Sensor module and method for manufacturing same
First Claim
Patent Images
1. A sensor module comprising:
- a carrier substrate comprising a bottom side and a top side;
a sensor region arranged on the top side of the carrier substrate and comprising a pressure-sensitive active area;
a signal-processing chip arranged on the top side of the carrier substrate and electrically connected to the sensor region; and
a continuous casting material covering the top side of the carrier substrate and the signal-processing chip and being in mechanical contact to both, the casting material comprising a recess which is arranged such that the casting material does not cover at least a part of the active area of the sensor region,wherein a dam separating the recess region from the casting material and comprising a dam material different from the casting material is arranged between the casting material and the recess region.
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Abstract
A sensor module has a carrier substrate having a bottom side and a top side, a sensor chip arranged on the top side of the carrier substrate and having a pressure-sensitive active area, a signal-processing chip arranged on the top side of the carrier substrate next to the sensor chip and being connected to the sensor chip in an electrically conducting manner, a continuous casting material covering the top side of the carrier substrate and the signal-processing chip and being in mechanical contact with both, the casting material having a recess which is arranged such that the casting material does not cover at least a part of the active area of the sensor chip.
29 Citations
4 Claims
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1. A sensor module comprising:
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a carrier substrate comprising a bottom side and a top side; a sensor region arranged on the top side of the carrier substrate and comprising a pressure-sensitive active area; a signal-processing chip arranged on the top side of the carrier substrate and electrically connected to the sensor region; and a continuous casting material covering the top side of the carrier substrate and the signal-processing chip and being in mechanical contact to both, the casting material comprising a recess which is arranged such that the casting material does not cover at least a part of the active area of the sensor region, wherein a dam separating the recess region from the casting material and comprising a dam material different from the casting material is arranged between the casting material and the recess region.
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2. A sensor module comprising:
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a carrier substrate comprising a bottom side and a top side; a sensor region arranged on the top side of the carrier substrate and comprising a pressure-sensitive active area; a signal-processing chip arranged on the top side of the carrier substrate and electrically connected to the sensor region; and a continuous casting material covering the top side of the carrier substrate and the signal-processing chip and being in mechanical contact to both, the casting material comprising a recess which is arranged such that the casting material does not cover at least a part of the active area of the sensor region, wherein a pipe-shaped body separating the recess region from the casting material and comprising a different material from the casting material is arranged between the casting material and the recess region, the pipe-shaped body being designed to adjust a pressure at the pressure-sensitive active area to the atmospheric pressure.
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3. A sensor module comprising:
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a carrier substrate comprising a bottom side and a top side; a sensor region arranged on the top side of the carrier substrate and comprising a pressure-sensitive active area; a signal-processing chip arranged on the top side of the carrier substrate and electrically connected to the sensor region; and a continuous casting material covering the top side of the carrier substrate and the signal-processing chip and being in mechanical contact to both, the casting material comprising a recess which is arranged such that the casting material does not cover at least a part of the active area of the sensor region, wherein the sensor chip comprises a microphone and the sensor module is implemented as a microphone module, and wherein the microphone module comprises a bandwidth region in which a microphone sensitivity is increased and an upper cut-off frequency value of the bandwidth region is in a range from 25 kHz to 100 kHz. - View Dependent Claims (4)
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Specification