Electronic device and method of manufacturing the same

• US 7,993,960 B2
• Filed: 12/13/2007
• Issued: 08/09/2011
• Est. Priority Date: 12/13/2006
• Status: Active Grant

• Current Assignee: Samsung Display Company Limited (Samsung Electronics Co. Ltd.)
• Original Assignee: Samsung Mobile Display Company Limited (Samsung Electronics Co. Ltd.)
• Inventors: Fischer, Joerg, Schaedig, Marcus, Mathea, Arthur
• Primary Examiner(s): TRAN, MINH LOAN
• Application Number:
  US11/956,163
• Publication Number:
  US 20080143251A1
• Time in Patent Office: 1,335 Days
• Field of Search: 257/E21.244, 257/E21.249, 257/E21.255, 438/22, 438/99, 438/149, 438/151
• US Class Current: 438/99
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H10K 59/122 Pixel-defining structures or layers, e.g. banks
• CPC Class Codes: H10K 71/13 using printing techniques, e.g. ink-jet printing or screen printing
• CPC Class Codes: H10K 71/236 using printing techniques, e.g. applying the etch liquid using an ink jet printer

Abstract

Provided are an electronic device including a bank structure and a method of manufacturing the same. The method of manufacturing the electronic device requires a fewer number of processes and comprises a direct patterning of insulating layers, such as fluorinated organic polymer layers, is possible using cost-efficient techniques such as inkjet printing.

Claims

1. A method of manufacturing an electronic device, the method comprising:

providing a substrate;

applying an organic insulating layer comprising an organic insulating material on the substrate; and

applying at least one conductive line onto at least one second area of the organic insulating layer; and

patterning the organic insulating layer by applying an organic solvent to at least one first area of the organic insulating layer,

wherein in the patterning the organic insulating layer, dissolving the organic insulating material of the first area by applying the organic solvent, and encapsulating the at least one conductive line with the dissolved organic insulating material.

2. The method of claim 1, wherein the organic insulating material comprises a fluorinated organic polymer.

3. The method of claim 2, wherein the organic insulating material comprises a material selected from the group consisting of polyhexafluoropropene, fluoronated poly-para-xylene, fluorinated polyaryl ether ketones, fluorinated polyalkyl ethers, fluorinated polyamide, fluorinated ethylene/propylene copolymer, poly-(1,2-difluoromethylene)-perfluoro-tetrahydrofuran, and polytetrafluorethylene.

4. The method of claim 1, wherein the organic insulating material comprises a material selected from the group consisting of polyvinylphenol, polyvinyl alcohol, polyethylene, polystyrene, poly(methylmethacrylate), poly(butylmethacrylate), poly(cyclohexylmethacrylate), polyisobutylene, and polypropylene.

5. The method of claim 1, wherein the organic solvent comprises a non-polar solvent.

6. The method of claim 5, wherein the organic solvent comprises a solvent selected from the group consisting of methylene chloride, tetrahydrofuran, xylene, n-hexane, toluene, cyclohexane, anisole, 3,4-dimethylanisole, 1,2-dichlorobenzene, tetralin, 1,2,4-trimethylbenzene, 1,2,3-trimethylbenzene, 1,3,5-trimethylbenzene, methyl benzoate, ethyl benzoate, perfluoroheptane, perfluorooctane, perfluorononane, perfluorodecane, perfluoroundecane, perfluorododecane, perfluorodecalin, perfluoromethyldecalin, perfluoro-dimethyl ether, perfluoro-tetrahydrofuran, perfluoro-methyltetrahydrofuran, perfluoro-ethyltetrahydrofuran, perfluoro-dipropyl ether, perfluoro-diisopropyl ether, perfluoro-ethylpropyl ether, perfluoro-2-butyltetrahydrofuran, perfluorinated saturated tertiary amines, heptacosafluorotributylamine, and methoxynonafluorobutane.

7. The method of claim 1, further comprising carrying out a plasma-etching of the organic insulating layer.

8. The method of claim 1, further comprising forming a first conductive layer on the substrate.

9. The method of claim 8, wherein an organic insulating layer is applied onto the substrate having a first conductive layer, and the organic insulating layer is patterned by applying an organic solvent to the organic insulating layer to expose the first conductive layer.

10. The method of claim 9, further comprising forming an electroluminescent layer on the exposed first conductive layer.

11. The method of claim 8, wherein an organic insulating layer is applied onto the substrate having the first conductive layer, and the organic insulating layer is patterned by applying an organic solvent to the organic insulating layer not to expose the first conductive layer.

12. The method of claim 11, further comprising forming a second conductive layer on the patterned organic insulating layer.

13. The method of claim 1, wherein in the patterning the organic insulating layer, the thickness of the organic insulating layer is reduced in a plurality of first areas by applying the organic solvent in each of the first area, and the thickness of the organic insulating layer is increased in each of second areas, which are defined by an area between adjacent first areas, by accumulating the organic insulating material, which is dissolved by the organic solvent onto the second area.

14. A method of manufacturing an organic electroluminescent display, the method comprising:

providing a substrate;

applying a source electrode, a channel area, a drain electrode and a pixel electrode onto the substrate;

applying an organic insulating layer comprising an organic insulating material to cover the source electrode, the channel area, the drain electrode and the pixel electrode; and

removing the organic insulating material of a first area by applying an organic solvent to the first area of the organic insulating layer corresponding to the top surface of the pixel electrode.

15. The method of claim 14, wherein the organic insulating material of the first area is removed by applying the organic solvent to the first area so as to expose the pixel electrode.

16. The method of claim 14, further comprising plasma-etching to expose the pixel electrode.

17. The method of claim 14, further comprising forming a gate electrode on a second area of the organic insulating layer corresponding to the top surface of the channel area.

18. The method of claim 17, wherein the organic solvent is applied onto the first area to dissolve the organic insulating material and the dissolved organic insulating material covers the gate electrode after the gate electrode has been formed on the organic insulating layer.

19. The method of claim 17, wherein the organic solvent is applied onto the first area to dissolve the organic insulating material, and the dissolved organic insulating material is accumulated on the second area adjacent to the first area, thereby, forming a gate electrode on the accumulated organic insulating material.