Light-emitting diode

• US 7,994,518 B2
• Filed: 09/02/2008
• Issued: 08/09/2011
• Est. Priority Date: 12/11/2007
• Status: Expired due to Fees

• Current Assignee: Foxsemicon Integrated Technology Incorporated
• Original Assignee: Foxsemicon Integrated Technology Incorporated
• Inventors: Jiang, Wen-Jang, Hsu, Hung-Kuang, Wang, Chun-Wei
• Primary Examiner(s): Nguyen; Thinh T
• Application Number:
  US12/202,555
• Publication Number:
  US 20090146155A1
• Time in Patent Office: 1,071 Days
• Field of Search: 257/82, 257/98, 257/E33.067, 257/E33.077, 257/99, 257/100
• US Class Current: 257/82
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/1815 Shape
• CPC Class Codes: H01L 31/14 the light source or sources being controlled by the semiconductor device sensitive to radiation, e.g. image converters, image amplifiers or image storage devices
• CPC Class Codes: H01L 33/54 having a particular shape
• CPC Class Codes: H01L 33/60 Reflective elements

Abstract

An LED includes a substrate having a substantially flat substrate surface, a plurality of electrodes extending through the substrate, an LED chip configured for emitting light, a first and a second coplanar reflective layers formed on the surface, and a light pervious encapsulation member mounted on the substrate surface. The light pervious encapsulation member covers the LED chip and the first reflective layer and a portion of the second reflective layer. The LED chip is mounted on the substrate surface and electrically connected with the electrodes. The first reflective layer and the second reflective layer are configured for reflecting the light emitted from the LED chip.

Claims

1. An LED comprising:

a substrate having a substantially flat substrate surface;

a plurality of electrodes extending through the substrate;

an LED chip for emitting light, the LED chip mounted on the substrate surface and electrically connected with the electrodes;

a first and a second coplanar reflective layers formed on the substrate surface and configured for reflecting the light emitted from the LED chip, the first reflective layer being sandwiched between the LED chip and the substrate surface and insulated from the electrodes; and

a light pervious encapsulation member mounted on the substrate surface, and the encapsulation member covering the LED chip and the first reflective layer and a portion of the second reflective layer.

2. The LED of claim 1, further comprising an accommodating recess defined in the substrate surface, and an auxiliary electric component received in the accommodating recess.

3. The LED of claim 2, wherein the auxiliary electric component is an anti-static electric component.

4. The LED of claim 2, wherein the auxiliary electric component is a light intensity sensor.

5. The LED of claim 4, wherein the accommodating recess and the light intensity sensor are covered by the light pervious encapsulation member.

6. The LED of claim 4, wherein the accommodating recess and the light intensity sensor are located outside the light pervious encapsulation member.

7. The LED of claim 3, wherein the anti-static electric component is selected from the group consisting of a zener diode, a Schottky barrier diode, a silicon-based tunneling diode, and an integrated circuit for static electricity protection.

8. The LED of claim 3, wherein the anti-static electric component is electrically connected with the LED chip in parallel.

9. The LED of claim 1, wherein the substrate is comprised of silicon material.

10. The LED of claim 1, wherein the first reflective layer has an opening defined therein, and the LED chip is disposed in the opening and surrounded by the first reflective layer.

11. The LED of claim 1, wherein the first reflective layer or the second reflective layer is comprised of metal.

12. The LED of claim 1, wherein the first reflective layer and the second reflective layer is insulated from the electrodes.

13. The LED of claim 1, wherein the light pervious encapsulation member is hemispherical in shape.

14. The LED of claim 1, wherein the light pervious encapsulation member is a cone-shaped lens having an aspheric surface.

19. The LED of claim 1, wherein the first reflective layer directly and mechanically contacts the substrate surface and the LED chip at opposite surfaces thereof.

20. The LED of claim 1, further comprising two wires, wherein the second reflective layer is located beside and spaced from the first reflective layer, the wires extending through a gap between the first and second reflective layers to connect the LED chip and the electrodes.

15. An LED comprising:

a silicon substrate having a substantially flat substrate surface;

a plurality of electrodes extending through the silicon substrate;

an LED chip electrically connected with the electrodes for emitting light, the LED chip mounted on the substrate surface and located outside of the silicon substrate;

a reflective layer formed on the substrate surface and configured for reflecting the light emitted from the LED chip, the reflective layer directly and mechanically contacting the substrate surface and the LED chip at opposite surfaces thereof and a light pervious encapsulation member formed on the substrate surface, and covering the LED chip, the LED chip enveloped between the reflective layer and encapsulation member.

16. The LED of claim 15, wherein ends of the plurality of electrodes exposed out the substrate surface are located at opposite sides of and spaced from the reflective layer, wires interconnecting the LED chip and the ends of the electrodes.

17. The LED of claim 15, wherein the reflective layer is insulated from the electrodes.

18. The LED of claim 15, further comprising an additional reflective layer located beside and spaced from the reflective layer.