Method for electrochemical fabrication

• US 7,998,331 B2
• Filed: 02/01/2010
• Issued: 08/16/2011
• Est. Priority Date: 04/04/1997
• Status: Expired due to Fees

• Current Assignee: University of Southern California
• Original Assignee: University of Southern California
• Inventors: Cohen, Adam L.
• Primary Examiner(s): VAN, LUAN V
• Application Number:
  US12/698,026
• Publication Number:
  US 20100193366A1
• Time in Patent Office: 561 Days
• Field of Search: 205/118, 205/170, 205/223
• US Class Current: 205/118
• CPC Class Codes: B33Y 10/00 Processes of additive manufacturing
• CPC Class Codes: B81C 1/00126 Static structures not provided for in groups B81C1/00031 - B81C1/00119
• CPC Class Codes: B81C 2201/0181 Physical Vapour Deposition [PVD], i.e. evaporation, sputtering, ion plating or plasma assisted deposition, ion cluster beam technology
• CPC Class Codes: B81C 2201/0197 Processes for making multi-layered devices not provided for in groups B81C2201/0176 - B81C2201/0192
• CPC Class Codes: B81C 2201/032 LIGA process
• CPC Class Codes: C25D 1/00 Electroforming
• CPC Class Codes: C25D 1/003 3D structures, e.g. superposed patterned layers
• CPC Class Codes: C25D 17/06 Suspending or supporting devices for articles to be coated
• CPC Class Codes: C25D 5/022 using masking means
• CPC Class Codes: C25D 5/10 Electroplating with more than one layer of the same or of different metals for bearings C25D7/10
• CPC Class Codes: C25D 5/12 at least one layer being of nickel or chromium
• CPC Class Codes: C25D 5/22 Electroplating combined with mechanical treatment during the deposition
• CPC Class Codes: C25D 5/611 Smooth layers
• CPC Class Codes: H01L 21/2885 using an external electrical current, i.e. electro-deposition
• CPC Class Codes: H05K 3/241 characterised by the electroplating method; means therefor, e.g. baths or apparatus
• CPC Class Codes: Y10T 428/12486 Laterally noncoextensive components [e.g., embedded, etc.]
• CPC Class Codes: Y10T 428/239 Complete cover or casing

Abstract

An electroplating method that includes: a) contacting a first substrate with a first article, which includes a substrate and a conformable mask disposed in a pattern on the substrate; b) electroplating a first metal from a source of metal ions onto the first substrate in a first pattern, the first pattern corresponding to the complement of the conformable mask pattern; and c) removing the first article from the first substrate, is disclosed. Electroplating articles and electroplating apparatus are also disclosed.

Claims

1. A method for fabricating a multi-layer three-dimensional structure, comprising:

I. forming a first layer on a substrate comprising deposition of at least one sacrificial material and deposition of at least one structural material wherein the deposited sacrificial material and the deposited structural material are planarized to have a common height to set a boundary level for the first layer, and wherein the sacrificial material is etchable with a selected etchant and the structural material is not substantially etchable with the selected etchant;

II. forming additional layers adjacent to and adhered to previously formed layers, wherein the formation of each additional layer comprises deposition of at least one additional sacrificial material and deposition of at least one additional structural material and wherein the additional sacrificial material and the additional structural material for each additional layer are planarized to have a common height to set a boundary level for each additional layer; and

III. after formation of the additional layers, exposing the combination of the at least one structural material and the at least one sacrificial material to the selected etchant to cause etching of the at least one sacrificial material from a plurality of layers to reveal the components of the three-dimensional structure, wherein exposed portions of the at least one sacrificial material are removed subject to removal by the selected etchant while the exposed portions of the at least one structural material are not removed by the selected etchant,

wherein during formation of the plurality of layers, a portion of the at least one sacrificial material becomes encapsulated within a shell of the at least one structural material and becomes a permanent part of the structure, and

wherein the deposition of the sacrificial material and the structural material comprises electrodeposition.

2. The method of claim 1 wherein the deposition of the additional sacrificial material for at least a portion of the additional layers occurs selectively via a mask placed in contact with a previously formed additional layer.

3. The method of claim 2 wherein the deposition of the additional structural material for at least a portion of the additional layers occurs via a blanket deposition.