Collision avoidance for communications within a device

• US 7,995,604 B2
• Filed: 12/30/2006
• Issued: 08/09/2011
• Est. Priority Date: 12/30/2006
• Status: Expired due to Fees

• Current Assignee: Avago Technologies International Sales Pte Limited (Broadcom, Inc.)
• Original Assignee: Broadcom Corporation (Broadcom, Inc.)
• Inventors: Rofougaran, Ahmadreza (Reza)
• Primary Examiner(s): Phillips; Hassan
• Assistant Examiner(s): Duong; Duc T
• Application Number:
  US11/648,754
• Publication Number:
  US 20080160925A1
• Time in Patent Office: 1,683 Days
• Field of Search: 370/400, 370/401, 370419-421, 370/445, 370/447, 370/463, 709223-226
• US Class Current: 370/445
• CPC Class Codes: H04L 12/66 Arrangements for connecting between networks having differing types of switching systems, e.g. gateways

Abstract

A radio transceiver device includes circuitry for radiating electromagnetic signals at a very high radio frequency both through space, as well as through wave guides that are formed within a substrate material. In one embodiment, the substrate comprises a dielectric substrate formed within a board, for example, a printed circuit board. In another embodiment of the invention, the wave guide is formed within a die of an integrated circuit radio transceiver. A plurality of transceivers with different functionality is defined. Substrate transceivers are operable to transmit through the wave guides, while local transceivers are operable to produce very short range wireless transmissions through space. A third and final transceiver is a typical wireless transceiver for communication with remote (non-local to the device) transceivers.

Claims

1. An apparatus, comprising:

a first supporting board for supporting circuitry including transceiver circuitry;

first and second radio transceiver integrated circuit die supported by the first supporting board;

at least one intra-device local transceiver formed upon each of the first and second radio transceiver integrated circuit die, the at least one intra-device local transceiver supporting wireless communications with at least one other of the intra-device local transceivers formed upon the first and second radio transceiver integrated circuit die;

wherein the first radio transceiver integrated circuit die includes;

a wave guide formed within a dielectric substrate of the first radio transceiver integrated circuit die operable to guide very high radio frequency signals within the defined volume;

a first substrate local transceiver operable to transmit the very high radio frequency (RF) signals through the wave guide;

a second substrate local transceiver operable to receive the very high radio frequency signals from the wave guide; and

wherein a first intra-device local transceiver is communicatively coupled to the first substrate local transceiver and is operable to wirelessly transmit low power RF signals to a second intra-device transceiver; and

wherein each of the intra-device local transceivers is operable to communicate utilizing a carrier sense multiple access scheme wherein each of the intra-device local transceivers is operable to transmit a request-to-send signal to a receiver to which a communication is to be sent only when the communication exceeds a specified packet size.

2. The apparatus of claim 1 operable to utilize a collision avoidance scheme for communications within the substrate wave guide.

3. A method for wireless transmissions in an integrated circuit, comprising:

in a first local transceiver, transmitting to a second local transceiver a request-to-send signal only when a data packet to be transmitted exceeds a specified size;

in the first local transceiver, receiving a clear-to-send signal generated by the second local transceiver in response to the request-to-send signal;

determining to transmit a data packet to the second local transceiver; and

receiving a clear-to-send signal from a third local transceiver and determining to delay any further transmissions for a specified period;

wherein the second local transceiver is disposed either within the integrated circuit or within a device housing the integrated circuit.

4. A method of communication within a device, comprising:

establishing a first communication link with a remote tester device by way of a remote communication transceiver;

establishing a plurality of second communication links with a plurality of specified circuit blocks by way of respective ones of a pair of intra-device local communication transceivers or a pair of substrate transceivers; and

communicatively coupling the first communication link to each of the second communication links to enable the remote tester device to test the plurality of specified circuit blocks.

5. The method of claim 4 wherein the first communication link is one of a cellular, wireless local area network or personal area network protocol communication link.

6. The method of claim 4 wherein at least one of the second communication links is a very high radio frequency communication link of at least 10 GHz.

7. The method of claim 4 wherein at least one of the specified circuit blocks is one of a memory block, a processor block or a sensor block.

8. The method of claim 4 wherein the step of communicatively coupling the first and second communication links includes translating from a first to a second communication protocol.

9. The method of claim 4 wherein the step of communicatively coupling the first and second communication links includes translating from a first to a second frequency.