Method of making deep junction for electrical crosstalk reduction of an image sensor

• US 7,994,032 B2
• Filed: 07/28/2010
• Issued: 08/09/2011
• Est. Priority Date: 07/10/2006
• Status: Expired due to Fees

• Current Assignee: Taiwan Semiconductor Manufacturing Company Limited
• Original Assignee: Taiwan Semiconductor Manufacturing Company Limited
• Inventors: Wang, Chung, Chiang, Shang-Yi, Wuu, Shou-Gwo, Yaung, Dun-Nian
• Primary Examiner(s): Wilson; Allan R
• Application Number:
  US12/845,496
• Publication Number:
  US 20100289102A1
• Time in Patent Office: 377 Days
• Field of Search: 257/544, 257/549, 257/E21.544, 257/E25.005, 257/E27.124, 438/558
• US Class Current: 438/558
• CPC Class Codes: H01L 27/14623 Optical shielding
• CPC Class Codes: H01L 27/14627 Microlenses
• CPC Class Codes: H01L 27/14643 Photodiode arrays; MOS imagers
• CPC Class Codes: H01L 27/14685 Process for coatings or optical elements
• CPC Class Codes: H01L 27/148 Charge coupled imagers individual charge coupled devices H01L29/765

Abstract

The present disclosure provides an image sensor semiconductor device. The semiconductor device includes a substrate having a front surface and a back surface; a plurality of sensor elements formed on the front surface of the substrate, each of the plurality of sensor elements configured to receive light directed towards the back surface; and an aluminum doped feature formed in the substrate and disposed horizontally between two adjacent elements of the plurality of sensor elements and vertically between the back surface and the plurality of sensor elements.

Claims

1. A method of fabricating a semiconductor device, comprising:

providing a semiconductor substrate having a front surface and a back surface;

forming a masking layer on the back surface of the semiconductor substrate;

forming an opening in the masking layer, the opening configured to expose the semiconductor substrate within the opening;

forming an aluminum-containing layer on the masking layer and on the semiconductor substrate within the opening; and

driving aluminum from the aluminum-containing layer into the semiconductor substrate through the opening of the masking layer to form a junction of aluminum dopants around a sensor element that extends from the back surface without extending to the front surface.

2. The method of claim 1, further comprising removing the aluminum-containing layer after the driving of aluminum.

3. The method of claim 1, wherein the driving of aluminum comprises an annealing process.

4. The method of claim 3, wherein the driving of aluminum comprises an annealing temperature ranging between about 40°

C. and about 1200°

C.

5. The method of claim 3, wherein the annealing process is selected from the group consisting of a thermal annealing, a flash annealing, a laser annealing, and a combination thereof.

6. The method of claim 1, wherein the forming of the masking layer comprises forming the masking layer using a method selected from the group consisting of thermal oxidation, thermal nitridation, chemical vapor deposition, physical vapor deposition, spin-on coating, and combinations thereof.

7. The method of claim 1, wherein the forming of the aluminum-containing layer comprises utilizing a method selected from the group consisting of chemical vapor deposition, physical vapor deposition, plating, and combinations thereof.

8. The method of claim 1, wherein the forming of the opening comprises utilizing an etching process.

9. A method of fabricating a semiconductor device, comprising:

providing a semiconductor substrate having a front surface and a back surface;

forming a plurality of sensor elements on the front surface of the substrate, each of the plurality of sensor elements configured to receive light directed towards the back surface; and

forming an aluminum doped feature in the substrate extending from the back surface but not extending to the front surface, the aluminum doped feature disposed horizontally between two adjacent elements of the plurality of sensor elements and vertically between the back surface and the plurality of sensor elements.

10. The method of claim 9, wherein forming the aluminum doped feature includes:

forming a masking layer on the back surface of the semiconductor substrate;

forming an opening in the masking layer, the opening configured to expose the semiconductor substrate within the opening; and

forming an aluminum-containing layer on the masking layer and on the semiconductor substrate within the opening.

11. The method of claim 10, wherein forming the aluminum doped features includes annealing the aluminum-containing layer using an annealing process selected from the group consisting of a thermal annealing, a flash annealing, a laser annealing, and a combination thereof.

12. The method of claim 9, wherein forming the aluminum doped feature in the substrate includes forming the aluminum doped feature between the back surface and the plurality of sensor elements on the front surface.

13. The method of claim 10, further comprising removing the aluminum-containing layer and the masking layer after the forming of the aluminum doped feature.

14. A method of fabricating an image sensor semiconductor device, comprising:

providing a semiconductor substrate having a front surface and a back surface;

forming a sensor element in the semiconductor substrate;

forming an inter-level dielectric (ILD) on the front surface of the semiconductor substrate; and

forming a junction of aluminum dopants in the semiconductor substrate and extending from the back surface without extending to the front surface.

15. The method of claim 14, wherein forming the junction of aluminum dopants includes forming the junction of aluminum dopants horizontally around the sensor element in a top view of the semiconductor substrate.

16. The method of claim 14, wherein forming the junction of aluminum dopants includes:

forming a masking layer on the back surface of the semiconductor substrate;

forming an opening in the masking layer, the opening configured to expose the semiconductor substrate within the opening; and

forming an aluminum-containing layer on the masking layer and on the semiconductor substrate within the opening;

17. The method of claim 14, wherein the semiconductor substrate comprises a crystalline silicon configured in one of <

100> and

<

111>

orientation.

18. The method of claim 14, wherein the sensor element is selected from the group consisting of complementary metal-oxide-semiconductor (CMOS) image sensor, charge-coupled device sensor, active pixel sensor, passive pixel sensor, and combinations thereof.

19. The method of claim 14, wherein forming the junction of aluminum dopants includes forming the junction of aluminum dopants extending from the back surface towards the front surface a distance that is greater than one-fourth of a thickness of the semiconductor substrate.

20. The method of claim 19, wherein the distance is greater than about 1 micron.