially similar area as the component.

10. The method of claim 2, wherein disposing an attachment material layer over the surface comprises disposing a solder paste over the surface.

11. The method of claim 2, wherein after moving the component such that the component is attached to the at least a portion of the solder layer, the solder layer has voiding of less than 5% of an area of the backside surface of the component.

12. The method of claim 2, wherein after moving the component such that the component is attached to the at least a portion of the solder layer, the solder layer has voiding of less than 1% of an area of the backside surface of the component.

13. The method of claim 1, wherein moving the component such that the component is attached to at least a portion of the attachment material layer that is substantially larger than the first portion of the attachment material layer comprises moving the component such that the component is attached to substantially all of the attachment material layer.

14. The method of claim 1, wherein moving the component comprises moving the die at least partially due to a surface tension force of the attachment material layer.

15. The method of claim 1, wherein moving the component comprises moving the die at least partially due to an external force.

16. The method of claim 1, wherein the component comprises a light-emitting die.

17. The method of claim 16, wherein the light-emitting die has a light emission surface area greater than 1 mm².

18. The method of claim 16, wherein the light-emitting die has a light emission surface area greater than 3 mm².

19. The method of claim 16, wherein the light-emitting die has a light emission surface area greater than 10 mm².